PL2994263T3 - Sposób wiercenia laserowego i urządzenie ze zmianami promieniowania wyjściowego w kierunku promieniowym podczas wiercenia przedmiotu obrabianego - Google Patents

Sposób wiercenia laserowego i urządzenie ze zmianami promieniowania wyjściowego w kierunku promieniowym podczas wiercenia przedmiotu obrabianego

Info

Publication number
PL2994263T3
PL2994263T3 PL14727050T PL14727050T PL2994263T3 PL 2994263 T3 PL2994263 T3 PL 2994263T3 PL 14727050 T PL14727050 T PL 14727050T PL 14727050 T PL14727050 T PL 14727050T PL 2994263 T3 PL2994263 T3 PL 2994263T3
Authority
PL
Poland
Prior art keywords
workpiece
radial direction
direction during
output changes
radiation output
Prior art date
Application number
PL14727050T
Other languages
English (en)
Inventor
Mitsutaka Yoshida
Natsuki Sugiyama
Akio Sato
Kenji Kidera
Masaru Setodoi
Taku Yamaguchi
Original Assignee
Toyota Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50841898&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2994263(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toyota Motor Co Ltd filed Critical Toyota Motor Co Ltd
Publication of PL2994263T3 publication Critical patent/PL2994263T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PL14727050T 2013-05-09 2014-05-06 Sposób wiercenia laserowego i urządzenie ze zmianami promieniowania wyjściowego w kierunku promieniowym podczas wiercenia przedmiotu obrabianego PL2994263T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013099147A JP5994723B2 (ja) 2013-05-09 2013-05-09 レーザ穴あけ加工方法および装置
PCT/IB2014/000742 WO2014181173A1 (en) 2013-05-09 2014-05-06 Laser drilling method and apparatus with radiation output changes in a radial direction during drilling of a workpiece
EP14727050.8A EP2994263B1 (en) 2013-05-09 2014-05-06 Laser drilling method and apparatus with radiation output changes in a radial direction during drilling of a workpiece

Publications (1)

Publication Number Publication Date
PL2994263T3 true PL2994263T3 (pl) 2017-12-29

Family

ID=50841898

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14727050T PL2994263T3 (pl) 2013-05-09 2014-05-06 Sposób wiercenia laserowego i urządzenie ze zmianami promieniowania wyjściowego w kierunku promieniowym podczas wiercenia przedmiotu obrabianego

Country Status (7)

Country Link
US (1) US10300559B2 (pl)
EP (1) EP2994263B1 (pl)
JP (1) JP5994723B2 (pl)
CN (1) CN105189018B (pl)
HU (1) HUE036304T2 (pl)
PL (1) PL2994263T3 (pl)
WO (1) WO2014181173A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6335590B2 (ja) * 2014-03-31 2018-05-30 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置及びレンズユニット
DE102016106067A1 (de) * 2016-04-04 2017-10-05 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Bearbeitungsmaschine zum schneidenden Bearbeiten von plattenförmigen oder stabförmigen Werkstücken
JP2018006509A (ja) * 2016-06-30 2018-01-11 三星ダイヤモンド工業株式会社 基板の加工方法及び加工装置
WO2018224868A1 (de) * 2017-06-09 2018-12-13 Bystronic Laser Ag Verfahren zur steuerung einer strahlschneidvorrichtung mit einem schneidwerkzeug, ein computerimplementiertes verfahren zum automatischen bestimmen und erzeugen von bewegungsbefehlen zum steuern eines schneidwerkzeugs einer strahlschneidvorrichtung, sowie strahlschneidvorrichtung zum ausführen der verfahren
DE112018005306T5 (de) * 2017-11-07 2020-06-18 Sumitomo Electric Sintered Alloy, Ltd. Sinterkörper auf Eisenbasis, Verfahren zur Laserbeschriftung desselben und Verfahren zur Herstellung desselben
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
EP3856448A4 (en) * 2018-09-28 2022-06-22 Synfuel Americas Corporation LASER CUTTING SYSTEM FOR CUTTING ARTICLES AND FORMING FILTRATION TUBES
CN110976439B (zh) * 2019-12-24 2020-10-20 中国科学院半导体研究所 提高激光清洗表面均匀程度的激光清洗方式和设备
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN114346456A (zh) * 2022-01-26 2022-04-15 扬昕科技(苏州)有限公司 导光板模仁的加工方法及导光板模仁的加工设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
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JPH0542337A (ja) 1991-08-08 1993-02-23 Amada Co Ltd レーザによる自由曲面成形方法
JPH10245711A (ja) 1997-02-27 1998-09-14 Idemitsu Petrochem Co Ltd 透明バイザー付きヘルメット
JP3800795B2 (ja) * 1998-02-23 2006-07-26 富士ゼロックス株式会社 レーザ加工条件自動設定方法およびレーザ加工条件自動設定装置
US6070813A (en) * 1998-08-11 2000-06-06 Caterpillar Inc. Laser drilled nozzle in a tip of a fuel injector
JP2000071086A (ja) 1998-08-31 2000-03-07 Yasuoka:Kk レーザ光による形状加工方法及び装置
US6501045B1 (en) * 2000-04-06 2002-12-31 Resonetics, Inc. Method and apparatus for controlling the taper angle of the walls of laser machined features
JP4320926B2 (ja) 2000-06-16 2009-08-26 パナソニック株式会社 レーザ穴加工方法及び装置
US6627844B2 (en) * 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
US7411150B2 (en) * 2002-06-12 2008-08-12 Alstom Technology Ltd. Method of producing a composite component
CN1323797C (zh) * 2002-07-25 2007-07-04 松下电器产业株式会社 喷墨喷嘴和用于喷墨喷嘴的激光钻孔工艺
US6749285B2 (en) 2002-07-25 2004-06-15 Matsushita Electric Industrial Co., Ltd. Method of milling repeatable exit holes in ink-jet nozzles
JP2004058118A (ja) * 2002-07-31 2004-02-26 Kyocera Corp セラミック基板の穿孔方法
JP2004243404A (ja) 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
JP4635839B2 (ja) * 2005-11-15 2011-02-23 トヨタ自動車株式会社 孔あけ加工方法および孔あけ加工装置
US20070148567A1 (en) * 2005-12-09 2007-06-28 Joerg Ferber Method and apparatus for laser-drilling an inkjet orifice in a substrate
JP2008254327A (ja) * 2007-04-05 2008-10-23 Sharp Corp レーザー加工方法、およびそれを用いたノズルプレート製造方法ならびにインクジェットヘッド
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JP5308431B2 (ja) * 2010-12-06 2013-10-09 三星ダイヤモンド工業株式会社 レーザ光によるライン加工方法およびレーザ加工装置
JP5772495B2 (ja) 2011-10-21 2015-09-02 トヨタ自動車株式会社 燃料噴射弁

Also Published As

Publication number Publication date
JP5994723B2 (ja) 2016-09-21
EP2994263A1 (en) 2016-03-16
CN105189018B (zh) 2017-03-22
US20160082549A1 (en) 2016-03-24
JP2014217860A (ja) 2014-11-20
HUE036304T2 (hu) 2018-06-28
CN105189018A (zh) 2015-12-23
EP2994263B1 (en) 2017-06-21
US10300559B2 (en) 2019-05-28
WO2014181173A1 (en) 2014-11-13

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