PL2242871T3 - Sposób elektrolitycznego rozpuszczania niklu do roztworów do bezprądowego powlekania niklem - Google Patents
Sposób elektrolitycznego rozpuszczania niklu do roztworów do bezprądowego powlekania niklemInfo
- Publication number
- PL2242871T3 PL2242871T3 PL09720501T PL09720501T PL2242871T3 PL 2242871 T3 PL2242871 T3 PL 2242871T3 PL 09720501 T PL09720501 T PL 09720501T PL 09720501 T PL09720501 T PL 09720501T PL 2242871 T3 PL2242871 T3 PL 2242871T3
- Authority
- PL
- Poland
- Prior art keywords
- plating solutions
- nickel
- electrolytically dissolving
- nickel plating
- electroless
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title 4
- 229910052759 nickel Inorganic materials 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/046,864 US8177956B2 (en) | 2008-03-12 | 2008-03-12 | Method of electrolytically dissolving nickel into electroless nickel plating solutions |
EP09720501.7A EP2242871B1 (en) | 2008-03-12 | 2009-01-30 | Method of electrolytically dissolving nickel into electroless nickel plating solutions |
PCT/US2009/032547 WO2009114217A1 (en) | 2008-03-12 | 2009-01-30 | Method of electrolytically dissolving nickel into electroless nickel plating solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2242871T3 true PL2242871T3 (pl) | 2018-06-29 |
Family
ID=41063336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL09720501T PL2242871T3 (pl) | 2008-03-12 | 2009-01-30 | Sposób elektrolitycznego rozpuszczania niklu do roztworów do bezprądowego powlekania niklem |
Country Status (8)
Country | Link |
---|---|
US (1) | US8177956B2 (pl) |
EP (1) | EP2242871B1 (pl) |
JP (1) | JP2011514936A (pl) |
CN (1) | CN101960046A (pl) |
ES (1) | ES2661519T3 (pl) |
PL (1) | PL2242871T3 (pl) |
TW (1) | TWI385275B (pl) |
WO (1) | WO2009114217A1 (pl) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050289672A1 (en) * | 2004-06-28 | 2005-12-29 | Cambia | Biological gene transfer system for eukaryotic cells |
US10006126B2 (en) * | 2014-10-27 | 2018-06-26 | Surface Technology, Inc. | Plating bath solutions |
JP6344269B2 (ja) * | 2015-03-06 | 2018-06-20 | 豊田合成株式会社 | めっき方法 |
CN106048638B (zh) * | 2016-06-23 | 2018-05-04 | 广东佳纳能源科技有限公司 | 一种小阴极周期反向电流电溶金属镍造液的方法 |
CN107675199A (zh) * | 2017-11-20 | 2018-02-09 | 中国科学院兰州化学物理研究所 | 一种电解法制备硫酸镍的工艺 |
JP6984540B2 (ja) * | 2018-05-23 | 2021-12-22 | トヨタ自動車株式会社 | 金属皮膜の成膜方法 |
EP4263726A1 (en) * | 2020-12-17 | 2023-10-25 | Coventya Inc. | Multilayer corrosion system |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3303111A (en) * | 1963-08-12 | 1967-02-07 | Arthur L Peach | Electro-electroless plating method |
JPS5893864A (ja) * | 1981-11-30 | 1983-06-03 | Nakamura Minoru | 無電解めつき方法 |
JPS58157959A (ja) * | 1982-03-13 | 1983-09-20 | Kanto Kasei Kogyo Kk | 無電解めつき浴の再生方法およびそれに使用する装置 |
JPH01119679A (ja) * | 1987-11-02 | 1989-05-11 | Nec Corp | 化学銅めっき液の管理方法 |
JPH01119678A (ja) * | 1987-11-02 | 1989-05-11 | Nec Corp | 化学銅めっき液の管理装置 |
US5419821A (en) | 1993-06-04 | 1995-05-30 | Vaughan; Daniel J. | Process and equipment for reforming and maintaining electroless metal baths |
JPH0741957A (ja) * | 1993-07-27 | 1995-02-10 | Taiyo Kagaku Kogyo Kk | 無電解銅メッキ液の再生方法 |
US5522972A (en) * | 1994-07-19 | 1996-06-04 | Learonal, Inc. | Nickel hypophosphite manufacture |
US5716512A (en) | 1995-05-10 | 1998-02-10 | Vaughan; Daniel J. | Method for manufacturing salts of metals |
US5944879A (en) | 1997-02-19 | 1999-08-31 | Elf Atochem North America, Inc. | Nickel hypophosphite solutions containing increased nickel concentration |
GB9722028D0 (en) | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
DE19849278C1 (de) | 1998-10-15 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrodialytischen Regenerieren eines stromlosen Metallabscheidebades |
US6406611B1 (en) | 1999-12-08 | 2002-06-18 | University Of Alabama In Huntsville | Nickel cobalt phosphorous low stress electroplating |
JP3455709B2 (ja) | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
DE10240350B4 (de) | 2002-08-28 | 2005-05-12 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum Regenerieren eines stromlosen Metallabscheidebades |
EP1726683B1 (de) * | 2005-05-25 | 2008-04-09 | Enthone Inc. | Verfahren und Vorrichtung zur Einstellung der Ionenkonzentration in Elektrolyten |
-
2008
- 2008-03-12 US US12/046,864 patent/US8177956B2/en not_active Expired - Fee Related
-
2009
- 2009-01-30 WO PCT/US2009/032547 patent/WO2009114217A1/en active Application Filing
- 2009-01-30 PL PL09720501T patent/PL2242871T3/pl unknown
- 2009-01-30 EP EP09720501.7A patent/EP2242871B1/en active Active
- 2009-01-30 CN CN2009801078424A patent/CN101960046A/zh active Pending
- 2009-01-30 ES ES09720501.7T patent/ES2661519T3/es active Active
- 2009-01-30 JP JP2010550712A patent/JP2011514936A/ja active Pending
- 2009-03-10 TW TW098107649A patent/TWI385275B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2242871A4 (en) | 2016-11-16 |
JP2011514936A (ja) | 2011-05-12 |
CN101960046A (zh) | 2011-01-26 |
US8177956B2 (en) | 2012-05-15 |
ES2661519T3 (es) | 2018-04-02 |
TWI385275B (zh) | 2013-02-11 |
US20090232999A1 (en) | 2009-09-17 |
WO2009114217A1 (en) | 2009-09-17 |
TW201002860A (en) | 2010-01-16 |
WO2009114217A8 (en) | 2009-11-19 |
EP2242871A1 (en) | 2010-10-27 |
EP2242871B1 (en) | 2017-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PL2242871T3 (pl) | Sposób elektrolitycznego rozpuszczania niklu do roztworów do bezprądowego powlekania niklem | |
EP2373831A4 (en) | SOLUTION FOR ELECTRICLESS PALLADIUM PLATTING AND APPLICATION METHOD | |
HK1112107A1 (en) | Method of forming electrolytically plated terminations | |
EP2016207A4 (en) | COATING SOLUTION FOR CURRENT FREE COPPER | |
TWI367960B (en) | Plating solutions for electroless deposition of copper | |
EP2330224A4 (en) | HIGH PURITY COPPER AND PROCESS FOR THE ELECTROLYTIC PRODUCTION OF HIGH PURITY COPPER | |
EP2346799A4 (en) | PROCESS FOR PRETREATMENT OF METATHESIS UNIT WITH OCTENE FORMATION | |
EP2370615A4 (en) | ELECTROPLATING METHOD AND ELECTROPLATED PRODUCT | |
EP1930472A4 (en) | BATHING FOR THE ELASTIC DECOMPOSITION OF PALLADIUM AND METHOD FOR ELECTRICALLY DEPOSITING PALLADIUM | |
EP1932943A4 (en) | SOLUTION FOR CHEMICAL NICKNESS | |
EP2772566A4 (en) | SOLUTION FOR THE POWERFUL REDUCTION OF SILVER PLATING AND METHOD FOR ELECTRICALLY REDUCING SILVER PLATING | |
EP2337873A4 (en) | MANUFACTURE OF NICKEL | |
EP2749673A4 (en) | SILVER PLATING AND MANUFACTURING METHOD THEREFOR | |
EP2300641A4 (en) | ALKALI ELECTROLYSIS UNIT | |
EP2336393A4 (en) | GALVANOPLASTY PROCESS | |
EP2356267A4 (en) | BATHS, SYSTEMS AND METHODS FOR ELECTROLYTIC DEPOSITION | |
EP2395131A4 (en) | BATH FOR THE SEPARATION OF SILVER-CONTAINING ALLOY AND METHOD FOR ELECTROLYTIC DEPOSITION USING THEREOF | |
EP2309025A4 (en) | OBJECT PLATED BY THIN FILM OF COPPER FORMED BY AUTOCATALYTIC DEPOSITION | |
EP2233612A4 (en) | ELECTROLYSIS PROCESS | |
EP2287365A4 (en) | GALVANIZING BATH FROM COPPER-ZINC ALLOY AND PLATING METHOD THEREWITH | |
EP2470692A4 (en) | LIGHT-CONTROLLED, CURRENT-FREE PLATING | |
EP2350355A4 (en) | TIN ALLOY GALVANIZATION BATHS AND METHOD | |
EP2511400A4 (en) | ELECTROLYTIC HARD GOLD PLATTING SOLUTION AND PLATING METHOD THEREWITH | |
EP2683853A4 (en) | PLATING BATH FOR HALF-GLOSSY NICKEL AND METHOD FOR USE THEREOF | |
EP2791388A4 (en) | SILVER PLATING FROM SILVER TO GRAPHITE |