AT377386B - Halbleiterbaueinheit - Google Patents

Halbleiterbaueinheit

Info

Publication number
AT377386B
AT377386B AT617777A AT617777A AT377386B AT 377386 B AT377386 B AT 377386B AT 617777 A AT617777 A AT 617777A AT 617777 A AT617777 A AT 617777A AT 377386 B AT377386 B AT 377386B
Authority
AT
Austria
Prior art keywords
semiconductor unit
semiconductor
unit
Prior art date
Application number
AT617777A
Other languages
English (en)
Other versions
ATA617777A (de
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of ATA617777A publication Critical patent/ATA617777A/de
Application granted granted Critical
Publication of AT377386B publication Critical patent/AT377386B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
AT617777A 1976-09-04 1977-08-25 Halbleiterbaueinheit AT377386B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762639979 DE2639979C3 (de) 1976-09-04 1976-09-04 Halbleiterbaueinheit

Publications (2)

Publication Number Publication Date
ATA617777A ATA617777A (de) 1984-07-15
AT377386B true AT377386B (de) 1985-03-11

Family

ID=5987203

Family Applications (1)

Application Number Title Priority Date Filing Date
AT617777A AT377386B (de) 1976-09-04 1977-08-25 Halbleiterbaueinheit

Country Status (6)

Country Link
JP (1) JPS5332673A (de)
AT (1) AT377386B (de)
CH (1) CH621435A5 (de)
DE (1) DE2639979C3 (de)
FR (1) FR2363893A1 (de)
GB (1) GB1584783A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
DE3915707A1 (de) * 1989-05-13 1990-11-22 Asea Brown Boveri Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse
DE3940933A1 (de) * 1989-12-12 1991-06-27 Eupec Gmbh & Co Kg Verfahren zur verformung von basisplatten
DE4305439A1 (de) * 1993-02-23 1994-08-25 Eldo Elektronik Service Gmbh Umkapselung für ein elektronisches Bauelement

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2805019C2 (de) * 1978-02-06 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Spannungsversorgungsgerät für Werkzeugmaschinenantriebe
DE2812699C2 (de) * 1978-03-23 1987-04-09 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichter in Brückenschaltung mit einseitig gekühlten Scheibenthyristoren
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
DE2829300C2 (de) * 1978-07-04 1988-07-28 Brown, Boveri & Cie Ag, 6800 Mannheim Umkehrstromrichter-Anordnung
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS56132760U (de) * 1980-03-06 1981-10-08
JPS5710959A (en) * 1980-06-23 1982-01-20 Mitsubishi Electric Corp Semiconductor device
FR2503526A1 (fr) * 1981-04-03 1982-10-08 Silicium Semiconducteur Ssc Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.
JPS5823469A (ja) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp 複合パワ−トランジスタ
DE3143339C2 (de) * 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS5968958A (ja) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ組立体
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
KR900003012Y1 (ko) * 1986-02-21 1990-04-10 아루프스 덴기 가부시끼가이샤 Rf 모듈레이터

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316672B2 (de) * 1971-09-16 1978-06-02

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
DE3915707A1 (de) * 1989-05-13 1990-11-22 Asea Brown Boveri Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse
DE3940933A1 (de) * 1989-12-12 1991-06-27 Eupec Gmbh & Co Kg Verfahren zur verformung von basisplatten
DE4305439A1 (de) * 1993-02-23 1994-08-25 Eldo Elektronik Service Gmbh Umkapselung für ein elektronisches Bauelement
DE4305439C2 (de) * 1993-02-23 1999-10-21 Eldo Elektronik Service Gmbh Umkapselung für einen elektronischen Sensor zur Feldstärkemessung

Also Published As

Publication number Publication date
GB1584783A (en) 1981-02-18
DE2639979B2 (de) 1979-08-23
DE2639979A1 (de) 1978-03-09
CH621435A5 (en) 1981-01-30
JPS5332673A (en) 1978-03-28
ATA617777A (de) 1984-07-15
DE2639979C3 (de) 1980-05-14
FR2363893A1 (fr) 1978-03-31

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Legal Events

Date Code Title Description
EFA Change in the company name
ELJ Ceased due to non-payment of the annual fee