SG10201504255XA - Method for producing a device comprising a transponder antenna connected to contact pins and device obtained - Google Patents

Method for producing a device comprising a transponder antenna connected to contact pins and device obtained

Info

Publication number
SG10201504255XA
SG10201504255XA SG10201504255XA SG10201504255XA SG10201504255XA SG 10201504255X A SG10201504255X A SG 10201504255XA SG 10201504255X A SG10201504255X A SG 10201504255XA SG 10201504255X A SG10201504255X A SG 10201504255XA SG 10201504255X A SG10201504255X A SG 10201504255XA
Authority
SG
Singapore
Prior art keywords
producing
contact pins
antenna connected
transponder antenna
device obtained
Prior art date
Application number
SG10201504255XA
Inventor
Jean-François Martinent
Laurence Robles
François Roussel
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38613979&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG10201504255X(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of SG10201504255XA publication Critical patent/SG10201504255XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Support Of Aerials (AREA)
SG10201504255XA 2007-05-21 2008-05-13 Method for producing a device comprising a transponder antenna connected to contact pins and device obtained SG10201504255XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07301057A EP2001077A1 (en) 2007-05-21 2007-05-21 Method of manufacturing a device comprising a transponder antenna connected to connecting pads and device obtained

Publications (1)

Publication Number Publication Date
SG10201504255XA true SG10201504255XA (en) 2015-09-29

Family

ID=38613979

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201504255XA SG10201504255XA (en) 2007-05-21 2008-05-13 Method for producing a device comprising a transponder antenna connected to contact pins and device obtained

Country Status (15)

Country Link
US (1) US8359729B2 (en)
EP (2) EP2001077A1 (en)
JP (2) JP5270667B2 (en)
KR (1) KR101066697B1 (en)
CN (1) CN101836325B (en)
AU (1) AU2008253033B2 (en)
BR (1) BRPI0811143B1 (en)
CA (1) CA2687401C (en)
IL (1) IL202008A (en)
MX (1) MX2009012573A (en)
PL (1) PL2151010T3 (en)
PT (1) PT2151010T (en)
SG (1) SG10201504255XA (en)
WO (1) WO2008141982A1 (en)
ZA (1) ZA200908141B (en)

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* Cited by examiner, † Cited by third party
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HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
EP2001077A1 (en) * 2007-05-21 2008-12-10 Gemplus Method of manufacturing a device comprising a transponder antenna connected to connecting pads and device obtained
EP2390825A1 (en) 2010-05-31 2011-11-30 Gemalto SA Method for manufacturing a device comprising a transponder antenna on a thin core and device obtained
DE102010024523B4 (en) * 2010-06-21 2017-03-23 Leonhard Kurz Stiftung & Co. Kg Multilayer film element
EP2463809A1 (en) * 2010-12-07 2012-06-13 NagraID S.A. Electronic card with electric contact including an electronic unit and/or an antenna
US20130075476A1 (en) * 2011-09-23 2013-03-28 Hid Global Ireland Teoranta Secure rfid device and method of production
US9178265B2 (en) 2012-02-09 2015-11-03 Hid Global Gmbh Anti-crack means for wire antenna in transponder
EP2873031B1 (en) 2012-07-12 2018-08-22 Assa Abloy Ab Method of manufacturing a functional inlay
KR20140055147A (en) * 2012-10-30 2014-05-09 삼성전자주식회사 Stretchable antenna and manufacturing method of the same
EP2779029B1 (en) * 2013-03-13 2017-07-26 SES RFID Solutions GmbH Chip card inlay for contact and non-contact responsive smart cards
FR3026529B1 (en) * 2014-09-30 2017-12-29 Linxens Holding METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY
CN104485294A (en) * 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 Temporary bonding and separation method for wafers
WO2016097817A1 (en) 2014-12-15 2016-06-23 Assa Abloy Ab Method of producing a functional inlay and inlay produced by the method
RU2685973C2 (en) * 2015-02-20 2019-04-23 Нид Са Method of making device containing at least one electronic element associated with substrate and antenna
FR3040516B1 (en) * 2015-08-27 2017-09-15 Linxens Holding METHOD FOR MANUFACTURING AN ELECTRIC CIRCUIT, ELECTRIC CIRCUIT OBTAINED BY THIS METHOD AND CHIP CARD COMPRISING SUCH AN ELECTRICAL CIRCUIT
US10121100B2 (en) 2016-12-20 2018-11-06 Capital One Services, Llc Two piece transaction card having fabric inlay
SE541653C2 (en) * 2017-11-03 2019-11-19 Stora Enso Oyj Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
CN112020405A (en) * 2018-02-26 2020-12-01 艾利丹尼森零售信息服务公司 Attaching an RFID chip directly to a metal structure as part of a fabric label
DE102018117364A1 (en) * 2018-07-18 2020-01-23 Infineon Technologies Ag Method and device for trimming an antenna mounted on a carrier, method for producing a carrier structure, carrier structure and chip card
TW202145640A (en) * 2020-05-28 2021-12-01 韋僑科技股份有限公司 Radio frequency antenna module and method for making the same
JP2023040461A (en) * 2021-09-10 2023-03-23 日本航空電子工業株式会社 antenna assembly

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DE4410732C2 (en) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Method for arranging a transponder unit having at least one chip and a wire coil on a substrate, as well as chip card with a correspondingly arranged transponder unit
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FR2769390B1 (en) * 1997-10-08 2003-02-14 Gemplus Card Int METHOD FOR MANUFACTURING CHIP CARDS SUITABLE FOR PROVIDING CONTACT AND NON-CONTACT OPERATION, AND CONTACTLESS CHIP CARDS
FR2775810B1 (en) * 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
FR2782821B1 (en) * 1998-08-27 2001-10-12 Gemplus Card Int NON-CONTACT CHIP CARD MANUFACTURING PROCESS
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EP2001077A1 (en) * 2007-05-21 2008-12-10 Gemplus Method of manufacturing a device comprising a transponder antenna connected to connecting pads and device obtained

Also Published As

Publication number Publication date
IL202008A (en) 2015-02-26
ZA200908141B (en) 2010-07-28
EP2151010A1 (en) 2010-02-10
EP2151010B1 (en) 2017-11-01
CA2687401C (en) 2014-10-14
JP5868882B2 (en) 2016-02-24
WO2008141982A1 (en) 2008-11-27
CA2687401A1 (en) 2008-11-27
US20100147958A1 (en) 2010-06-17
AU2008253033B2 (en) 2012-01-19
AU2008253033A1 (en) 2008-11-27
BRPI0811143A2 (en) 2017-08-01
KR101066697B1 (en) 2011-09-21
EP2001077A1 (en) 2008-12-10
CN101836325B (en) 2014-08-27
PL2151010T3 (en) 2018-07-31
MX2009012573A (en) 2009-12-09
JP2010528357A (en) 2010-08-19
PT2151010T (en) 2018-01-25
BRPI0811143B1 (en) 2020-10-20
JP5270667B2 (en) 2013-08-21
IL202008A0 (en) 2010-06-16
US8359729B2 (en) 2013-01-29
JP2013122786A (en) 2013-06-20
CN101836325A (en) 2010-09-15
KR20100009641A (en) 2010-01-28

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