ATE363727T1 - Verfahren zur kathodischen magnetron-zerstäubung - Google Patents

Verfahren zur kathodischen magnetron-zerstäubung

Info

Publication number
ATE363727T1
ATE363727T1 AT03769081T AT03769081T ATE363727T1 AT E363727 T1 ATE363727 T1 AT E363727T1 AT 03769081 T AT03769081 T AT 03769081T AT 03769081 T AT03769081 T AT 03769081T AT E363727 T1 ATE363727 T1 AT E363727T1
Authority
AT
Austria
Prior art keywords
magnetron
target
sputting
cathodic
sputtering surface
Prior art date
Application number
AT03769081T
Other languages
English (en)
Inventor
Guy Clavareau
Patrick Lefevre
Original Assignee
Alloys For Technical Applic S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32111404&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE363727(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alloys For Technical Applic S filed Critical Alloys For Technical Applic S
Application granted granted Critical
Publication of ATE363727T1 publication Critical patent/ATE363727T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coating By Spraying Or Casting (AREA)
AT03769081T 2002-10-23 2003-10-22 Verfahren zur kathodischen magnetron-zerstäubung ATE363727T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE2002/0606A BE1015154A5 (fr) 2002-10-23 2002-10-23 Ensemble destine a la pulverisation cathodique magnetron.

Publications (1)

Publication Number Publication Date
ATE363727T1 true ATE363727T1 (de) 2007-06-15

Family

ID=32111404

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03769081T ATE363727T1 (de) 2002-10-23 2003-10-22 Verfahren zur kathodischen magnetron-zerstäubung

Country Status (10)

Country Link
US (1) US20060086605A1 (de)
EP (1) EP1556883B1 (de)
JP (1) JP2006503979A (de)
AT (1) ATE363727T1 (de)
AU (1) AU2003278001A1 (de)
BE (1) BE1015154A5 (de)
CA (1) CA2502667A1 (de)
DE (1) DE60314171T2 (de)
PL (1) PL377299A1 (de)
WO (1) WO2004038756A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070007130A1 (en) * 2005-07-11 2007-01-11 Heraeus, Inc. Enhanced magnetron sputtering target
US20080047831A1 (en) * 2006-08-24 2008-02-28 Hendryk Richert Segmented/modular magnet bars for sputtering target
US20100044222A1 (en) * 2008-08-21 2010-02-25 Guardian Industries Corp., Sputtering target including magnetic field uniformity enhancing sputtering target backing tube
EP2471843B1 (de) * 2009-08-27 2016-08-17 Nippon Shokubai Co., Ltd. Verfahren zu herstellung von wasserabsorbierendes harz auf basis von polyacrylsäure(salz)
DE102013105617A1 (de) * 2013-01-22 2014-07-24 Von Ardenne Anlagentechnik Gmbh Planarmagnetronanordnung und Verfahren zum Betreiben einer Planarmagnetronanordnung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
JPH03271366A (ja) * 1990-03-20 1991-12-03 Tosoh Corp スパッタリングターゲット及びそれを用いる装置
US5286361A (en) * 1992-10-19 1994-02-15 Regents Of The University Of California Magnetically attached sputter targets
US5417833A (en) * 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
US5415754A (en) * 1993-10-22 1995-05-16 Sierra Applied Sciences, Inc. Method and apparatus for sputtering magnetic target materials
DE69937948D1 (de) * 1999-06-21 2008-02-21 Bekaert Advanced Coatings N V Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils

Also Published As

Publication number Publication date
JP2006503979A (ja) 2006-02-02
AU2003278001A1 (en) 2004-05-13
DE60314171T2 (de) 2008-01-24
WO2004038756A3 (fr) 2004-11-25
EP1556883B1 (de) 2007-05-30
EP1556883A2 (de) 2005-07-27
PL377299A1 (pl) 2006-01-23
BE1015154A5 (fr) 2004-10-05
US20060086605A1 (en) 2006-04-27
DE60314171D1 (de) 2007-07-12
WO2004038756A2 (fr) 2004-05-06
CA2502667A1 (en) 2004-05-06

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Legal Events

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