JPS5332673A - Semiconductor constituting units - Google Patents

Semiconductor constituting units

Info

Publication number
JPS5332673A
JPS5332673A JP10426877A JP10426877A JPS5332673A JP S5332673 A JPS5332673 A JP S5332673A JP 10426877 A JP10426877 A JP 10426877A JP 10426877 A JP10426877 A JP 10426877A JP S5332673 A JPS5332673 A JP S5332673A
Authority
JP
Japan
Prior art keywords
semiconductor constituting
constituting units
units
semiconductor
constituting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10426877A
Other languages
Japanese (ja)
Inventor
Shiirutsu Buinfuriito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of JPS5332673A publication Critical patent/JPS5332673A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
JP10426877A 1976-09-04 1977-09-01 Semiconductor constituting units Pending JPS5332673A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762639979 DE2639979C3 (en) 1976-09-04 1976-09-04 Semiconductor module

Publications (1)

Publication Number Publication Date
JPS5332673A true JPS5332673A (en) 1978-03-28

Family

ID=5987203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10426877A Pending JPS5332673A (en) 1976-09-04 1977-09-01 Semiconductor constituting units

Country Status (6)

Country Link
JP (1) JPS5332673A (en)
AT (1) AT377386B (en)
CH (1) CH621435A5 (en)
DE (1) DE2639979C3 (en)
FR (1) FR2363893A1 (en)
GB (1) GB1584783A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56132760U (en) * 1980-03-06 1981-10-08
JPS5710959A (en) * 1980-06-23 1982-01-20 Mitsubishi Electric Corp Semiconductor device
JPS5823469A (en) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp Composite power transistor
JPS60153155A (en) * 1983-12-14 1985-08-12 シーメンス・アクチエンゲゼルシヤフト Power semiconductor device

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2805019C2 (en) * 1978-02-06 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Power supply device for machine tool drives
DE2812699A1 (en) * 1978-03-23 1979-09-27 Bbc Brown Boveri & Cie ARRANGEMENT OF DISC THYRISTORS IN THERMAL AND ELECTRICAL CONTACT ON HEAT SINK
DE2819327C2 (en) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor module
DE2829300C2 (en) * 1978-07-04 1988-07-28 Brown, Boveri & Cie Ag, 6800 Mannheim Inverter converter arrangement
DE3005313C2 (en) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
FR2503526A1 (en) * 1981-04-03 1982-10-08 Silicium Semiconducteur Ssc PACKAGE AND METHOD FOR MOUNTING AND INTERCONNECTING MEDIUM POWER SEMICONDUCTOR COMPONENTS IN A SINGLE PACKAGE.
DE3143339A1 (en) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
JPS5968958A (en) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp Gate turn-off thyristor assembled body
KR900003012Y1 (en) * 1986-02-21 1990-04-10 아루프스 덴기 가부시끼가이샤 Rf modulator
DE3837920A1 (en) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh SEMICONDUCTOR ELEMENT
DE3915707A1 (en) * 1989-05-13 1990-11-22 Asea Brown Boveri PLASTIC HOUSING AND PERFORMANCE SEMICONDUCTOR MODULE WITH THIS HOUSING
DE3940933C2 (en) * 1989-12-12 1996-08-01 Eupec Gmbh & Co Kg Method for deforming a base plate for semiconductor modules and device for carrying out the method
DE4305439C2 (en) * 1993-02-23 1999-10-21 Eldo Elektronik Service Gmbh Encapsulation for an electronic sensor for field strength measurement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838072A (en) * 1971-09-16 1973-06-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838072A (en) * 1971-09-16 1973-06-05

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56132760U (en) * 1980-03-06 1981-10-08
JPS5710959A (en) * 1980-06-23 1982-01-20 Mitsubishi Electric Corp Semiconductor device
JPS5823469A (en) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp Composite power transistor
JPS60153155A (en) * 1983-12-14 1985-08-12 シーメンス・アクチエンゲゼルシヤフト Power semiconductor device
JPH0345902B2 (en) * 1983-12-14 1991-07-12 Siemens Ag

Also Published As

Publication number Publication date
AT377386B (en) 1985-03-11
GB1584783A (en) 1981-02-18
DE2639979C3 (en) 1980-05-14
FR2363893A1 (en) 1978-03-31
DE2639979A1 (en) 1978-03-09
ATA617777A (en) 1984-07-15
CH621435A5 (en) 1981-01-30
DE2639979B2 (en) 1979-08-23

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