PL3659206T3 - Struktura koncentrycznej linii przesyłowej - Google Patents

Struktura koncentrycznej linii przesyłowej

Info

Publication number
PL3659206T3
PL3659206T3 PL18746365T PL18746365T PL3659206T3 PL 3659206 T3 PL3659206 T3 PL 3659206T3 PL 18746365 T PL18746365 T PL 18746365T PL 18746365 T PL18746365 T PL 18746365T PL 3659206 T3 PL3659206 T3 PL 3659206T3
Authority
PL
Poland
Prior art keywords
transmission line
line structure
coaxial transmission
coaxial
transmission
Prior art date
Application number
PL18746365T
Other languages
English (en)
Inventor
Angelo M. Puzella
Lance A. Auer
Norman ARMENDARIZ
Donald A. Bozza
John B. Francis
Philip M. Henault
Randal W. Oberle
Susan C. Trulli
Dimitry Zarkh
Original Assignee
Raytheon Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Company filed Critical Raytheon Company
Publication of PL3659206T3 publication Critical patent/PL3659206T3/pl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00Communication cables or conductors
    • H01B11/18Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
    • H01B11/20Cables having a multiplicity of coaxial lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00Communication cables or conductors
    • H01B11/18Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
    • H01B11/1808Construction of the conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06Coaxial lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/103Hollow-waveguide/coaxial-line transitions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/005Manufacturing coaxial lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
PL18746365T 2017-07-28 2018-07-02 Struktura koncentrycznej linii przesyłowej PL3659206T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/663,128 US10276282B2 (en) 2017-07-28 2017-07-28 Coaxial transmission line structure
PCT/US2018/040549 WO2019022922A1 (en) 2017-07-28 2018-07-02 COAXIAL TRANSMISSION LINE STRUCTURE
EP18746365.8A EP3659206B1 (en) 2017-07-28 2018-07-02 Coaxial transmission line structure

Publications (1)

Publication Number Publication Date
PL3659206T3 true PL3659206T3 (pl) 2022-02-21

Family

ID=63036340

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18746365T PL3659206T3 (pl) 2017-07-28 2018-07-02 Struktura koncentrycznej linii przesyłowej

Country Status (6)

Country Link
US (1) US10276282B2 (pl)
EP (1) EP3659206B1 (pl)
JP (1) JP6957746B2 (pl)
KR (1) KR102239468B1 (pl)
PL (1) PL3659206T3 (pl)
WO (1) WO2019022922A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11876278B2 (en) 2021-03-29 2024-01-16 Raytheon Company Balun comprising stepped transitions between balance and unbalance connections, where the stepped transitions include ground rings of differing lengths connected by caged vias

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4175257A (en) * 1977-10-05 1979-11-20 United Technologies Corporation Modular microwave power combiner
US4733172A (en) * 1986-03-08 1988-03-22 Trw Inc. Apparatus for testing I.C. chip
US5084651A (en) * 1987-10-29 1992-01-28 Farney George K Microwave tube with directional coupling of an input locking signal
US5347086A (en) 1992-03-24 1994-09-13 Microelectronics And Computer Technology Corporation Coaxial die and substrate bumps
US5218322A (en) * 1992-04-07 1993-06-08 Hughes Aircraft Company Solid state microwave power amplifier module
US5668509A (en) * 1996-03-25 1997-09-16 Hughes Electronics Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies
JP3546823B2 (ja) * 2000-09-07 2004-07-28 インターナショナル・ビジネス・マシーンズ・コーポレーション スルーホール構造および該スルーホール構造を含むプリント基板
JP4623850B2 (ja) 2001-03-27 2011-02-02 京セラ株式会社 高周波半導体素子収納用パッケージおよびその実装構造
US7091424B2 (en) 2002-10-10 2006-08-15 International Business Machines Corporation Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
DE10300956B3 (de) * 2003-01-13 2004-07-15 Epcos Ag Bauelement mit Höchstfrequenzverbindungen in einem Substrat
DE10300955B4 (de) * 2003-01-13 2005-10-27 Epcos Ag Radar-Transceiver für Mikrowellen- und Millimeterwellenanwendungen
DE10305855A1 (de) 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
JP4652230B2 (ja) 2003-06-02 2011-03-16 日本電気株式会社 プリント回路基板用コンパクトビア伝送路およびその設計方法
WO2007046271A1 (ja) 2005-10-18 2007-04-26 Nec Corporation 垂直信号経路、それを有するプリント基板及びそのプリント基板と半導体素子とを有する半導体パッケージ
JP4365852B2 (ja) 2006-11-30 2009-11-18 株式会社日立製作所 導波管構造
US7675465B2 (en) * 2007-05-22 2010-03-09 Sibeam, Inc. Surface mountable integrated circuit packaging scheme
KR101055425B1 (ko) 2010-04-30 2011-08-08 삼성전기주식회사 광대역 전송선로-도파관 변환장치
US9577035B2 (en) 2012-08-24 2017-02-21 Newport Fab, Llc Isolated through silicon vias in RF technologies
US9980370B2 (en) * 2013-09-24 2018-05-22 Nec Corporation Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween

Also Published As

Publication number Publication date
JP2020526045A (ja) 2020-08-27
EP3659206B1 (en) 2021-11-10
US20190035517A1 (en) 2019-01-31
KR20190126929A (ko) 2019-11-12
WO2019022922A1 (en) 2019-01-31
JP6957746B2 (ja) 2021-11-02
EP3659206A1 (en) 2020-06-03
US10276282B2 (en) 2019-04-30
KR102239468B1 (ko) 2021-04-12

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