PL3532233T3 - Dysza do lutowania falowego mająca automatycznie regulowaną szerokość gardzieli - Google Patents

Dysza do lutowania falowego mająca automatycznie regulowaną szerokość gardzieli

Info

Publication number
PL3532233T3
PL3532233T3 PL17768282T PL17768282T PL3532233T3 PL 3532233 T3 PL3532233 T3 PL 3532233T3 PL 17768282 T PL17768282 T PL 17768282T PL 17768282 T PL17768282 T PL 17768282T PL 3532233 T3 PL3532233 T3 PL 3532233T3
Authority
PL
Poland
Prior art keywords
wave soldering
automatic adjustable
throat width
soldering nozzle
adjustable throat
Prior art date
Application number
PL17768282T
Other languages
English (en)
Inventor
Jonathan M. Dautenhahn
Gregory Leo HUESTE
Original Assignee
Illinois Tool Works Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc. filed Critical Illinois Tool Works Inc.
Publication of PL3532233T3 publication Critical patent/PL3532233T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL17768282T 2016-10-26 2017-08-28 Dysza do lutowania falowego mająca automatycznie regulowaną szerokość gardzieli PL3532233T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/334,819 US10029326B2 (en) 2016-10-26 2016-10-26 Wave soldering nozzle having automatic adjustable throat width
PCT/US2017/048840 WO2018080627A1 (en) 2016-10-26 2017-08-28 Wave soldering nozzle having automatic adjustable throat width
EP17768282.0A EP3532233B1 (en) 2016-10-26 2017-08-28 Wave soldering nozzle having automatic adjustable throat width

Publications (1)

Publication Number Publication Date
PL3532233T3 true PL3532233T3 (pl) 2021-06-14

Family

ID=59887368

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17768282T PL3532233T3 (pl) 2016-10-26 2017-08-28 Dysza do lutowania falowego mająca automatycznie regulowaną szerokość gardzieli

Country Status (7)

Country Link
US (1) US10029326B2 (pl)
EP (1) EP3532233B1 (pl)
CN (1) CN109890548B (pl)
CA (1) CA3041473C (pl)
ES (1) ES2856148T3 (pl)
PL (1) PL3532233T3 (pl)
WO (1) WO2018080627A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508299B1 (ja) * 2017-11-29 2019-05-08 千住金属工業株式会社 噴流はんだ高さ確認治具及びその取り扱い方法
US10780516B2 (en) * 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3151592A (en) * 1963-05-20 1964-10-06 Howard W Wegener Sump and nozzle for soldering machines
US3604611A (en) * 1969-01-07 1971-09-14 Dee Electric Co Soldering apparatus
US3993235A (en) 1975-09-02 1976-11-23 Hollis Engineering, Inc. Differential pressure wave soldering system
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
US4824010A (en) * 1980-12-26 1989-04-25 Matsushita Electric Industrial Co., Ltd. Process and apparatus for soldering printed circuit boards
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
US4530457A (en) 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
US4666077A (en) * 1983-02-28 1987-05-19 Electrovert Solder pot for wave soldering machine
US4541358A (en) * 1983-11-28 1985-09-17 The Htc Corporation Method and apparatus for solder removal
USRE33197E (en) * 1985-05-03 1990-04-10 Electrover Limited Vibrator wave soldering
KR920008948B1 (ko) * 1987-02-12 1992-10-12 니혼 덴네쯔 게이기 가부시끼가이샤 프린트 기판의 납땜방법 및 그의 장치
US4886201A (en) 1988-06-09 1989-12-12 Electrovert Limited Solder wave nozzle construction
US5044542A (en) 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5121874A (en) * 1989-11-22 1992-06-16 Electrovert Ltd. Shield gas wave soldering
US5156324A (en) * 1992-03-17 1992-10-20 Electrovert Lgd Solder apparatus with dual hollow wave nozzles
US5568894A (en) * 1993-06-04 1996-10-29 Electrovert Ltd. Applying flux to a solder wave for wave soldering an element
US5630542A (en) * 1994-12-05 1997-05-20 Soltec B.V. Soldering apparatus with abrupt separation of solder streams
US5772101A (en) * 1995-08-07 1998-06-30 Ns Tekuno Co., Ltd. Wave soldering machine
US6415972B1 (en) 1999-06-02 2002-07-09 Speedline Technologies, Inc. Closed loop solder wave height control system
WO2001066296A1 (en) 2000-03-09 2001-09-13 Speedline Technologies, Inc. Apparatus and methods for wave soldering
JP2002080950A (ja) * 2000-09-07 2002-03-22 Senju Metal Ind Co Ltd ドロスから酸化物を分離する方法および噴流はんだ槽
TW511856U (en) * 2001-12-26 2002-11-21 Asustek Comp Inc Adjustable nozzle of tin oven
US20060186183A1 (en) 2005-02-18 2006-08-24 Speedline Technologies, Inc. Wave solder nozzle
DE102010027291A1 (de) * 2010-07-16 2012-01-19 Airbus Operations Gmbh Verfahren und Vorrichtung zum Rührreibschweissen
TWM454066U (zh) * 2013-01-25 2013-05-21 Inventec Corp 自動焊接設備
CN105033391A (zh) * 2013-08-06 2015-11-11 熊菊莲 一种波峰焊机
CN105555453B (zh) * 2013-09-18 2017-04-12 千住金属工业株式会社 喷流喷嘴以及喷流装置
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US9161459B2 (en) 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
US9370838B2 (en) * 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
CN204248166U (zh) * 2014-10-20 2015-04-08 深圳市联合超越电子设备有限公司 改良结构的波峰焊锡槽
JP5910784B1 (ja) * 2015-09-11 2016-04-27 千住金属工業株式会社 噴流ノズル及び噴流はんだ付け装置

Also Published As

Publication number Publication date
EP3532233A1 (en) 2019-09-04
CA3041473C (en) 2021-06-01
CN109890548B (zh) 2021-10-22
ES2856148T3 (es) 2021-09-27
CN109890548A (zh) 2019-06-14
US20180111211A1 (en) 2018-04-26
CA3041473A1 (en) 2018-05-03
EP3532233B1 (en) 2020-12-16
WO2018080627A1 (en) 2018-05-03
US10029326B2 (en) 2018-07-24

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