PL3172734T3 - Materiał interfejsu termicznego z dyspersjami cząstek o mieszanym współczynniku kształtu - Google Patents

Materiał interfejsu termicznego z dyspersjami cząstek o mieszanym współczynniku kształtu

Info

Publication number
PL3172734T3
PL3172734T3 PL15818517T PL15818517T PL3172734T3 PL 3172734 T3 PL3172734 T3 PL 3172734T3 PL 15818517 T PL15818517 T PL 15818517T PL 15818517 T PL15818517 T PL 15818517T PL 3172734 T3 PL3172734 T3 PL 3172734T3
Authority
PL
Poland
Prior art keywords
aspect ratio
thermal interface
interface material
particle dispersions
ratio particle
Prior art date
Application number
PL15818517T
Other languages
English (en)
Inventor
John TIMMERMAN
Sanjay Misra
Original Assignee
Henkel IP & Holding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel IP & Holding GmbH filed Critical Henkel IP & Holding GmbH
Publication of PL3172734T3 publication Critical patent/PL3172734T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL15818517T 2014-07-11 2015-06-24 Materiał interfejsu termicznego z dyspersjami cząstek o mieszanym współczynniku kształtu PL3172734T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/328,834 US9611414B2 (en) 2014-07-11 2014-07-11 Thermal interface material with mixed aspect ratio particle dispersions
EP15818517.3A EP3172734B1 (en) 2014-07-11 2015-06-24 Thermal interface material with mixed aspect ratio particle dispersions
PCT/US2015/037336 WO2016007287A1 (en) 2014-07-11 2015-06-24 Thermal interface material with mixed aspect ratio particle dispersions

Publications (1)

Publication Number Publication Date
PL3172734T3 true PL3172734T3 (pl) 2021-07-05

Family

ID=55064681

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15818517T PL3172734T3 (pl) 2014-07-11 2015-06-24 Materiał interfejsu termicznego z dyspersjami cząstek o mieszanym współczynniku kształtu

Country Status (9)

Country Link
US (3) US9611414B2 (pl)
EP (1) EP3172734B1 (pl)
JP (1) JP6727187B2 (pl)
KR (1) KR102496868B1 (pl)
CN (1) CN106663473A (pl)
ES (1) ES2856408T3 (pl)
PL (1) PL3172734T3 (pl)
TW (1) TWI668261B (pl)
WO (1) WO2016007287A1 (pl)

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US11229147B2 (en) 2015-02-06 2022-01-18 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
DE102015118245A1 (de) * 2015-10-26 2017-04-27 Infineon Technologies Austria Ag Thermisches Schnittstellenmaterial mit definierten thermischen, mechanischen und elektrischen Eigenschaften
WO2018111921A1 (en) 2016-12-12 2018-06-21 Energous Corporation Methods of selectively activating antenna zones of a near-field charging pad to maximize wireless power delivered
JP6886175B2 (ja) * 2017-03-08 2021-06-16 河合石灰工業株式会社 ポーラス生石灰およびその製造方法
JP7092676B2 (ja) * 2017-06-23 2022-06-28 積水化学工業株式会社 放熱シート、放熱シートの製造方法及び積層体
GB2571791B (en) * 2018-03-09 2022-07-13 Graphitene Ltd Heat-sink formulation and method of manufacture thereof
FR3084202B1 (fr) * 2018-07-20 2020-10-23 Inst Supergrid Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication
WO2020131188A2 (en) * 2018-09-27 2020-06-25 Henkel IP & Holding GmbH Abrasion-resistant coatings for thermal interfaces
CN109651799A (zh) * 2018-12-19 2019-04-19 航天科工武汉磁电有限责任公司 吸波贴片、其制备方法及其应用
CN114731061A (zh) 2019-09-20 2022-07-08 艾诺格思公司 使用无线功率发射系统中的功率放大器控制器集成电路来分类和检测异物
JP2021051905A (ja) * 2019-09-25 2021-04-01 富士高分子工業株式会社 シーリング材用熱伝導シート及びこれを組み込んだ発熱性電気・電子部品
JP2023536573A (ja) * 2020-07-28 2023-08-28 スリーエム イノベイティブ プロパティズ カンパニー 熱充填剤粒子、熱伝導性組成物、及びそれらを含むアセンブリ
KR102542423B1 (ko) 2020-09-23 2023-06-12 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체
EP4269486A1 (en) * 2021-12-22 2023-11-01 Korea Institute of Ceramic Engineering and Technology Heat dissipation material, composition including same, and preparation method therefor

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US6114429A (en) 1997-08-06 2000-09-05 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
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Also Published As

Publication number Publication date
ES2856408T3 (es) 2021-09-27
JP6727187B2 (ja) 2020-07-22
TWI668261B (zh) 2019-08-11
US20160009975A1 (en) 2016-01-14
KR102496868B1 (ko) 2023-02-07
US9611414B2 (en) 2017-04-04
TW201615716A (zh) 2016-05-01
EP3172734B1 (en) 2021-01-20
JP2017519888A (ja) 2017-07-20
KR20170032278A (ko) 2017-03-22
US20170158936A1 (en) 2017-06-08
EP3172734A1 (en) 2017-05-31
US11447677B2 (en) 2022-09-20
US20190322918A1 (en) 2019-10-24
WO2016007287A1 (en) 2016-01-14
CN106663473A (zh) 2017-05-10
EP3172734A4 (en) 2018-05-09

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