PL200347A1 - Przyrzad polprzewodnikowy wysokonapieciowy - Google Patents

Przyrzad polprzewodnikowy wysokonapieciowy

Info

Publication number
PL200347A1
PL200347A1 PL20034777A PL20034777A PL200347A1 PL 200347 A1 PL200347 A1 PL 200347A1 PL 20034777 A PL20034777 A PL 20034777A PL 20034777 A PL20034777 A PL 20034777A PL 200347 A1 PL200347 A1 PL 200347A1
Authority
PL
Poland
Prior art keywords
voltage semiconductor
semiconductor
voltage
Prior art date
Application number
PL20034777A
Other languages
English (en)
Other versions
PL113661B1 (en
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of PL200347A1 publication Critical patent/PL200347A1/pl
Publication of PL113661B1 publication Critical patent/PL113661B1/pl

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/137Collector regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/104Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
PL1977200347A 1976-08-24 1977-08-18 High voltage semi-conductor instrument PL113661B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/717,335 US4047196A (en) 1976-08-24 1976-08-24 High voltage semiconductor device having a novel edge contour

Publications (2)

Publication Number Publication Date
PL200347A1 true PL200347A1 (pl) 1978-04-24
PL113661B1 PL113661B1 (en) 1980-12-31

Family

ID=24881597

Family Applications (1)

Application Number Title Priority Date Filing Date
PL1977200347A PL113661B1 (en) 1976-08-24 1977-08-18 High voltage semi-conductor instrument

Country Status (10)

Country Link
US (1) US4047196A (pl)
JP (1) JPS5327370A (pl)
AU (1) AU502694B2 (pl)
BR (1) BR7705488A (pl)
DE (1) DE2736342A1 (pl)
FR (1) FR2363196A1 (pl)
GB (1) GB1548796A (pl)
NL (1) NL7709281A (pl)
PL (1) PL113661B1 (pl)
SE (1) SE7708723L (pl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329707A (en) * 1978-09-15 1982-05-11 Westinghouse Electric Corp. Glass-sealed power thyristor
US4255757A (en) * 1978-12-05 1981-03-10 International Rectifier Corporation High reverse voltage semiconductor device with fast recovery time with central depression
JPS58173249U (ja) * 1982-05-12 1983-11-19 日本電気株式会社 高圧ダイオ−ド
GB2176338A (en) * 1985-06-06 1986-12-17 Marconi Electronic Devices Edge contouring in a semiconductor device
US4740477A (en) * 1985-10-04 1988-04-26 General Instrument Corporation Method for fabricating a rectifying P-N junction having improved breakdown voltage characteristics
US5166769A (en) * 1988-07-18 1992-11-24 General Instrument Corporation Passitvated mesa semiconductor and method for making same
JP3203192B2 (ja) * 1996-10-16 2001-08-27 三洋電機株式会社 半導体装置およびその製造方法
US5930660A (en) * 1997-10-17 1999-07-27 General Semiconductor, Inc. Method for fabricating diode with improved reverse energy characteristics
US6600204B2 (en) * 2001-07-11 2003-07-29 General Semiconductor, Inc. Low-voltage punch-through bi-directional transient-voltage suppression devices having surface breakdown protection and methods of making the same
JP2005515640A (ja) * 2002-01-15 2005-05-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング pn接合を備えた半導体構造物及び半導体構造物の製造方法
US20110084332A1 (en) * 2009-10-08 2011-04-14 Vishay General Semiconductor, Llc. Trench termination structure
JP6107430B2 (ja) * 2012-06-08 2017-04-05 豊田合成株式会社 半導体装置
DE102016124669B3 (de) * 2016-12-16 2018-05-17 Semikron Elektronik Gmbh & Co. Kg Thyristoren mit einem jeweiligen Halbleiterkörper
DE102018113573B4 (de) * 2018-06-07 2022-11-03 Semikron Elektronik Gmbh & Co. Kg Patentabteilung Diode mit einem Halbleiterkörper
FR3107988B1 (fr) * 2020-03-05 2023-11-10 St Microelectronics Tours Sas Formation d'un thyristor, triac ou diode de suppression de tensions transitoires

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3241010A (en) * 1962-03-23 1966-03-15 Texas Instruments Inc Semiconductor junction passivation
US3320496A (en) * 1963-11-26 1967-05-16 Int Rectifier Corp High voltage semiconductor device
US3514346A (en) * 1965-08-02 1970-05-26 Gen Electric Semiconductive devices having asymmetrically conductive junction
US3553539A (en) * 1967-11-22 1971-01-05 Matsushita Electronics Corp Microwave-oscillating device and the method of making same
US3535774A (en) * 1968-07-09 1970-10-27 Rca Corp Method of fabricating semiconductor devices
US3755720A (en) * 1972-09-25 1973-08-28 Rca Corp Glass encapsulated semiconductor device
JPS5218070B2 (pl) * 1972-10-04 1977-05-19
US3972113A (en) * 1973-05-14 1976-08-03 Mitsubishi Denki Kabushiki Kaisha Process of producing semiconductor devices
JPS5334624B2 (pl) * 1973-06-27 1978-09-21

Also Published As

Publication number Publication date
FR2363196A1 (fr) 1978-03-24
GB1548796A (en) 1979-07-18
AU2801477A (en) 1979-02-22
BR7705488A (pt) 1978-06-06
US4047196A (en) 1977-09-06
SE7708723L (sv) 1978-02-25
NL7709281A (nl) 1978-02-28
JPS5327370A (en) 1978-03-14
AU502694B2 (en) 1979-08-02
PL113661B1 (en) 1980-12-31
DE2736342A1 (de) 1978-03-02

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