JPS5658999A - Automatic plating apparatus - Google Patents
Automatic plating apparatusInfo
- Publication number
- JPS5658999A JPS5658999A JP13439279A JP13439279A JPS5658999A JP S5658999 A JPS5658999 A JP S5658999A JP 13439279 A JP13439279 A JP 13439279A JP 13439279 A JP13439279 A JP 13439279A JP S5658999 A JPS5658999 A JP S5658999A
- Authority
- JP
- Japan
- Prior art keywords
- water
- washing
- tank
- substrate
- conveying carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
PURPOSE: To reduce installation area so as to improve operation efficiency, by fixing a simplified water-washing tank to the bottom of a conveying carrier, and by washing the material to be plated with water during conveyance as well.
CONSTITUTION: A conveying carrier 4 equipped with a simplified water-washing tank 13 at the bottom is conveyed above a degreasing tank 11, where a substrate 3 held by a chuck 6 is lowered by a winding roller 7 operated by revolving a reversible motor 12. A driving shaft 18, which rotates in response to the motor 12, opens a cover 17 and immerses the substrate 3 into a degreasing tank 11, through a passage hole 15. After degreased, the substrate 3 is pulled up into the simplified water-washing tank 13 by revolving the motor 12 reversely, simultaneously, the cover 17 moves horizontally by the reverse rotation of the driving shaft 18 and closes the passage hole 15. The conveying carrier 4 is transferred to the following electroless plating tank 12 while washing water being sprayed through spray nozzles 19 attached to the body of the simplified water-washing tank 13. The washing water is discharged by means of a drain pit etc., then plating is performed in the same way as described above.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13439279A JPS5658999A (en) | 1979-10-18 | 1979-10-18 | Automatic plating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13439279A JPS5658999A (en) | 1979-10-18 | 1979-10-18 | Automatic plating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5658999A true JPS5658999A (en) | 1981-05-22 |
JPS5727196B2 JPS5727196B2 (en) | 1982-06-09 |
Family
ID=15127320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13439279A Granted JPS5658999A (en) | 1979-10-18 | 1979-10-18 | Automatic plating apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5658999A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57143498A (en) * | 1981-02-27 | 1982-09-04 | C Uyemura & Co Ltd | Washing mechanism in surface treatment device |
US6941957B2 (en) * | 2002-01-12 | 2005-09-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for pretreating a substrate prior to electroplating |
US7252100B1 (en) * | 2003-03-28 | 2007-08-07 | Emc Corporation | Systems and methods for processing a set of circuit boards |
JP2008024982A (en) * | 2006-07-20 | 2008-02-07 | Sanshin Seisakusho:Kk | Plating apparatus |
CN104213181A (en) * | 2014-09-18 | 2014-12-17 | 丹阳市新光电子有限公司 | Electric-shock-prevention lifting electroplating device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6136499U (en) * | 1984-08-08 | 1986-03-06 | 三菱重工業株式会社 | Ship turning motion control device |
CN102912408A (en) * | 2012-11-12 | 2013-02-06 | 江苏矽研半导体科技有限公司 | Washing unit for plating equipment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS523366U (en) * | 1975-06-24 | 1977-01-11 |
-
1979
- 1979-10-18 JP JP13439279A patent/JPS5658999A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS523366U (en) * | 1975-06-24 | 1977-01-11 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57143498A (en) * | 1981-02-27 | 1982-09-04 | C Uyemura & Co Ltd | Washing mechanism in surface treatment device |
JPH0242918B2 (en) * | 1981-02-27 | 1990-09-26 | ||
US6941957B2 (en) * | 2002-01-12 | 2005-09-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for pretreating a substrate prior to electroplating |
US7252100B1 (en) * | 2003-03-28 | 2007-08-07 | Emc Corporation | Systems and methods for processing a set of circuit boards |
JP2008024982A (en) * | 2006-07-20 | 2008-02-07 | Sanshin Seisakusho:Kk | Plating apparatus |
CN104213181A (en) * | 2014-09-18 | 2014-12-17 | 丹阳市新光电子有限公司 | Electric-shock-prevention lifting electroplating device |
CN104213181B (en) * | 2014-09-18 | 2016-05-18 | 丹阳市新光电子有限公司 | A kind of lifting electroplanting device of protection against electric shock |
Also Published As
Publication number | Publication date |
---|---|
JPS5727196B2 (en) | 1982-06-09 |
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