CN104213181A - Electric-shock-prevention lifting electroplating device - Google Patents
Electric-shock-prevention lifting electroplating device Download PDFInfo
- Publication number
- CN104213181A CN104213181A CN201410475994.2A CN201410475994A CN104213181A CN 104213181 A CN104213181 A CN 104213181A CN 201410475994 A CN201410475994 A CN 201410475994A CN 104213181 A CN104213181 A CN 104213181A
- Authority
- CN
- China
- Prior art keywords
- clamping plate
- electroplating
- slide lid
- fixed
- lifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title abstract description 20
- 206010014357 Electric shock Diseases 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims description 21
- 210000000515 tooth Anatomy 0.000 claims description 13
- 229910052753 mercury Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract 2
- 230000001360 synchronised effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410475994.2A CN104213181B (en) | 2014-09-18 | 2014-09-18 | A kind of lifting electroplanting device of protection against electric shock |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410475994.2A CN104213181B (en) | 2014-09-18 | 2014-09-18 | A kind of lifting electroplanting device of protection against electric shock |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104213181A true CN104213181A (en) | 2014-12-17 |
CN104213181B CN104213181B (en) | 2016-05-18 |
Family
ID=52095074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410475994.2A Active CN104213181B (en) | 2014-09-18 | 2014-09-18 | A kind of lifting electroplanting device of protection against electric shock |
Country Status (1)
Country | Link |
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CN (1) | CN104213181B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106048695A (en) * | 2016-06-26 | 2016-10-26 | 温州正达环保设备有限公司 | Environmental-friendly screw thread turret head |
CN107913115A (en) * | 2017-12-02 | 2018-04-17 | 大连煜美医疗科技有限公司 | Artificial tooth electroplating meter |
CN114934279A (en) * | 2022-05-31 | 2022-08-23 | 东华工程科技股份有限公司 | Electrolytic tank for hydrogen production by water electrolysis |
Citations (20)
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JPS5629696A (en) * | 1979-08-17 | 1981-03-25 | Kosaku:Kk | Surface treating apparatus |
JPS5658999A (en) * | 1979-10-18 | 1981-05-22 | Toshiba Corp | Automatic plating apparatus |
CN1177654A (en) * | 1996-09-20 | 1998-04-01 | 德阳市孟家自动电镀厂 | Ring divided electroplating bath with automatic lifting guide |
DE29809964U1 (en) * | 1998-06-04 | 1998-09-24 | NUTROCK Apparatebau GmbH, 42655 Solingen | Sliding lid for a container |
JP3784824B1 (en) * | 2005-07-19 | 2006-06-14 | 株式会社アイプラント | Electroplating treatment system |
CN101061259A (en) * | 2004-07-01 | 2007-10-24 | 埃托特克德国有限公司 | Device and method for electrolytically treating work pieces |
CN101319344A (en) * | 2008-06-26 | 2008-12-10 | 匡优新 | Automatic transport cart for galvanization manufacture |
CN201195761Y (en) * | 2008-04-28 | 2009-02-18 | 广州市百达信工贸有限公司 | Cathode rotary rack plating apparatus with center anode |
CN101709498A (en) * | 2009-12-14 | 2010-05-19 | 华中科技大学 | Electrophoresis equipment for thin film deposition |
CN101730761A (en) * | 2007-06-06 | 2010-06-09 | 埃托特克德国有限公司 | Vertical system for the plating treatment of a work piece and method for conveying the work piece |
CN101922038A (en) * | 2010-09-01 | 2010-12-22 | 深南电路有限公司 | Upright plating line plating equipment and clamp thereof |
CN102080250A (en) * | 2009-11-27 | 2011-06-01 | 北京中科三环高技术股份有限公司 | Automatic lifting structure of plating/phosphating line |
CN202595307U (en) * | 2012-03-16 | 2012-12-12 | 四会市研创电器有限公司 | Clamp for surface treatment of metal |
CN202849579U (en) * | 2012-09-26 | 2013-04-03 | 苏州市胜能弹簧五金制品有限公司 | Double-torsion spring arranged on electroplating hanging tool |
KR20130131914A (en) * | 2012-05-25 | 2013-12-04 | 대진대학교 산학협력단 | Vertical drum rotation electroforming device |
CN103526272A (en) * | 2013-09-17 | 2014-01-22 | 兰继红 | Firm electroplating suspension rod capable of automatic elevation |
CN203683711U (en) * | 2013-12-26 | 2014-07-02 | 深圳市华大电路科技有限公司 | Copper plating rectifying device |
CN203820913U (en) * | 2014-05-13 | 2014-09-10 | 遂宁市维海电子科技有限公司 | Circuit board electroplating clamp |
CN203846127U (en) * | 2014-05-28 | 2014-09-24 | 晋西工业集团有限责任公司 | Integral electroplating device for tube workpiece |
CN204198885U (en) * | 2014-09-18 | 2015-03-11 | 丹阳市新光电子有限公司 | A kind of lifting electroplanting device of protection against electric shock |
-
2014
- 2014-09-18 CN CN201410475994.2A patent/CN104213181B/en active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5629696A (en) * | 1979-08-17 | 1981-03-25 | Kosaku:Kk | Surface treating apparatus |
JPS5658999A (en) * | 1979-10-18 | 1981-05-22 | Toshiba Corp | Automatic plating apparatus |
CN1177654A (en) * | 1996-09-20 | 1998-04-01 | 德阳市孟家自动电镀厂 | Ring divided electroplating bath with automatic lifting guide |
DE29809964U1 (en) * | 1998-06-04 | 1998-09-24 | NUTROCK Apparatebau GmbH, 42655 Solingen | Sliding lid for a container |
CN101061259A (en) * | 2004-07-01 | 2007-10-24 | 埃托特克德国有限公司 | Device and method for electrolytically treating work pieces |
JP3784824B1 (en) * | 2005-07-19 | 2006-06-14 | 株式会社アイプラント | Electroplating treatment system |
CN101730761A (en) * | 2007-06-06 | 2010-06-09 | 埃托特克德国有限公司 | Vertical system for the plating treatment of a work piece and method for conveying the work piece |
CN201195761Y (en) * | 2008-04-28 | 2009-02-18 | 广州市百达信工贸有限公司 | Cathode rotary rack plating apparatus with center anode |
CN101319344A (en) * | 2008-06-26 | 2008-12-10 | 匡优新 | Automatic transport cart for galvanization manufacture |
CN102080250A (en) * | 2009-11-27 | 2011-06-01 | 北京中科三环高技术股份有限公司 | Automatic lifting structure of plating/phosphating line |
CN101709498A (en) * | 2009-12-14 | 2010-05-19 | 华中科技大学 | Electrophoresis equipment for thin film deposition |
CN101922038A (en) * | 2010-09-01 | 2010-12-22 | 深南电路有限公司 | Upright plating line plating equipment and clamp thereof |
CN202595307U (en) * | 2012-03-16 | 2012-12-12 | 四会市研创电器有限公司 | Clamp for surface treatment of metal |
KR20130131914A (en) * | 2012-05-25 | 2013-12-04 | 대진대학교 산학협력단 | Vertical drum rotation electroforming device |
CN202849579U (en) * | 2012-09-26 | 2013-04-03 | 苏州市胜能弹簧五金制品有限公司 | Double-torsion spring arranged on electroplating hanging tool |
CN103526272A (en) * | 2013-09-17 | 2014-01-22 | 兰继红 | Firm electroplating suspension rod capable of automatic elevation |
CN203683711U (en) * | 2013-12-26 | 2014-07-02 | 深圳市华大电路科技有限公司 | Copper plating rectifying device |
CN203820913U (en) * | 2014-05-13 | 2014-09-10 | 遂宁市维海电子科技有限公司 | Circuit board electroplating clamp |
CN203846127U (en) * | 2014-05-28 | 2014-09-24 | 晋西工业集团有限责任公司 | Integral electroplating device for tube workpiece |
CN204198885U (en) * | 2014-09-18 | 2015-03-11 | 丹阳市新光电子有限公司 | A kind of lifting electroplanting device of protection against electric shock |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106048695A (en) * | 2016-06-26 | 2016-10-26 | 温州正达环保设备有限公司 | Environmental-friendly screw thread turret head |
CN107913115A (en) * | 2017-12-02 | 2018-04-17 | 大连煜美医疗科技有限公司 | Artificial tooth electroplating meter |
CN114934279A (en) * | 2022-05-31 | 2022-08-23 | 东华工程科技股份有限公司 | Electrolytic tank for hydrogen production by water electrolysis |
Also Published As
Publication number | Publication date |
---|---|
CN104213181B (en) | 2016-05-18 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An electric shock proof lifting electroplating device Effective date of registration: 20221025 Granted publication date: 20160518 Pledgee: Jiangsu Danyang Rural Commercial Bank Co.,Ltd. Pledgor: DANYANG CITY XINGUANG ELECTRON Co.,Ltd. Registration number: Y2022980019477 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231008 Granted publication date: 20160518 Pledgee: Jiangsu Danyang Rural Commercial Bank Co.,Ltd. Pledgor: DANYANG CITY XINGUANG ELECTRON Co.,Ltd. Registration number: Y2022980019477 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A lifting electroplating device for preventing electric shock Effective date of registration: 20231209 Granted publication date: 20160518 Pledgee: Jiangsu Danyang Rural Commercial Bank Co.,Ltd. Pledgor: DANYANG CITY XINGUANG ELECTRON Co.,Ltd. Registration number: Y2023980069861 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |