PL77829B1 - - Google Patents
Download PDFInfo
- Publication number
- PL77829B1 PL77829B1 PL15024671D PL15024671D PL77829B1 PL 77829 B1 PL77829 B1 PL 77829B1 PL 15024671 D PL15024671 D PL 15024671D PL 15024671 D PL15024671 D PL 15024671D PL 77829 B1 PL77829 B1 PL 77829B1
- Authority
- PL
- Poland
- Prior art keywords
- bath
- plate
- solder
- layer
- channel
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 description 7
- 241000233866 Fungi Species 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000763 evoking effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HUTE000593 | 1970-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL77829B1 true PL77829B1 (enExample) | 1975-04-30 |
Family
ID=11001979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL15024671D PL77829B1 (enExample) | 1970-09-01 | 1971-08-28 |
Country Status (3)
| Country | Link |
|---|---|
| BG (1) | BG22849A3 (enExample) |
| CS (1) | CS163381B1 (enExample) |
| PL (1) | PL77829B1 (enExample) |
-
1971
- 1971-08-28 PL PL15024671D patent/PL77829B1/pl unknown
- 1971-08-28 BG BG018450A patent/BG22849A3/xx unknown
- 1971-08-31 CS CS621771A patent/CS163381B1/cs unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CS163381B1 (enExample) | 1975-09-15 |
| BG22849A3 (bg) | 1977-04-20 |
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