JP2001501882A - 逆スタンピング方法 - Google Patents
逆スタンピング方法Info
- Publication number
- JP2001501882A JP2001501882A JP10517724A JP51772498A JP2001501882A JP 2001501882 A JP2001501882 A JP 2001501882A JP 10517724 A JP10517724 A JP 10517724A JP 51772498 A JP51772498 A JP 51772498A JP 2001501882 A JP2001501882 A JP 2001501882A
- Authority
- JP
- Japan
- Prior art keywords
- printing material
- negative
- liquid
- bath
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 37
- 238000007639 printing Methods 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 47
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 239000002904 solvent Substances 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 230000008569 process Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/02—Letterpress printing, e.g. book printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F1/00—Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed
- B41F1/26—Details
- B41F1/40—Inking units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Printing Methods (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Forging (AREA)
- Vending Machines For Individual Products (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Detergent Compositions (AREA)
- Weting (AREA)
- General Preparation And Processing Of Foods (AREA)
- Confectionery (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.図形の盛り上げたネガを備えた型を5,000〜50,000cpsの範囲 内にある粘度を有する液状印刷素材の浴槽中に前記ネガを上向きにして浸漬し、 前記ネガを上向きに維持しながら前記図形の盛り上げたネガと前記浴槽を相対的 に垂直方向に変位させて液状印刷素材で濡れた前記ネガを露出させ、 被印刷面を液状印刷素材で濡らされ上向きに露出した前記ネガに接触させて同 ネガから印刷素材を被印刷面に転写させることにより被印刷面に図形を印刷する 方法。 2.請求項1による方法において、前記液状印刷素材の浴が目標温度の3℃以内 に温度制御されること。 3.請求項1による方法において、前記液状印刷素材が前記浴槽とリザーバ間に て連続的に循環されること。 4.請求項1による方法において、前記液状印刷素材が揮発性溶剤中の溶質の溶 液であって前記浴槽と蒸発によって消失した溶質が取り替えられるリザーバの間 にて連続的に循環されること。 5.請求項1による方法において、前記液状印刷素材が懸濁した固体を含有し同 固体を懸濁液中に維持するため連続的に攪拌されること。 6.請求項1による方法において、前記液状印刷素材が非硬化性の接着剤である こと。 7.請求項1による方法において、前記盛り上げたネガが実質的に平らであり水 平であること。 8.請求項1による方法において、前記盛り上げたネガが実質的に平らであり水 平に対して30°以下の角度を形成していること。 9.請求項1による方法において、前記盛り上げたネガが複数の平面を規定し、 前記被印刷面が前記ネガの平面に対応する複数の平面を規定していることにより 、前記液状印刷素材が被印刷面の全ての平面に同時に転写されること。 10.請求項1による方法において、前記被印刷面がガラスの表面であること。 11.請求項1による方法において、前記被印刷面が金属リードフレームの表面 であること。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2730396P | 1996-10-10 | 1996-10-10 | |
US60/027,303 | 1996-10-10 | ||
PCT/US1997/018173 WO1998015410A1 (en) | 1996-10-10 | 1997-10-07 | Inverted stamping process |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001501882A true JP2001501882A (ja) | 2001-02-13 |
JP3428028B2 JP3428028B2 (ja) | 2003-07-22 |
Family
ID=21836910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51772498A Expired - Fee Related JP3428028B2 (ja) | 1996-10-10 | 1997-10-07 | 逆スタンピング方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US5816158A (ja) |
EP (1) | EP0930974B1 (ja) |
JP (1) | JP3428028B2 (ja) |
KR (1) | KR100457148B1 (ja) |
CN (1) | CN1078532C (ja) |
AT (1) | ATE201849T1 (ja) |
AU (1) | AU4749997A (ja) |
DE (1) | DE69705124T2 (ja) |
DK (1) | DK0930974T3 (ja) |
HK (1) | HK1021719A1 (ja) |
WO (1) | WO1998015410A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214152B1 (en) * | 1999-03-22 | 2001-04-10 | Rjr Polymers, Inc. | Lead frame moisture barrier for molded plastic electronic packages |
US20030202242A1 (en) * | 2002-04-26 | 2003-10-30 | Roberto Sgaravatto | Slide for the microscopic examination of biological fluids |
US10225906B2 (en) * | 2004-10-22 | 2019-03-05 | Massachusetts Institute Of Technology | Light emitting device including semiconductor nanocrystals |
US7598122B1 (en) * | 2006-03-08 | 2009-10-06 | National Semiconductor Corporation | Die attach method and microarray leadframe structure |
EP1884830A1 (en) * | 2006-08-04 | 2008-02-06 | Sony Deutschland GmbH | A method of applying a material on a substrate |
US8530279B2 (en) * | 2008-09-11 | 2013-09-10 | Texas Instruments Incorporated | Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter |
US8639373B2 (en) * | 2009-10-14 | 2014-01-28 | Stmicroelectronics, Inc. | Modular low stress package technology |
US9027247B2 (en) | 2012-10-22 | 2015-05-12 | Xerox Corporation | Liquid adhesive application by contact printing |
US10115605B2 (en) | 2016-07-06 | 2018-10-30 | Rjr Technologies, Inc. | Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB566461A (en) * | 1942-08-19 | 1945-01-01 | Goss Printing Press Co Ltd | Method of printing with water base and like inks |
US2700629A (en) * | 1950-01-30 | 1955-01-25 | American Photofoil Corp | Method for transferring a decoration to a surface |
US2905085A (en) * | 1956-11-15 | 1959-09-22 | British Tufting Machinery Ltd | Textile printing |
US3140655A (en) * | 1961-11-03 | 1964-07-14 | John J Lally | Apparatus for impressing type face |
US3741764A (en) * | 1971-05-21 | 1973-06-26 | Jerobee Ind Inc | Method of making accurate reproduction |
KR0153260B1 (ko) * | 1989-06-16 | 1998-11-02 | 기다지마 요시도시 | 미세패턴의 인쇄방법 |
US5095817A (en) * | 1990-11-30 | 1992-03-17 | Kabushiki Kaisha Shinkawa | Thin film supplying mechanism |
-
1997
- 1997-10-07 AU AU47499/97A patent/AU4749997A/en not_active Abandoned
- 1997-10-07 KR KR10-1999-7003118A patent/KR100457148B1/ko not_active IP Right Cessation
- 1997-10-07 JP JP51772498A patent/JP3428028B2/ja not_active Expired - Fee Related
- 1997-10-07 EP EP97910024A patent/EP0930974B1/en not_active Expired - Lifetime
- 1997-10-07 DK DK97910024T patent/DK0930974T3/da active
- 1997-10-07 US US08/952,336 patent/US5816158A/en not_active Expired - Lifetime
- 1997-10-07 WO PCT/US1997/018173 patent/WO1998015410A1/en active IP Right Grant
- 1997-10-07 CN CN97199684A patent/CN1078532C/zh not_active Expired - Fee Related
- 1997-10-07 DE DE69705124T patent/DE69705124T2/de not_active Expired - Lifetime
- 1997-10-07 AT AT97910024T patent/ATE201849T1/de active
-
2000
- 2000-01-20 HK HK00100375A patent/HK1021719A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU4749997A (en) | 1998-05-05 |
KR20000049049A (ko) | 2000-07-25 |
EP0930974B1 (en) | 2001-06-06 |
DE69705124D1 (de) | 2001-07-12 |
KR100457148B1 (ko) | 2004-11-16 |
JP3428028B2 (ja) | 2003-07-22 |
CN1237927A (zh) | 1999-12-08 |
CN1078532C (zh) | 2002-01-30 |
ATE201849T1 (de) | 2001-06-15 |
WO1998015410A1 (en) | 1998-04-16 |
HK1021719A1 (en) | 2000-06-30 |
US5816158A (en) | 1998-10-06 |
EP0930974A1 (en) | 1999-07-28 |
DK0930974T3 (da) | 2001-09-03 |
DE69705124T2 (de) | 2001-09-27 |
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