JPS5658999A - Automatic plating apparatus - Google Patents

Automatic plating apparatus

Info

Publication number
JPS5658999A
JPS5658999A JP13439279A JP13439279A JPS5658999A JP S5658999 A JPS5658999 A JP S5658999A JP 13439279 A JP13439279 A JP 13439279A JP 13439279 A JP13439279 A JP 13439279A JP S5658999 A JPS5658999 A JP S5658999A
Authority
JP
Japan
Prior art keywords
water
washing
tank
substrate
conveying carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13439279A
Other languages
Japanese (ja)
Other versions
JPS5727196B2 (en
Inventor
Narimitsu Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13439279A priority Critical patent/JPS5658999A/en
Publication of JPS5658999A publication Critical patent/JPS5658999A/en
Publication of JPS5727196B2 publication Critical patent/JPS5727196B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

PURPOSE: To reduce installation area so as to improve operation efficiency, by fixing a simplified water-washing tank to the bottom of a conveying carrier, and by washing the material to be plated with water during conveyance as well.
CONSTITUTION: A conveying carrier 4 equipped with a simplified water-washing tank 13 at the bottom is conveyed above a degreasing tank 11, where a substrate 3 held by a chuck 6 is lowered by a winding roller 7 operated by revolving a reversible motor 12. A driving shaft 18, which rotates in response to the motor 12, opens a cover 17 and immerses the substrate 3 into a degreasing tank 11, through a passage hole 15. After degreased, the substrate 3 is pulled up into the simplified water-washing tank 13 by revolving the motor 12 reversely, simultaneously, the cover 17 moves horizontally by the reverse rotation of the driving shaft 18 and closes the passage hole 15. The conveying carrier 4 is transferred to the following electroless plating tank 12 while washing water being sprayed through spray nozzles 19 attached to the body of the simplified water-washing tank 13. The washing water is discharged by means of a drain pit etc., then plating is performed in the same way as described above.
COPYRIGHT: (C)1981,JPO&Japio
JP13439279A 1979-10-18 1979-10-18 Automatic plating apparatus Granted JPS5658999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13439279A JPS5658999A (en) 1979-10-18 1979-10-18 Automatic plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13439279A JPS5658999A (en) 1979-10-18 1979-10-18 Automatic plating apparatus

Publications (2)

Publication Number Publication Date
JPS5658999A true JPS5658999A (en) 1981-05-22
JPS5727196B2 JPS5727196B2 (en) 1982-06-09

Family

ID=15127320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13439279A Granted JPS5658999A (en) 1979-10-18 1979-10-18 Automatic plating apparatus

Country Status (1)

Country Link
JP (1) JPS5658999A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143498A (en) * 1981-02-27 1982-09-04 C Uyemura & Co Ltd Washing mechanism in surface treatment device
US6941957B2 (en) * 2002-01-12 2005-09-13 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for pretreating a substrate prior to electroplating
US7252100B1 (en) * 2003-03-28 2007-08-07 Emc Corporation Systems and methods for processing a set of circuit boards
JP2008024982A (en) * 2006-07-20 2008-02-07 Sanshin Seisakusho:Kk Plating apparatus
CN104213181A (en) * 2014-09-18 2014-12-17 丹阳市新光电子有限公司 Electric-shock-prevention lifting electroplating device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136499U (en) * 1984-08-08 1986-03-06 三菱重工業株式会社 Ship turning motion control device
CN102912408A (en) * 2012-11-12 2013-02-06 江苏矽研半导体科技有限公司 Washing unit for plating equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523366U (en) * 1975-06-24 1977-01-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523366U (en) * 1975-06-24 1977-01-11

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143498A (en) * 1981-02-27 1982-09-04 C Uyemura & Co Ltd Washing mechanism in surface treatment device
JPH0242918B2 (en) * 1981-02-27 1990-09-26
US6941957B2 (en) * 2002-01-12 2005-09-13 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for pretreating a substrate prior to electroplating
US7252100B1 (en) * 2003-03-28 2007-08-07 Emc Corporation Systems and methods for processing a set of circuit boards
JP2008024982A (en) * 2006-07-20 2008-02-07 Sanshin Seisakusho:Kk Plating apparatus
CN104213181A (en) * 2014-09-18 2014-12-17 丹阳市新光电子有限公司 Electric-shock-prevention lifting electroplating device
CN104213181B (en) * 2014-09-18 2016-05-18 丹阳市新光电子有限公司 A kind of lifting electroplanting device of protection against electric shock

Also Published As

Publication number Publication date
JPS5727196B2 (en) 1982-06-09

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