PL3354118T3 - Sposoby nakładania powłok polimerowych - Google Patents
Sposoby nakładania powłok polimerowychInfo
- Publication number
- PL3354118T3 PL3354118T3 PL16775611T PL16775611T PL3354118T3 PL 3354118 T3 PL3354118 T3 PL 3354118T3 PL 16775611 T PL16775611 T PL 16775611T PL 16775611 T PL16775611 T PL 16775611T PL 3354118 T3 PL3354118 T3 PL 3354118T3
- Authority
- PL
- Poland
- Prior art keywords
- polymer coatings
- methods
- depositing
- coatings
- polymer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/145—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Paints Or Removers (AREA)
- Formation Of Insulating Films (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15186771 | 2015-09-24 | ||
| EP16775611.3A EP3354118B1 (en) | 2015-09-24 | 2016-09-23 | Polymer coatings and methods for depositing polymer coatings |
| PCT/EP2016/072774 WO2017051019A1 (en) | 2015-09-24 | 2016-09-23 | Polymer coatings and methods for depositing polymer coatings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3354118T3 true PL3354118T3 (pl) | 2021-11-08 |
Family
ID=54199607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL16775611T PL3354118T3 (pl) | 2015-09-24 | 2016-09-23 | Sposoby nakładania powłok polimerowych |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US11419220B2 (pl) |
| EP (1) | EP3354118B1 (pl) |
| JP (1) | JP6810149B2 (pl) |
| KR (1) | KR102381614B1 (pl) |
| CN (1) | CN108141963B (pl) |
| CA (1) | CA2998688C (pl) |
| DK (1) | DK3354118T3 (pl) |
| ES (1) | ES2881976T3 (pl) |
| IL (1) | IL258321B (pl) |
| MY (1) | MY188421A (pl) |
| PL (1) | PL3354118T3 (pl) |
| PT (1) | PT3354118T (pl) |
| WO (1) | WO2017051019A1 (pl) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10351729B2 (en) * | 2016-03-03 | 2019-07-16 | Motorola Mobility Llc | Polysiloxane films and methods of making polysiloxane films |
| CN108933088B (zh) * | 2017-05-25 | 2020-05-29 | 上海稷以科技有限公司 | 一种封装的方法及封装结构 |
| EP4289520A3 (en) * | 2017-08-23 | 2024-03-13 | Molecular Plasma Group SA | Soft plasma polymerization process for a mechanically durable superhydrophobic nanostructured coating |
| CN109675775A (zh) * | 2017-10-18 | 2019-04-26 | 上海稷以科技有限公司 | 在物体表面形成保护层的方法及表面形成有保护层的产品 |
| JP2021520446A (ja) * | 2018-05-04 | 2021-08-19 | ジアンスゥ フェイバード ナノテクノロジー カンパニー リミテッドＪｉａｎｇｓｕ Ｆａｖｏｒｅｄ Ｎａｎｏｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． | ナノコーティングによる電気機器の保護方法 |
| PL3680029T3 (pl) | 2019-01-09 | 2023-07-24 | Europlasma Nv | Metoda polimeryzacji plazmowej do powlekania polimerowego substratu |
| DE102020119221A1 (de) | 2020-07-21 | 2022-01-27 | Plasmatreat Gmbh | Verfahren zur überwachten Plasmabehandlung einer Leiterplatte |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6479727A (en) | 1987-09-21 | 1989-03-24 | Matsushita Electric Ind Co Ltd | Production of liquid crystal display device |
| DE4216999C2 (de) * | 1992-05-22 | 1996-03-14 | Fraunhofer Ges Forschung | Verfahren zur Oberflächenbeschichtung von Silbergegenständen und nach diesem Verfahren hergestellte Schutzschicht |
| DE19824364A1 (de) | 1998-05-30 | 1999-12-02 | Bosch Gmbh Robert | Verfahren zum Aufbringen eines Verschleißschutz-Schichtsystems mit optischen Eigenschaften auf Oberflächen |
| GB0406049D0 (en) | 2004-03-18 | 2004-04-21 | Secr Defence | Surface coatings |
| JP2007021895A (ja) * | 2005-07-15 | 2007-02-01 | Dainippon Printing Co Ltd | バリア性フィルムおよびそれを使用した積層材 |
| US7791815B2 (en) * | 2007-03-13 | 2010-09-07 | Varioptic S.A. | Dielectric coatings for electrowetting applications |
| US8962097B1 (en) * | 2007-09-07 | 2015-02-24 | Edward Maxwell Yokley | Surface properties of polymeric materials with nanoscale functional coating |
| MX2011001775A (es) * | 2008-08-18 | 2011-06-20 | Semblant Global Ltd | Revestimiento de polimero de halo-hidrocarburo. |
| GB2462824A (en) * | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
| US8557712B1 (en) * | 2008-12-15 | 2013-10-15 | Novellus Systems, Inc. | PECVD flowable dielectric gap fill |
| GB2510213A (en) * | 2012-08-13 | 2014-07-30 | Europlasma Nv | Forming a protective polymer coating on a component |
| US10532548B2 (en) * | 2013-10-21 | 2020-01-14 | The North Face Apparel Corp. | Functional biomaterial coatings for textiles and other substrates |
| GB2539231B (en) * | 2015-06-10 | 2017-08-23 | Semblant Ltd | Coated electrical assembly |
-
2016
- 2016-09-23 DK DK16775611.3T patent/DK3354118T3/da active
- 2016-09-23 CN CN201680055649.0A patent/CN108141963B/zh active Active
- 2016-09-23 WO PCT/EP2016/072774 patent/WO2017051019A1/en active Application Filing
- 2016-09-23 EP EP16775611.3A patent/EP3354118B1/en active Active
- 2016-09-23 PT PT167756113T patent/PT3354118T/pt unknown
- 2016-09-23 JP JP2018535239A patent/JP6810149B2/ja active Active
- 2016-09-23 PL PL16775611T patent/PL3354118T3/pl unknown
- 2016-09-23 MY MYPI2018701009A patent/MY188421A/en unknown
- 2016-09-23 US US15/762,270 patent/US11419220B2/en active Active
- 2016-09-23 ES ES16775611T patent/ES2881976T3/es active Active
- 2016-09-23 CA CA2998688A patent/CA2998688C/en active Active
- 2016-09-23 KR KR1020187010522A patent/KR102381614B1/ko active IP Right Grant
-
2018
- 2018-03-22 IL IL258321A patent/IL258321B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PT3354118T (pt) | 2021-09-02 |
| CN108141963A (zh) | 2018-06-08 |
| CA2998688C (en) | 2022-11-08 |
| US20180279483A1 (en) | 2018-09-27 |
| IL258321A (en) | 2018-05-31 |
| KR102381614B1 (ko) | 2022-03-31 |
| ES2881976T3 (es) | 2021-11-30 |
| DK3354118T3 (da) | 2021-08-23 |
| CN108141963B (zh) | 2020-11-06 |
| KR20180058740A (ko) | 2018-06-01 |
| CA2998688A1 (en) | 2017-03-30 |
| EP3354118A1 (en) | 2018-08-01 |
| MY188421A (en) | 2021-12-08 |
| WO2017051019A1 (en) | 2017-03-30 |
| IL258321B (en) | 2021-10-31 |
| US11419220B2 (en) | 2022-08-16 |
| EP3354118B1 (en) | 2021-06-02 |
| JP2018537595A (ja) | 2018-12-20 |
| JP6810149B2 (ja) | 2021-01-06 |
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