PL3659206T3 - Struktura koncentrycznej linii przesyłowej - Google Patents
Struktura koncentrycznej linii przesyłowejInfo
- Publication number
- PL3659206T3 PL3659206T3 PL18746365T PL18746365T PL3659206T3 PL 3659206 T3 PL3659206 T3 PL 3659206T3 PL 18746365 T PL18746365 T PL 18746365T PL 18746365 T PL18746365 T PL 18746365T PL 3659206 T3 PL3659206 T3 PL 3659206T3
- Authority
- PL
- Poland
- Prior art keywords
- transmission line
- line structure
- coaxial transmission
- coaxial
- transmission
- Prior art date
Links
- 230000005540 biological transmission Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
- H01B11/20—Cables having a multiplicity of coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
- H01B11/1808—Construction of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/06—Coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/103—Hollow-waveguide/coaxial-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/005—Manufacturing coaxial lines
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Waveguides (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/663,128 US10276282B2 (en) | 2017-07-28 | 2017-07-28 | Coaxial transmission line structure |
PCT/US2018/040549 WO2019022922A1 (en) | 2017-07-28 | 2018-07-02 | COAXIAL TRANSMISSION LINE STRUCTURE |
EP18746365.8A EP3659206B1 (en) | 2017-07-28 | 2018-07-02 | Coaxial transmission line structure |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3659206T3 true PL3659206T3 (pl) | 2022-02-21 |
Family
ID=63036340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL18746365T PL3659206T3 (pl) | 2017-07-28 | 2018-07-02 | Struktura koncentrycznej linii przesyłowej |
Country Status (6)
Country | Link |
---|---|
US (1) | US10276282B2 (pl) |
EP (1) | EP3659206B1 (pl) |
JP (1) | JP6957746B2 (pl) |
KR (1) | KR102239468B1 (pl) |
PL (1) | PL3659206T3 (pl) |
WO (1) | WO2019022922A1 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11876278B2 (en) | 2021-03-29 | 2024-01-16 | Raytheon Company | Balun comprising stepped transitions between balance and unbalance connections, where the stepped transitions include ground rings of differing lengths connected by caged vias |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4175257A (en) * | 1977-10-05 | 1979-11-20 | United Technologies Corporation | Modular microwave power combiner |
US4733172A (en) * | 1986-03-08 | 1988-03-22 | Trw Inc. | Apparatus for testing I.C. chip |
US5084651A (en) * | 1987-10-29 | 1992-01-28 | Farney George K | Microwave tube with directional coupling of an input locking signal |
US5347086A (en) | 1992-03-24 | 1994-09-13 | Microelectronics And Computer Technology Corporation | Coaxial die and substrate bumps |
US5218322A (en) * | 1992-04-07 | 1993-06-08 | Hughes Aircraft Company | Solid state microwave power amplifier module |
US5668509A (en) * | 1996-03-25 | 1997-09-16 | Hughes Electronics | Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies |
JP3546823B2 (ja) * | 2000-09-07 | 2004-07-28 | インターナショナル・ビジネス・マシーンズ・コーポレーション | スルーホール構造および該スルーホール構造を含むプリント基板 |
JP4623850B2 (ja) | 2001-03-27 | 2011-02-02 | 京セラ株式会社 | 高周波半導体素子収納用パッケージおよびその実装構造 |
US7091424B2 (en) | 2002-10-10 | 2006-08-15 | International Business Machines Corporation | Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers |
DE10300956B3 (de) * | 2003-01-13 | 2004-07-15 | Epcos Ag | Bauelement mit Höchstfrequenzverbindungen in einem Substrat |
DE10300955B4 (de) * | 2003-01-13 | 2005-10-27 | Epcos Ag | Radar-Transceiver für Mikrowellen- und Millimeterwellenanwendungen |
DE10305855A1 (de) | 2003-02-13 | 2004-08-26 | Robert Bosch Gmbh | HF-Multilayer-Platine |
JP4652230B2 (ja) | 2003-06-02 | 2011-03-16 | 日本電気株式会社 | プリント回路基板用コンパクトビア伝送路およびその設計方法 |
WO2007046271A1 (ja) | 2005-10-18 | 2007-04-26 | Nec Corporation | 垂直信号経路、それを有するプリント基板及びそのプリント基板と半導体素子とを有する半導体パッケージ |
JP4365852B2 (ja) | 2006-11-30 | 2009-11-18 | 株式会社日立製作所 | 導波管構造 |
US7675465B2 (en) * | 2007-05-22 | 2010-03-09 | Sibeam, Inc. | Surface mountable integrated circuit packaging scheme |
KR101055425B1 (ko) | 2010-04-30 | 2011-08-08 | 삼성전기주식회사 | 광대역 전송선로-도파관 변환장치 |
US9577035B2 (en) | 2012-08-24 | 2017-02-21 | Newport Fab, Llc | Isolated through silicon vias in RF technologies |
US9980370B2 (en) * | 2013-09-24 | 2018-05-22 | Nec Corporation | Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween |
-
2017
- 2017-07-28 US US15/663,128 patent/US10276282B2/en active Active
-
2018
- 2018-07-02 PL PL18746365T patent/PL3659206T3/pl unknown
- 2018-07-02 KR KR1020197031807A patent/KR102239468B1/ko active IP Right Grant
- 2018-07-02 WO PCT/US2018/040549 patent/WO2019022922A1/en active Application Filing
- 2018-07-02 EP EP18746365.8A patent/EP3659206B1/en active Active
- 2018-07-02 JP JP2020520442A patent/JP6957746B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2020526045A (ja) | 2020-08-27 |
EP3659206B1 (en) | 2021-11-10 |
US20190035517A1 (en) | 2019-01-31 |
KR20190126929A (ko) | 2019-11-12 |
WO2019022922A1 (en) | 2019-01-31 |
JP6957746B2 (ja) | 2021-11-02 |
EP3659206A1 (en) | 2020-06-03 |
US10276282B2 (en) | 2019-04-30 |
KR102239468B1 (ko) | 2021-04-12 |
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