DE60314171D1 - Verfahren zur kathodischen magnetron-zerstäubung - Google Patents

Verfahren zur kathodischen magnetron-zerstäubung

Info

Publication number
DE60314171D1
DE60314171D1 DE60314171T DE60314171T DE60314171D1 DE 60314171 D1 DE60314171 D1 DE 60314171D1 DE 60314171 T DE60314171 T DE 60314171T DE 60314171 T DE60314171 T DE 60314171T DE 60314171 D1 DE60314171 D1 DE 60314171D1
Authority
DE
Germany
Prior art keywords
target
magnetron
magnetron spraying
cathodic
sputtering surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE60314171T
Other languages
English (en)
Other versions
DE60314171T2 (de
Inventor
Guy Clavareau
Patrick Lefevre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALLOYS FOR TECHNICAL APPLIC S
Original Assignee
ALLOYS FOR TECHNICAL APPLIC S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32111404&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60314171(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by ALLOYS FOR TECHNICAL APPLIC S filed Critical ALLOYS FOR TECHNICAL APPLIC S
Application granted granted Critical
Publication of DE60314171D1 publication Critical patent/DE60314171D1/de
Publication of DE60314171T2 publication Critical patent/DE60314171T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coating By Spraying Or Casting (AREA)
DE60314171T 2002-10-23 2003-10-22 Verfahren zur kathodischen magnetron-zerstäubung Revoked DE60314171T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
BE2002/0606A BE1015154A5 (fr) 2002-10-23 2002-10-23 Ensemble destine a la pulverisation cathodique magnetron.
BE200200606 2002-10-23
PCT/BE2003/000179 WO2004038756A2 (fr) 2002-10-23 2003-10-22 Methode destinee a la pulverisation cathodique magnetron

Publications (2)

Publication Number Publication Date
DE60314171D1 true DE60314171D1 (de) 2007-07-12
DE60314171T2 DE60314171T2 (de) 2008-01-24

Family

ID=32111404

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60314171T Revoked DE60314171T2 (de) 2002-10-23 2003-10-22 Verfahren zur kathodischen magnetron-zerstäubung

Country Status (10)

Country Link
US (1) US20060086605A1 (de)
EP (1) EP1556883B1 (de)
JP (1) JP2006503979A (de)
AT (1) ATE363727T1 (de)
AU (1) AU2003278001A1 (de)
BE (1) BE1015154A5 (de)
CA (1) CA2502667A1 (de)
DE (1) DE60314171T2 (de)
PL (1) PL377299A1 (de)
WO (1) WO2004038756A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070007130A1 (en) * 2005-07-11 2007-01-11 Heraeus, Inc. Enhanced magnetron sputtering target
US20080047831A1 (en) * 2006-08-24 2008-02-28 Hendryk Richert Segmented/modular magnet bars for sputtering target
US20100044222A1 (en) * 2008-08-21 2010-02-25 Guardian Industries Corp., Sputtering target including magnetic field uniformity enhancing sputtering target backing tube
JP5619010B2 (ja) * 2009-08-27 2014-11-05 株式会社日本触媒 ポリアクリル酸（塩）系吸水性樹脂およびその製造方法
DE102013105617A1 (de) * 2013-01-22 2014-07-24 Von Ardenne Anlagentechnik Gmbh Planarmagnetronanordnung und Verfahren zum Betreiben einer Planarmagnetronanordnung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
JPH03271366A (ja) * 1990-03-20 1991-12-03 Tosoh Corp スパッタリングターゲット及びそれを用いる装置
US5286361A (en) * 1992-10-19 1994-02-15 Regents Of The University Of California Magnetically attached sputter targets
US5417833A (en) * 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
US5415754A (en) * 1993-10-22 1995-05-16 Sierra Applied Sciences, Inc. Method and apparatus for sputtering magnetic target materials
EP1063679B1 (de) * 1999-06-21 2008-01-09 Bekaert Advanced Coatings NV. Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils

Also Published As

Publication number Publication date
DE60314171T2 (de) 2008-01-24
CA2502667A1 (en) 2004-05-06
WO2004038756A2 (fr) 2004-05-06
AU2003278001A1 (en) 2004-05-13
EP1556883A2 (de) 2005-07-27
EP1556883B1 (de) 2007-05-30
BE1015154A5 (fr) 2004-10-05
PL377299A1 (pl) 2006-01-23
ATE363727T1 (de) 2007-06-15
WO2004038756A3 (fr) 2004-11-25
US20060086605A1 (en) 2006-04-27
JP2006503979A (ja) 2006-02-02

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8328 Change in the person/name/address of the agent

Representative=s name: BOCKHORNI & KOLLEGEN, 80687 MUENCHEN

8339 Ceased/non-payment of the annual fee
8331 Complete revocation