PL363401A1 - Sposób wytwarzania tarczy do napylania jonowego ze stopu na bazie Si, tarcza do napylania jonowego oraz zastosowanie tarczy do napylania jonowego - Google Patents

Sposób wytwarzania tarczy do napylania jonowego ze stopu na bazie Si, tarcza do napylania jonowego oraz zastosowanie tarczy do napylania jonowego

Info

Publication number
PL363401A1
PL363401A1 PL03363401A PL36340103A PL363401A1 PL 363401 A1 PL363401 A1 PL 363401A1 PL 03363401 A PL03363401 A PL 03363401A PL 36340103 A PL36340103 A PL 36340103A PL 363401 A1 PL363401 A1 PL 363401A1
Authority
PL
Poland
Prior art keywords
disk
ion sputtering
based alloy
fabrication
application
Prior art date
Application number
PL03363401A
Other languages
English (en)
Other versions
PL204234B1 (pl
Inventor
Martin Weigert
Josef Heindel
Uwe Konietzka
Original Assignee
W.C.Heraeus Gmbh & Co.Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by W.C.Heraeus Gmbh & Co.Kg filed Critical W.C.Heraeus Gmbh & Co.Kg
Publication of PL363401A1 publication Critical patent/PL363401A1/pl
Publication of PL204234B1 publication Critical patent/PL204234B1/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D15/00Casting using a mould or core of which a part significant to the process is of high thermal conductivity, e.g. chill casting; Moulds or accessories specially adapted therefor
    • B22D15/02Casting using a mould or core of which a part significant to the process is of high thermal conductivity, e.g. chill casting; Moulds or accessories specially adapted therefor of cylinders, pistons, bearing shells or like thin-walled objects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/15Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting by using vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL363401A 2002-11-14 2003-11-12 Sposób wytwarzania tarczy do napylania jonowego ze stopu na bazie Si PL204234B1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10253319A DE10253319B3 (de) 2002-11-14 2002-11-14 Verfahren zum Herstellen eines Sputtertargets aus einer Si-Basislegierung, sowie die Verwendung des Sputtertargets

Publications (2)

Publication Number Publication Date
PL363401A1 true PL363401A1 (pl) 2004-05-17
PL204234B1 PL204234B1 (pl) 2009-12-31

Family

ID=32185716

Family Applications (1)

Application Number Title Priority Date Filing Date
PL363401A PL204234B1 (pl) 2002-11-14 2003-11-12 Sposób wytwarzania tarczy do napylania jonowego ze stopu na bazie Si

Country Status (7)

Country Link
US (2) US20040094283A1 (pl)
EP (1) EP1447458B1 (pl)
JP (1) JP2004162179A (pl)
CN (1) CN100537829C (pl)
AT (1) ATE329064T1 (pl)
DE (2) DE10253319B3 (pl)
PL (1) PL204234B1 (pl)

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* Cited by examiner, † Cited by third party
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DE102004058316A1 (de) * 2004-12-02 2006-06-08 W.C. Heraeus Gmbh Rohrförmiges Sputtertarget
DE102004060423B4 (de) * 2004-12-14 2016-10-27 Heraeus Deutschland GmbH & Co. KG Rohrtarget und dessen Verwendung
US7922066B2 (en) * 2005-09-21 2011-04-12 Soleras, LTd. Method of manufacturing a rotary sputtering target using a mold
US7247418B2 (en) * 2005-12-01 2007-07-24 Eastman Kodak Company Imageable members with improved chemical resistance
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
EP1933391A1 (de) * 2006-12-11 2008-06-18 Applied Materials, Inc. Verfahren zur Herstellung einer SiN:H-Schicht auf einem Substrat
DE102006060512A1 (de) * 2006-12-19 2008-06-26 W.C. Heraeus Gmbh Sputtertargetanordnung
RU2344019C1 (ru) * 2007-04-16 2009-01-20 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Способ получения литых трубных изделий из сплавов на основе никеля и/или кобальта
RU2340426C1 (ru) * 2007-04-16 2008-12-10 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Способ получения литого трубного катода из сплавов на основе алюминия для ионно-плазменного нанесения покрытий
EP2488677B1 (en) * 2009-10-12 2013-08-28 Gradel S.à.r.L. Method and apparatus for production of rotatable sputtering targets
JP5428741B2 (ja) * 2009-10-19 2014-02-26 東ソー株式会社 円筒形スパッタリングターゲットの製造方法
KR20140029456A (ko) * 2011-04-29 2014-03-10 프랙스에어 에스.티. 테크놀로지, 인코포레이티드 원통형 스퍼터 타깃 조립체를 형성하는 방법
CN102352483A (zh) * 2011-11-15 2012-02-15 江苏美特林科特殊合金有限公司 一种真空溅射镀膜用硅铝合金中空旋转靶材的制备方法
CN102430718A (zh) * 2011-12-26 2012-05-02 昆山全亚冠环保科技有限公司 用于制备铝及铝基合金旋转靶材的模具及制作方法
CN106180652B (zh) * 2016-09-09 2019-02-15 西京学院 一种钛合金薄壁壳体铸坯精加工模具及其加工方法
CN110218983A (zh) * 2019-06-25 2019-09-10 杨晔 磁控溅射旋转靶材的绑定方法
CN111118437A (zh) * 2019-12-31 2020-05-08 广州市尤特新材料有限公司 一种旋转硅磷合金靶材及其制备方法与应用
CN115354290B (zh) * 2022-09-01 2024-01-23 中核四0四有限公司 一种放射性靶件的制造方法及系统

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US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
ES8402188A1 (es) * 1982-04-15 1984-01-16 Creusot Loire Procedimiento de fabricacion de un lingote hueco de acero.
JPS61124566A (ja) * 1984-11-19 1986-06-12 Mitsubishi Metal Corp スパツタリング用Al−Si系合金タ−ゲツト板材の製造法
JPH04184732A (ja) * 1990-11-20 1992-07-01 Seiko Epson Corp スパッタリングターゲットおよび、そのスパッタリングターゲットを用いた保護膜
US5094288A (en) * 1990-11-21 1992-03-10 Silicon Casting, Inc. Method of making an essentially void-free, cast silicon and aluminum product
JPH0539566A (ja) * 1991-02-19 1993-02-19 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
JPH0551730A (ja) * 1991-03-19 1993-03-02 Mitsubishi Materials Corp 蒸着用素材またはスパツタリング用ターゲツト素材の製造方法
BE1007067A3 (nl) * 1992-07-15 1995-03-07 Emiel Vanderstraeten Besloten Sputterkathode en werkwijze voor het vervaardigen van deze kathode.
US5303762A (en) * 1992-07-17 1994-04-19 Hitchiner Manufacturing Co., Inc. Countergravity casting apparatus and method
DE4243757A1 (de) * 1992-12-23 1994-06-30 Leybold Materials Gmbh Target für eine Kathodenzerstäubungsanlage aus einer ferromagnetischen Legierung
JPH07228967A (ja) * 1994-02-17 1995-08-29 Mitsubishi Materials Corp 長尺円筒状スパッタリングターゲット
JP3618005B2 (ja) * 1994-08-23 2005-02-09 三井金属鉱業株式会社 回転カソード用スパッタリングターゲットの製造方法
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DE19810246A1 (de) * 1998-03-10 1999-09-16 Leybold Materials Gmbh Sputtertarget zum Abscheiden nitridischer oder oxidischer Siliziumschichten und Verfahren zu seiner Herstellung
US6581669B2 (en) * 1998-03-10 2003-06-24 W.C. Heraeus Gmbh & Co., Kg Sputtering target for depositing silicon layers in their nitride or oxide form and a process for its preparation
DE69940854D1 (de) * 1998-12-28 2009-06-18 Ultraclad Corp Verfahren zur herstellung eines silizium/aluminiumsputtertargets
DE10043748B4 (de) * 2000-09-05 2004-01-15 W. C. Heraeus Gmbh & Co. Kg Zylinderförmiges Sputtertarget, Verfahren zu seiner Herstellung und Verwendung
DE10063383C1 (de) * 2000-12-19 2002-03-14 Heraeus Gmbh W C Verfahren zur Herstellung eines Rohrtargets und Verwendung
DE10140589A1 (de) * 2001-08-18 2003-02-27 Heraeus Gmbh W C Sputtertarget aus einer Siliziumlegierung und Verfahren zur Herstellung eines Sputtertargets

Also Published As

Publication number Publication date
CN100537829C (zh) 2009-09-09
ATE329064T1 (de) 2006-06-15
DE10253319B3 (de) 2004-05-27
JP2004162179A (ja) 2004-06-10
EP1447458A3 (de) 2004-08-25
US20050092455A1 (en) 2005-05-05
CN1500907A (zh) 2004-06-02
PL204234B1 (pl) 2009-12-31
US20040094283A1 (en) 2004-05-20
DE50303674D1 (de) 2006-07-20
EP1447458A2 (de) 2004-08-18
EP1447458B1 (de) 2006-06-07

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LAPS Decisions on the lapse of the protection rights

Effective date: 20101112