PL2465122T3 - Zespolona pojemność elektryczna i jej zastosowanie - Google Patents

Zespolona pojemność elektryczna i jej zastosowanie

Info

Publication number
PL2465122T3
PL2465122T3 PL10739377T PL10739377T PL2465122T3 PL 2465122 T3 PL2465122 T3 PL 2465122T3 PL 10739377 T PL10739377 T PL 10739377T PL 10739377 T PL10739377 T PL 10739377T PL 2465122 T3 PL2465122 T3 PL 2465122T3
Authority
PL
Poland
Prior art keywords
composite capacitance
capacitance
composite
Prior art date
Application number
PL10739377T
Other languages
English (en)
Inventor
Didier Cottet
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Publication of PL2465122T3 publication Critical patent/PL2465122T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Rectifiers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PL10739377T 2009-08-13 2010-08-09 Zespolona pojemność elektryczna i jej zastosowanie PL2465122T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09167796A EP2296156A1 (en) 2009-08-13 2009-08-13 Composite capacitance and use thereof
EP10739377.9A EP2465122B1 (en) 2009-08-13 2010-08-09 Composite capacitance and use thereof
PCT/EP2010/061565 WO2011018434A2 (en) 2009-08-13 2010-08-09 Composite capacitance and use thereof

Publications (1)

Publication Number Publication Date
PL2465122T3 true PL2465122T3 (pl) 2013-10-31

Family

ID=41362736

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10739377T PL2465122T3 (pl) 2009-08-13 2010-08-09 Zespolona pojemność elektryczna i jej zastosowanie

Country Status (9)

Country Link
US (1) US20120139483A1 (pl)
EP (2) EP2296156A1 (pl)
JP (1) JP5503003B2 (pl)
CN (1) CN102549688B (pl)
ES (1) ES2425630T3 (pl)
PL (1) PL2465122T3 (pl)
PT (1) PT2465122E (pl)
RU (1) RU2508574C2 (pl)
WO (1) WO2011018434A2 (pl)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5377575B2 (ja) 2011-05-31 2013-12-25 日産自動車株式会社 電力変換装置
JP5437312B2 (ja) 2011-05-31 2014-03-12 日産自動車株式会社 電力変換装置
JP5377573B2 (ja) * 2011-05-31 2013-12-25 日産自動車株式会社 電力変換装置
JP5437313B2 (ja) 2011-05-31 2014-03-12 日産自動車株式会社 電力変換装置
JP5377574B2 (ja) 2011-05-31 2013-12-25 日産自動車株式会社 電力変換装置
JP5437314B2 (ja) 2011-05-31 2014-03-12 日産自動車株式会社 電力変換装置
KR101425123B1 (ko) 2012-09-27 2014-08-05 삼화콘덴서공업주식회사 Ｄｃ-링크 커패시터 모듈
JP2014110721A (ja) * 2012-12-04 2014-06-12 Samsung Electronics Co Ltd 電力変換装置
US9740248B2 (en) * 2013-06-07 2017-08-22 Western Digital Technologies, Inc. Component placement within a solid state drive
CN103986309A (zh) * 2014-05-23 2014-08-13 台达电子企业管理（上海）有限公司 直流电容模块及其叠层母排结构
US9722510B2 (en) * 2014-06-03 2017-08-01 Cummins Power Generation Ip, Inc. Modular inverter platform providing physical and electrical configurability and scalability
JP6269437B2 (ja) * 2014-10-23 2018-01-31 トヨタ自動車株式会社 コンデンサモジュール
JP6609928B2 (ja) * 2015-01-28 2019-11-27 株式会社明電舎 コンデンサの取付構造及び電力変換装置
CN107979134A (zh) * 2015-06-01 2018-05-01 广东欧珀移动通信有限公司 充电电路和移动终端
US10084310B1 (en) * 2016-02-08 2018-09-25 National Technology & Engineering Solutions Of Sandia, Llc Low-inductance direct current power bus
EP3411891B1 (de) * 2016-03-21 2022-01-19 Siemens Energy Global GmbH & Co. KG Elektrische einrichtung mit kühlvorrichtung und akustischem dämpfungsmittel und elektrische anlage umfassend die elektrische einrichtung
DE102016106835B3 (de) * 2016-04-13 2017-06-29 Peter Fischer Busbar mit einer Mehrzahl von Filmkondensatoren
KR101809121B1 (ko) * 2016-05-11 2017-12-14 세향산업 주식회사 대전력 세라믹커패시터 패키징장치
CN108074742A (zh) * 2016-11-15 2018-05-25 天津三星电子有限公司 一种电解电容器
DE102016223256A1 (de) * 2016-11-24 2018-05-24 Robert Bosch Gmbh Kondensator, insbesondere Zwischenkreiskondensator für ein Mehrphasensystem
EP3480832B1 (en) 2017-11-07 2022-09-07 Rogers BV Electrical energy storage device and method for producing an electrical energy storage device
DE102018204382A1 (de) 2018-03-22 2019-09-26 Audi Ag Zwischenkreiskondensator für ein elektromotorisch angetriebenes Fahrzeug
FR3099632B1 (fr) * 2019-08-01 2022-12-30 Valeo Systemes De Controle Moteur Composant électronique comprenant au moins deux condensateurs
US10923287B1 (en) * 2019-08-06 2021-02-16 GM Global Technology Operations LLC Vascular cooled capacitor assembly and method
US11271492B2 (en) * 2020-07-27 2022-03-08 Virgina Tech Intellectual Properties, Inc. Medium voltage planar DC bus distributed capacitor array
US20240032198A1 (en) * 2022-07-21 2024-01-25 Rockwell Collins, Inc. Capacitor bank assembly

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912597A (en) * 1989-08-09 1990-03-27 Qualidyne Systems Assembly of electric impedance elements
JPH06176972A (ja) * 1992-12-02 1994-06-24 Matsushita Electric Ind Co Ltd ブロック型電気二重層コンデンサ
JPH0923079A (ja) * 1995-07-05 1997-01-21 Fuji Electric Co Ltd 電力変換装置
US5648892A (en) * 1995-09-29 1997-07-15 Allen-Bradley Company, Inc. Wireless circuit board system for a motor controller
JP3778383B2 (ja) * 1996-10-11 2006-05-24 本田技研工業株式会社 コンデンサ
JP2000060145A (ja) * 1998-08-17 2000-02-25 Ebara Densan Ltd 駆動装置
EP1033730B1 (en) * 1999-02-04 2008-06-11 Advanced Capacitor Technologies, Inc. Capacitor module, bank of such modules, and storehouse housing such banks
DE10062075A1 (de) * 2000-12-13 2002-06-27 Bosch Gmbh Robert Umrichter mit integrierten Zwischenkreiskondensatoren
US6541942B1 (en) * 2001-11-13 2003-04-01 Aerovironment, Inc. Capacitor tub assembly and method of cooling
US6631071B2 (en) * 2002-01-16 2003-10-07 Matsushita Electric Industrial Co., Ltd. Capacitor module
USD493423S1 (en) * 2002-11-29 2004-07-27 Honda Giken Kogyo Kabushiki Kaisha Capacitor module
TWI243388B (en) * 2004-01-16 2005-11-11 Ind Tech Res Inst Structure and method for a multi-electrode capacitor
RU2308111C2 (ru) * 2004-06-22 2007-10-10 Сергей Николаевич Разумов Батарея электрохимических конденсаторов и способ ее эксплуатации
JP2006287100A (ja) * 2005-04-04 2006-10-19 Shindengen Electric Mfg Co Ltd コンデンサモジュール
US7428136B2 (en) * 2005-08-06 2008-09-23 Geomat Insights, Llc Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
US8107241B2 (en) * 2006-03-31 2012-01-31 Mitsubishi Electric Corporation Electric power conversion apparatus including cooling units
JP2007281127A (ja) * 2006-04-05 2007-10-25 Shindengen Electric Mfg Co Ltd コンデンサを備える回路装置及びコンデンサモジュール
KR100905862B1 (ko) * 2007-02-26 2009-07-02 삼성전기주식회사 집적된 적층형 칩 커패시터 모듈 및 이를 구비하는 집적회로 장치
US7898818B2 (en) * 2007-03-07 2011-03-01 Dell Products, Lp Variably orientated capacitive elements for printed circuit boards and method of manufacturing same
US8351216B2 (en) * 2007-07-09 2013-01-08 Power Concepts Nz Limited Layered structure connection and assembly
US20090128993A1 (en) * 2007-11-21 2009-05-21 Industrial Technology Reaserch Institute Multi-tier capacitor structure, fabrication method thereof and semiconductor substrate employing the same
US8125766B2 (en) * 2008-06-13 2012-02-28 Kemet Electronics Corporation Concentrated capacitor assembly
US20100020470A1 (en) * 2008-07-25 2010-01-28 General Electric Company Systems, methods, and apparatuses for balancing capacitor load
DE102009053583B3 (de) * 2009-11-17 2011-03-31 Semikron Elektronik Gmbh & Co. Kg Modular aufgebaute Stromrichteranordnung

Also Published As

Publication number Publication date
EP2465122A2 (en) 2012-06-20
ES2425630T3 (es) 2013-10-16
EP2465122B1 (en) 2013-05-29
WO2011018434A3 (en) 2011-08-25
WO2011018434A2 (en) 2011-02-17
RU2012109406A (ru) 2013-09-20
US20120139483A1 (en) 2012-06-07
CN102549688A (zh) 2012-07-04
PT2465122E (pt) 2013-09-02
CN102549688B (zh) 2014-06-25
JP2013502198A (ja) 2013-01-17
JP5503003B2 (ja) 2014-05-28
EP2296156A1 (en) 2011-03-16
RU2508574C2 (ru) 2014-02-27

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