PT2151010T - Processo de realização de um dispositivo compreendendo uma antena de transpondedor ligada a almofadas de contacto e dispositivo obtido - Google Patents

Processo de realização de um dispositivo compreendendo uma antena de transpondedor ligada a almofadas de contacto e dispositivo obtido

Info

Publication number
PT2151010T
PT2151010T PT87595575T PT08759557T PT2151010T PT 2151010 T PT2151010 T PT 2151010T PT 87595575 T PT87595575 T PT 87595575T PT 08759557 T PT08759557 T PT 08759557T PT 2151010 T PT2151010 T PT 2151010T
Authority
PT
Portugal
Prior art keywords
manufacturing
antenna connected
connecting pads
transponder antenna
device obtained
Prior art date
Application number
PT87595575T
Other languages
English (en)
Inventor
François Martinent Jean
Robles Laurence
Roussel François
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38613979&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT2151010(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of PT2151010T publication Critical patent/PT2151010T/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/038Textiles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/029Woven fibrous reinforcement or textile
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10628Leaded surface mounted device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • Y10T29/49018Antenna or wave energy "plumbing" making with other electrical component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
PT87595575T 2007-05-21 2008-05-13 Processo de realização de um dispositivo compreendendo uma antena de transpondedor ligada a almofadas de contacto e dispositivo obtido PT2151010T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07301057A EP2001077A1 (fr) 2007-05-21 2007-05-21 Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu

Publications (1)

Publication Number Publication Date
PT2151010T true PT2151010T (pt) 2018-01-25

Family

ID=38613979

Family Applications (1)

Application Number Title Priority Date Filing Date
PT87595575T PT2151010T (pt) 2007-05-21 2008-05-13 Processo de realização de um dispositivo compreendendo uma antena de transpondedor ligada a almofadas de contacto e dispositivo obtido

Country Status (15)

Country Link
US (1) US8359729B2 (pt)
EP (2) EP2001077A1 (pt)
JP (2) JP5270667B2 (pt)
KR (1) KR101066697B1 (pt)
CN (1) CN101836325B (pt)
AU (1) AU2008253033B2 (pt)
BR (1) BRPI0811143B1 (pt)
CA (1) CA2687401C (pt)
IL (1) IL202008A (pt)
MX (1) MX2009012573A (pt)
PL (1) PL2151010T3 (pt)
PT (1) PT2151010T (pt)
SG (1) SG10201504255XA (pt)
WO (1) WO2008141982A1 (pt)
ZA (1) ZA200908141B (pt)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
EP2390825A1 (fr) 2010-05-31 2011-11-30 Gemalto SA Procédé de réalisation d'un dispositif comportant une antenne de transpondeur sur une âme fine et dispositif obtenu
DE102010024523B4 (de) * 2010-06-21 2017-03-23 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiges Folienelement
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
US20130075476A1 (en) * 2011-09-23 2013-03-28 Hid Global Ireland Teoranta Secure rfid device and method of production
US9178265B2 (en) 2012-02-09 2015-11-03 Hid Global Gmbh Anti-crack means for wire antenna in transponder
WO2014008937A1 (en) 2012-07-12 2014-01-16 Assa Abloy Ab Method of manufacturing a functional inlay
KR20140055147A (ko) * 2012-10-30 2014-05-09 삼성전자주식회사 신축성 안테나 및 그 제조 방법
EP2779029B1 (de) * 2013-03-13 2017-07-26 SES RFID Solutions GmbH Chipkarteninlay für kontaktbehaftet und kontaktlos ansprechende Chipkarten
FR3026529B1 (fr) * 2014-09-30 2017-12-29 Linxens Holding Procede de fabrication de carte a puce et carte a puce obtenue par ce procede.
CN104485294A (zh) * 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 一种晶圆临时键合及分离方法
WO2016097817A1 (en) 2014-12-15 2016-06-23 Assa Abloy Ab Method of producing a functional inlay and inlay produced by the method
CN107567633A (zh) * 2015-02-20 2018-01-09 恩爱的有限公司 用于制造包括与基底或天线相关联的至少一个电子元件的装置的方法
FR3040516B1 (fr) * 2015-08-27 2017-09-15 Linxens Holding Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique
US10121100B2 (en) 2016-12-20 2018-11-06 Capital One Services, Llc Two piece transaction card having fabric inlay
SE541653C2 (en) * 2017-11-03 2019-11-19 Stora Enso Oyj Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
CN112020405A (zh) * 2018-02-26 2020-12-01 艾利丹尼森零售信息服务公司 将rfid芯片直接附接到金属结构作为织物标签的一部分
DE102018117364A1 (de) * 2018-07-18 2020-01-23 Infineon Technologies Ag Verfahren und Vorrichtung zum Trimmen einer auf einem Träger aufgebrachten Antenne, Verfahren zum Herstellen einer Trägerstruktur, Trägerstruktur und Chipkarte
TW202145640A (zh) * 2020-05-28 2021-12-01 韋僑科技股份有限公司 射頻通訊天線模組及其製造方法
JP2023040461A (ja) * 2021-09-10 2023-03-23 日本航空電子工業株式会社 アンテナ組立体

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
WO1997030418A2 (de) 1996-02-12 1997-08-21 David Finn Verfahren und vorrichtung zur kontaktierung eines drahtleiters
DE19651566B4 (de) * 1996-12-11 2006-09-07 Assa Abloy Identification Technology Group Ab Chip-Modul sowie Verfahren zu dessen Herstellung und eine Chip-Karte
WO1998052772A1 (fr) * 1997-05-19 1998-11-26 Hitachi Maxell, Ltd. Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
WO2000030210A1 (en) * 1998-11-12 2000-05-25 Motorola Inc. Smartcard module and method of attaching antenna wires thereto
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
DE10047972A1 (de) 2000-09-27 2002-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung einer Transponderspule
JP4053231B2 (ja) * 2000-11-09 2008-02-27 株式会社日立製作所 無線通信装置
JP2002298110A (ja) * 2001-03-30 2002-10-11 Oji Paper Co Ltd アンテナ基材、共振ラベル、ic実装体およびその製造方法
JP2004062634A (ja) * 2002-07-30 2004-02-26 Nec Tokin Corp 非接触通信媒体の接合方法および非接触通信媒体
US6978668B2 (en) * 2003-12-22 2005-12-27 The Goodyear Tire & Rubber Company Flexible tinsel ribbon antenna and assembly method for a tire
JP2005303049A (ja) * 2004-04-13 2005-10-27 Sumitomo Wiring Syst Ltd 太陽電池モジュール用端子ボックス
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu

Also Published As

Publication number Publication date
EP2151010B1 (fr) 2017-11-01
KR101066697B1 (ko) 2011-09-21
BRPI0811143B1 (pt) 2020-10-20
IL202008A0 (en) 2010-06-16
IL202008A (en) 2015-02-26
BRPI0811143A2 (pt) 2017-08-01
US8359729B2 (en) 2013-01-29
JP5868882B2 (ja) 2016-02-24
JP5270667B2 (ja) 2013-08-21
AU2008253033B2 (en) 2012-01-19
WO2008141982A1 (fr) 2008-11-27
KR20100009641A (ko) 2010-01-28
ZA200908141B (en) 2010-07-28
CN101836325A (zh) 2010-09-15
PL2151010T3 (pl) 2018-07-31
JP2013122786A (ja) 2013-06-20
MX2009012573A (es) 2009-12-09
SG10201504255XA (en) 2015-09-29
CN101836325B (zh) 2014-08-27
JP2010528357A (ja) 2010-08-19
CA2687401A1 (fr) 2008-11-27
EP2151010A1 (fr) 2010-02-10
EP2001077A1 (fr) 2008-12-10
US20100147958A1 (en) 2010-06-17
CA2687401C (fr) 2014-10-14
AU2008253033A1 (en) 2008-11-27

Similar Documents

Publication Publication Date Title
PT2151010T (pt) Processo de realização de um dispositivo compreendendo uma antena de transpondedor ligada a almofadas de contacto e dispositivo obtido
GB2488688B (en) Recessed and embedded die coreless package
EP2414994A4 (en) SYSTEM AND METHOD FOR IMPLEMENTING TRANSACTIONS USING A WIRELESS DEVICE
GB2474923B (en) A phased array antenna and a method of operating a phased array antenna
PL2262722T3 (pl) Zintegrowany układ mikroigłowy i sposób jego wytwarzania
EP2515988A4 (en) MOISTURIZER / HYDROGEL SLEEVE CATHETER PACKAGE / PACKAGE, METHOD FOR MANUFACTURING AND USING SAME
EP2469626A4 (en) POWER SUPPLY DEVICE AND BATTERY CONNECTOR
HK1174138A1 (en) Bonding device and method for manufacturing tabular bonded body
HK1178506A1 (zh) 包括帶與連接裝置的組件及將連接裝置安裝到帶上的方法
EP2169767A4 (en) WIRELESS MARKER AND METHOD FOR MANUFACTURING THE WIRELESS MARKER
EP2401708A4 (en) CONTACTLESS DEVICE WITH MINIATURIZED ANTENNA
HK1158846A1 (en) Ic tag for wireless communication and method of manufacturing the same ic ic
EP2628370A4 (en) Method and arrangement for attaching a chip to a printed conductive surface
EP2465713A4 (en) BALL JOINT CONSTRUCTION AND METHOD FOR THE PRODUCTION THEREOF
IL217986A0 (en) Apparatus comprising a fitting connected to a body and a method of manufacture thereof
GB2462723B (en) An antenna and a method of manufacturing an antenna
ZA201206797B (en) Laminate structure for a chip card and method for the production thereof
HK1159861A1 (en) Three-dimensional antenna array and structure
HK1136064A1 (en) Wireless ic tag and method for manufacturing wireless ic tag
GB0805161D0 (en) A method of reducing mutual coupling between antennas
ZA201200917B (en) Flexible sachet and manufacturing method
EP2490967A4 (en) TIPS FOR LAYING UP OBJECTS ON A SURFACE, METHOD FOR USE OF THE TIP, METHOD FOR PRODUCING THE TIP AND DEVICE FOR PRODUCING THE TISSUE TREATMENT
EP2452025A4 (en) CONNECTOR FOR PREFABRICATED ELEMENTS AND CONNECTION METHOD
HK1128991A1 (en) Flip chip structure and method of manufacture
ZA201305279B (en) Identification device and method of manufacturing a continuous structure