PH30641A - Opto-electronic coupler having improved moisture protective housing - Google Patents

Opto-electronic coupler having improved moisture protective housing

Info

Publication number
PH30641A
PH30641A PH44363A PH44363A PH30641A PH 30641 A PH30641 A PH 30641A PH 44363 A PH44363 A PH 44363A PH 44363 A PH44363 A PH 44363A PH 30641 A PH30641 A PH 30641A
Authority
PH
Philippines
Prior art keywords
opto
protective housing
improved moisture
moisture protective
electronic coupler
Prior art date
Application number
PH44363A
Other languages
English (en)
Inventor
Jacob Wijdenes
Antonius L M Gieben
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of PH30641A publication Critical patent/PH30641A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PH44363A 1991-05-17 1992-05-18 Opto-electronic coupler having improved moisture protective housing PH30641A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP91201193 1991-05-17

Publications (1)

Publication Number Publication Date
PH30641A true PH30641A (en) 1997-09-16

Family

ID=8207657

Family Applications (1)

Application Number Title Priority Date Filing Date
PH44363A PH30641A (en) 1991-05-17 1992-05-18 Opto-electronic coupler having improved moisture protective housing

Country Status (5)

Country Link
US (1) US5329131A (fr)
EP (1) EP0513908B1 (fr)
JP (1) JP3152500B2 (fr)
DE (1) DE69201161T2 (fr)
PH (1) PH30641A (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4327133B4 (de) * 1993-08-12 2006-07-13 Vishay Europe Gmbh Verfahren zum Aufbringen eines optischen Koppelmediums
JPH07333055A (ja) * 1994-06-03 1995-12-22 Matsushita Electric Ind Co Ltd 光検出器
US5489800A (en) * 1994-08-31 1996-02-06 Motorola, Inc. Dual channel small outline optocoupler package and method thereof
US5614131A (en) * 1995-05-01 1997-03-25 Motorola, Inc. Method of making an optoelectronic device
EP0851414A3 (fr) * 1996-12-26 2000-09-27 Sanyo Electric Co. Ltd Tête de lecture optique et lecteur de supports d'enregistrement
US5828074A (en) * 1997-05-19 1998-10-27 Mini-Systems, Inc. Optoisolator comprising walls having photosensitive inner surfaces
US6943378B2 (en) * 2003-08-14 2005-09-13 Agilent Technologies, Inc. Opto-coupler
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
US8577190B2 (en) * 2010-03-23 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler
US8571360B2 (en) * 2010-03-23 2013-10-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler with light guide defining element
US8412006B2 (en) * 2010-03-23 2013-04-02 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optocoupler
CN102736189A (zh) * 2011-04-01 2012-10-17 亿广科技(上海)有限公司 光耦合器
TW201334240A (zh) * 2012-02-08 2013-08-16 Lextar Electronics Corp 半導體發光元件之封裝結構
JP2013179226A (ja) * 2012-02-29 2013-09-09 Toshiba Corp 光結合装置
US20140119691A1 (en) * 2012-10-29 2014-05-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-coupler with light guide
JP6445947B2 (ja) * 2015-09-04 2018-12-26 株式会社東芝 光結合装置
TWI680321B (zh) * 2018-12-24 2019-12-21 兆龍國際股份有限公司 光耦合器
US20220157681A1 (en) * 2020-11-17 2022-05-19 Stmicroelectronics Sdn Bhd Integrated circuit package with v-shaped notch creepage structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179619A (en) * 1977-12-02 1979-12-18 General Electric Company Optocoupler having internal reflection and improved isolation capabilities
DE2806167C2 (de) * 1978-02-14 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Hochspannungsfester Optokoppler
JPS55154785A (en) * 1979-05-22 1980-12-02 Nec Corp Photo coupling device
JPS5915502B2 (ja) * 1980-10-09 1984-04-10 株式会社東芝 光結合半導体装置
JPS57132377A (en) * 1981-02-09 1982-08-16 Kyoto Semi Kondakutaa Kk Photocoupler
US4645551A (en) * 1984-08-31 1987-02-24 Motorola, Inc. Method of making an octocoupler
JPS6195581A (ja) * 1984-10-16 1986-05-14 Toshiba Corp 光結合素子
JPS61228681A (ja) * 1985-04-01 1986-10-11 Sharp Corp 光結合半導体装置
US5148243A (en) * 1985-06-25 1992-09-15 Hewlett-Packard Company Optical isolator with encapsulation
US4694183A (en) * 1985-06-25 1987-09-15 Hewlett-Packard Company Optical isolator fabricated upon a lead frame
DE3633251A1 (de) * 1986-09-30 1988-03-31 Siemens Ag Optoelektronisches koppelelement
DE3633181C2 (de) * 1986-09-30 1998-12-10 Siemens Ag Reflexlichtschranke
US4980568A (en) * 1989-05-22 1990-12-25 Hewlett-Packard Company Optical isolator having high voltage isolation and high light flux light guide

Also Published As

Publication number Publication date
EP0513908A3 (en) 1993-03-17
EP0513908A2 (fr) 1992-11-19
JP3152500B2 (ja) 2001-04-03
DE69201161T2 (de) 1995-08-24
JPH05145111A (ja) 1993-06-11
DE69201161D1 (de) 1995-02-23
EP0513908B1 (fr) 1995-01-11
US5329131A (en) 1994-07-12

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