HK1021719A1 - Inverted stamping process - Google Patents
Inverted stamping processInfo
- Publication number
- HK1021719A1 HK1021719A1 HK00100375A HK00100375A HK1021719A1 HK 1021719 A1 HK1021719 A1 HK 1021719A1 HK 00100375 A HK00100375 A HK 00100375A HK 00100375 A HK00100375 A HK 00100375A HK 1021719 A1 HK1021719 A1 HK 1021719A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- die
- pct
- stamping process
- sec
- wet
- Prior art date
Links
- 239000007788 liquid Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/02—Letterpress printing, e.g. book printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F1/00—Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed
- B41F1/26—Details
- B41F1/40—Inking units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Printing Methods (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Forging (AREA)
- Vending Machines For Individual Products (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Detergent Compositions (AREA)
- Weting (AREA)
- General Preparation And Processing Of Foods (AREA)
- Confectionery (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2730396P | 1996-10-10 | 1996-10-10 | |
PCT/US1997/018173 WO1998015410A1 (en) | 1996-10-10 | 1997-10-07 | Inverted stamping process |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1021719A1 true HK1021719A1 (en) | 2000-06-30 |
Family
ID=21836910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00100375A HK1021719A1 (en) | 1996-10-10 | 2000-01-20 | Inverted stamping process |
Country Status (11)
Country | Link |
---|---|
US (1) | US5816158A (xx) |
EP (1) | EP0930974B1 (xx) |
JP (1) | JP3428028B2 (xx) |
KR (1) | KR100457148B1 (xx) |
CN (1) | CN1078532C (xx) |
AT (1) | ATE201849T1 (xx) |
AU (1) | AU4749997A (xx) |
DE (1) | DE69705124T2 (xx) |
DK (1) | DK0930974T3 (xx) |
HK (1) | HK1021719A1 (xx) |
WO (1) | WO1998015410A1 (xx) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214152B1 (en) * | 1999-03-22 | 2001-04-10 | Rjr Polymers, Inc. | Lead frame moisture barrier for molded plastic electronic packages |
US20030202242A1 (en) * | 2002-04-26 | 2003-10-30 | Roberto Sgaravatto | Slide for the microscopic examination of biological fluids |
US20060196375A1 (en) * | 2004-10-22 | 2006-09-07 | Seth Coe-Sullivan | Method and system for transferring a patterned material |
US7598122B1 (en) * | 2006-03-08 | 2009-10-06 | National Semiconductor Corporation | Die attach method and microarray leadframe structure |
EP1884830A1 (en) * | 2006-08-04 | 2008-02-06 | Sony Deutschland GmbH | A method of applying a material on a substrate |
US8530279B2 (en) * | 2008-09-11 | 2013-09-10 | Texas Instruments Incorporated | Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter |
US8639373B2 (en) * | 2009-10-14 | 2014-01-28 | Stmicroelectronics, Inc. | Modular low stress package technology |
US9027247B2 (en) | 2012-10-22 | 2015-05-12 | Xerox Corporation | Liquid adhesive application by contact printing |
US10115605B2 (en) | 2016-07-06 | 2018-10-30 | Rjr Technologies, Inc. | Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB566461A (en) * | 1942-08-19 | 1945-01-01 | Goss Printing Press Co Ltd | Method of printing with water base and like inks |
US2700629A (en) * | 1950-01-30 | 1955-01-25 | American Photofoil Corp | Method for transferring a decoration to a surface |
US2905085A (en) * | 1956-11-15 | 1959-09-22 | British Tufting Machinery Ltd | Textile printing |
US3140655A (en) * | 1961-11-03 | 1964-07-14 | John J Lally | Apparatus for impressing type face |
US3741764A (en) * | 1971-05-21 | 1973-06-26 | Jerobee Ind Inc | Method of making accurate reproduction |
KR0153260B1 (ko) * | 1989-06-16 | 1998-11-02 | 기다지마 요시도시 | 미세패턴의 인쇄방법 |
US5095817A (en) * | 1990-11-30 | 1992-03-17 | Kabushiki Kaisha Shinkawa | Thin film supplying mechanism |
-
1997
- 1997-10-07 DE DE69705124T patent/DE69705124T2/de not_active Expired - Lifetime
- 1997-10-07 AT AT97910024T patent/ATE201849T1/de active
- 1997-10-07 EP EP97910024A patent/EP0930974B1/en not_active Expired - Lifetime
- 1997-10-07 WO PCT/US1997/018173 patent/WO1998015410A1/en active IP Right Grant
- 1997-10-07 US US08/952,336 patent/US5816158A/en not_active Expired - Lifetime
- 1997-10-07 AU AU47499/97A patent/AU4749997A/en not_active Abandoned
- 1997-10-07 DK DK97910024T patent/DK0930974T3/da active
- 1997-10-07 JP JP51772498A patent/JP3428028B2/ja not_active Expired - Fee Related
- 1997-10-07 KR KR10-1999-7003118A patent/KR100457148B1/ko not_active IP Right Cessation
- 1997-10-07 CN CN97199684A patent/CN1078532C/zh not_active Expired - Fee Related
-
2000
- 2000-01-20 HK HK00100375A patent/HK1021719A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU4749997A (en) | 1998-05-05 |
JP2001501882A (ja) | 2001-02-13 |
CN1078532C (zh) | 2002-01-30 |
EP0930974B1 (en) | 2001-06-06 |
EP0930974A1 (en) | 1999-07-28 |
WO1998015410A1 (en) | 1998-04-16 |
ATE201849T1 (de) | 2001-06-15 |
JP3428028B2 (ja) | 2003-07-22 |
KR100457148B1 (ko) | 2004-11-16 |
DE69705124T2 (de) | 2001-09-27 |
DK0930974T3 (da) | 2001-09-03 |
KR20000049049A (ko) | 2000-07-25 |
DE69705124D1 (de) | 2001-07-12 |
US5816158A (en) | 1998-10-06 |
CN1237927A (zh) | 1999-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20151007 |