PL3558581T3 - Sposób obróbki płytki skrawającej oraz odpowiednie urządzenie do obróbki płytki skrawającej - Google Patents

Sposób obróbki płytki skrawającej oraz odpowiednie urządzenie do obróbki płytki skrawającej

Info

Publication number
PL3558581T3
PL3558581T3 PL17811313.0T PL17811313T PL3558581T3 PL 3558581 T3 PL3558581 T3 PL 3558581T3 PL 17811313 T PL17811313 T PL 17811313T PL 3558581 T3 PL3558581 T3 PL 3558581T3
Authority
PL
Poland
Prior art keywords
machining
cutting insert
corresponding device
insert
cutting
Prior art date
Application number
PL17811313.0T
Other languages
English (en)
Inventor
Martin Reisacher
Peter Hildebrand
Original Assignee
Dmg Mori Ultrasonic Lasertec Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dmg Mori Ultrasonic Lasertec Gmbh filed Critical Dmg Mori Ultrasonic Lasertec Gmbh
Publication of PL3558581T3 publication Critical patent/PL3558581T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PL17811313.0T 2016-12-20 2017-12-08 Sposób obróbki płytki skrawającej oraz odpowiednie urządzenie do obróbki płytki skrawającej PL3558581T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016225602.5A DE102016225602B3 (de) 2016-12-20 2016-12-20 Verfahren zur Bearbeitung einer Schneidplatte sowie entsprechende Vorrichtung zur Bearbeitung einer Schneidplatte
PCT/EP2017/081997 WO2018114390A1 (de) 2016-12-20 2017-12-08 Verfahren zur bearbeitung einer schneidplatte sowie entsprechende vorrichtung zur bearbeitung einer schneidplatte

Publications (1)

Publication Number Publication Date
PL3558581T3 true PL3558581T3 (pl) 2023-10-09

Family

ID=60627651

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17811313.0T PL3558581T3 (pl) 2016-12-20 2017-12-08 Sposób obróbki płytki skrawającej oraz odpowiednie urządzenie do obróbki płytki skrawającej

Country Status (8)

Country Link
US (1) US11331748B2 (pl)
EP (1) EP3558581B1 (pl)
JP (1) JP6850904B2 (pl)
KR (1) KR102256559B1 (pl)
CN (1) CN110248765B (pl)
DE (1) DE102016225602B3 (pl)
PL (1) PL3558581T3 (pl)
WO (1) WO2018114390A1 (pl)

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EP3345723A1 (de) * 2017-01-10 2018-07-11 Ivoclar Vivadent AG Verfahren zur steuerung einer werkzeugmaschine
JP6570592B2 (ja) * 2017-09-29 2019-09-04 株式会社牧野フライス製作所 工作機械の機上測定方法および制御装置
US10835990B2 (en) * 2018-01-26 2020-11-17 Kennametal Inc. Cutting tools comprising ultrahard materials and methods of making the same
SG10201907808VA (en) * 2018-09-05 2020-04-29 Blm Spa Machine for the working of tubes provided with a device for detecting any slippage of the tube being worked
DE102018129329A1 (de) 2018-11-21 2020-05-28 Automotive Lighting Reutlingen Gmbh Verfahren zur Farbenlackabtragenden Laserbearbeitung eines lackierten Werkstücks
TWI809251B (zh) * 2019-03-08 2023-07-21 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
DE102019214939A1 (de) * 2019-09-27 2021-04-01 Carl Zeiss Microscopy Gmbh Verfahren zum Analysieren, Abbilden und/oder Bearbeiten eines Gebiets eines Objektsund Teilchenstrahlvorrichtung zum Ausführen des Verfahrens
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统
WO2022180775A1 (ja) * 2021-02-26 2022-09-01 国立大学法人名古屋工業大学 レーザ加工装置、厚さ検出方法および厚さ検出装置
JP7647304B2 (ja) * 2021-04-30 2025-03-18 村田機械株式会社 工具刃先成形装置及び工具刃先成形方法
JP7582051B2 (ja) * 2021-04-30 2024-11-13 村田機械株式会社 工具刃先成形装置及び工具刃先成形方法
JP7619152B2 (ja) * 2021-04-30 2025-01-22 村田機械株式会社 工具刃先成形装置及び工具刃先成形方法
CN114871597B (zh) * 2022-07-08 2022-09-16 广东国玉科技有限公司 复合膜层的切割方法以及切割系统
CN116393842A (zh) * 2023-05-26 2023-07-07 深圳铭创智能装备有限公司 一种曲面玻璃边缘膜切割装置及其使用方法

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JP2001053443A (ja) 1999-08-06 2001-02-23 Hitachi Ltd 電子回路基板の製造方法，電子回路基板の製造装置及び電子回路基板
JP3643104B2 (ja) * 2002-12-27 2005-04-27 住友重機械工業株式会社 レーザ加工装置における加工位置ずれ補正方法
DE202005011455U1 (de) * 2004-12-06 2005-10-27 Faurecia Innenraum Systeme Gmbh Vorrichtung zur Bearbeitung eines Werkstücks mit einem Laser
DE102004058868B4 (de) * 2004-12-06 2006-12-07 Faurecia Innenraum Systeme Gmbh Vorrichtung und Verfahren zur Bearbeitung eines Kraftfahrzeug-Innenverkleidungsteils
DE102005006107A1 (de) 2005-02-09 2006-08-17 Robot-Technology Gmbh Verfahren zum Bearbeiten eines Werkstücks und Roboterhand
US7638731B2 (en) 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
PL1834696T3 (pl) 2006-03-14 2013-08-30 Hoffmann La Roche Sposób wytwarzania wielowarstwowego elementu analitycznego
US8546717B2 (en) * 2009-09-17 2013-10-01 Sciaky, Inc. Electron beam layer manufacturing
DE102009044316B4 (de) 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
FR2954199B1 (fr) * 2009-12-22 2013-07-26 Commissariat Energie Atomique Procede d'ablation d'une surface en trois dimensions grace a un dispositif d'ablation laser, et dispositif de mise en oeuvre du procede
DE102010011508B4 (de) * 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
WO2012005816A2 (en) * 2010-06-30 2012-01-12 Resonetics Llc Precision laser ablation
DE102011078825B4 (de) * 2011-07-07 2018-07-19 Sauer Gmbh Lasertec Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks
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JP5364856B1 (ja) * 2013-02-27 2013-12-11 三菱重工業株式会社 加工装置、加工方法
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WO2016181359A1 (de) * 2015-05-13 2016-11-17 Bystronic Laser Ag Laserbearbeitungsvorrichtung

Also Published As

Publication number Publication date
DE102016225602B3 (de) 2018-05-09
CN110248765A (zh) 2019-09-17
US20190351504A1 (en) 2019-11-21
JP2020506065A (ja) 2020-02-27
KR102256559B1 (ko) 2021-05-26
US11331748B2 (en) 2022-05-17
KR20190111908A (ko) 2019-10-02
JP6850904B2 (ja) 2021-03-31
EP3558581A1 (de) 2019-10-30
CN110248765B (zh) 2021-12-14
EP3558581B1 (de) 2023-06-07
WO2018114390A1 (de) 2018-06-28

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