PL3544068T3 - Sposób wytwarzania mikrochłodnic termoelektrycznych - Google Patents

Sposób wytwarzania mikrochłodnic termoelektrycznych

Info

Publication number
PL3544068T3
PL3544068T3 PL19150957T PL19150957T PL3544068T3 PL 3544068 T3 PL3544068 T3 PL 3544068T3 PL 19150957 T PL19150957 T PL 19150957T PL 19150957 T PL19150957 T PL 19150957T PL 3544068 T3 PL3544068 T3 PL 3544068T3
Authority
PL
Poland
Prior art keywords
coolers
production
thermoelectric micro
thermoelectric
micro
Prior art date
Application number
PL19150957T
Other languages
English (en)
Inventor
Vasilii Sergeevich ANOSOV
Mikhail Petrovich VOLKOV
Alexander Aleksandrovich NAZARENKO
Denis Yevgenievich SUROV
Original Assignee
Rmt Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rmt Limited filed Critical Rmt Limited
Publication of PL3544068T3 publication Critical patent/PL3544068T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Connection of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Ceramic Products (AREA)
PL19150957T 2018-03-21 2019-01-09 Sposób wytwarzania mikrochłodnic termoelektrycznych PL3544068T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2018109990A RU2680675C1 (ru) 2018-03-21 2018-03-21 Способ изготовления термоэлектрических микроохладителей (варианты)
EP19150957.9A EP3544068B1 (en) 2018-03-21 2019-01-09 Method of production of thermoelectric micro-coolers

Publications (1)

Publication Number Publication Date
PL3544068T3 true PL3544068T3 (pl) 2021-03-08

Family

ID=65011893

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19150957T PL3544068T3 (pl) 2018-03-21 2019-01-09 Sposób wytwarzania mikrochłodnic termoelektrycznych

Country Status (12)

Country Link
US (1) US10991870B2 (pl)
EP (1) EP3544068B1 (pl)
JP (1) JP6776381B2 (pl)
KR (1) KR102170891B1 (pl)
CN (1) CN110299445B (pl)
CA (1) CA3030260C (pl)
DK (1) DK3544068T3 (pl)
ES (1) ES2820717T3 (pl)
PL (1) PL3544068T3 (pl)
RU (1) RU2680675C1 (pl)
TW (1) TWI683459B (pl)
WO (1) WO2019182473A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3114689B1 (fr) * 2020-09-29 2022-10-14 Commissariat Energie Atomique Procédé de fabrication de dispositif thermoélectrique par fabrication additive de peignes à contacter entre eux
CN113301782B (zh) * 2021-06-02 2022-04-19 苏州鸿凌达电子科技有限公司 一种智能超微型tec制冷模组的制备装置及其制造方法

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Also Published As

Publication number Publication date
CN110299445B (zh) 2023-04-18
CN110299445A (zh) 2019-10-01
RU2680675C1 (ru) 2019-02-25
CA3030260A1 (en) 2019-09-21
JP6776381B2 (ja) 2020-10-28
KR20190110932A (ko) 2019-10-01
ES2820717T3 (es) 2021-04-22
DK3544068T3 (da) 2020-09-28
EP3544068B1 (en) 2020-08-12
CA3030260C (en) 2022-01-11
JP2019169702A (ja) 2019-10-03
US20190296208A1 (en) 2019-09-26
WO2019182473A1 (ru) 2019-09-26
KR102170891B1 (ko) 2020-10-28
TW201941463A (zh) 2019-10-16
TWI683459B (zh) 2020-01-21
EP3544068A1 (en) 2019-09-25
US10991870B2 (en) 2021-04-27

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