PL377299A1 - Metoda katodowego rozpylania magnetronowego - Google Patents

Metoda katodowego rozpylania magnetronowego

Info

Publication number
PL377299A1
PL377299A1 PL377299A PL37729903A PL377299A1 PL 377299 A1 PL377299 A1 PL 377299A1 PL 377299 A PL377299 A PL 377299A PL 37729903 A PL37729903 A PL 37729903A PL 377299 A1 PL377299 A1 PL 377299A1
Authority
PL
Poland
Prior art keywords
target
magnetron
magnetron sputtering
sputtering surface
sputtering
Prior art date
Application number
PL377299A
Other languages
English (en)
Inventor
Guy Clavareau
Patrick Lefevre
Original Assignee
Alloys For Technical Applications S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32111404&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL377299(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alloys For Technical Applications S.A. filed Critical Alloys For Technical Applications S.A.
Publication of PL377299A1 publication Critical patent/PL377299A1/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coating By Spraying Or Casting (AREA)
PL377299A 2002-10-23 2003-10-22 Metoda katodowego rozpylania magnetronowego PL377299A1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE2002/0606A BE1015154A5 (fr) 2002-10-23 2002-10-23 Ensemble destine a la pulverisation cathodique magnetron.

Publications (1)

Publication Number Publication Date
PL377299A1 true PL377299A1 (pl) 2006-01-23

Family

ID=32111404

Family Applications (1)

Application Number Title Priority Date Filing Date
PL377299A PL377299A1 (pl) 2002-10-23 2003-10-22 Metoda katodowego rozpylania magnetronowego

Country Status (10)

Country Link
US (1) US20060086605A1 (pl)
EP (1) EP1556883B1 (pl)
JP (1) JP2006503979A (pl)
AT (1) ATE363727T1 (pl)
AU (1) AU2003278001A1 (pl)
BE (1) BE1015154A5 (pl)
CA (1) CA2502667A1 (pl)
DE (1) DE60314171T2 (pl)
PL (1) PL377299A1 (pl)
WO (1) WO2004038756A2 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070007130A1 (en) * 2005-07-11 2007-01-11 Heraeus, Inc. Enhanced magnetron sputtering target
US20080047831A1 (en) * 2006-08-24 2008-02-28 Hendryk Richert Segmented/modular magnet bars for sputtering target
US20100044222A1 (en) * 2008-08-21 2010-02-25 Guardian Industries Corp., Sputtering target including magnetic field uniformity enhancing sputtering target backing tube
EP2471845B1 (en) * 2009-08-27 2017-02-15 Nippon Shokubai Co., Ltd. Water-absorbing resin based on polyacrylic acid (salt) and process for producing same
DE102013105617A1 (de) * 2013-01-22 2014-07-24 Von Ardenne Anlagentechnik Gmbh Planarmagnetronanordnung und Verfahren zum Betreiben einer Planarmagnetronanordnung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
JPH03271366A (ja) * 1990-03-20 1991-12-03 Tosoh Corp スパッタリングターゲット及びそれを用いる装置
US5286361A (en) * 1992-10-19 1994-02-15 Regents Of The University Of California Magnetically attached sputter targets
US5417833A (en) * 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
US5415754A (en) * 1993-10-22 1995-05-16 Sierra Applied Sciences, Inc. Method and apparatus for sputtering magnetic target materials
DE69937948D1 (de) * 1999-06-21 2008-02-21 Bekaert Advanced Coatings N V Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils

Also Published As

Publication number Publication date
BE1015154A5 (fr) 2004-10-05
EP1556883A2 (fr) 2005-07-27
DE60314171D1 (de) 2007-07-12
ATE363727T1 (de) 2007-06-15
JP2006503979A (ja) 2006-02-02
DE60314171T2 (de) 2008-01-24
CA2502667A1 (en) 2004-05-06
WO2004038756A2 (fr) 2004-05-06
WO2004038756A3 (fr) 2004-11-25
US20060086605A1 (en) 2006-04-27
AU2003278001A1 (en) 2004-05-13
EP1556883B1 (fr) 2007-05-30

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Legal Events

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