PH23902A - Polymer compositions containing a dissolved dibenzalacetone palladium complex - Google Patents
Polymer compositions containing a dissolved dibenzalacetone palladium complexInfo
- Publication number
- PH23902A PH23902A PH34785A PH34785A PH23902A PH 23902 A PH23902 A PH 23902A PH 34785 A PH34785 A PH 34785A PH 34785 A PH34785 A PH 34785A PH 23902 A PH23902 A PH 23902A
- Authority
- PH
- Philippines
- Prior art keywords
- dibenzalacetone
- dissolved
- compositions containing
- polymer compositions
- palladium complex
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/145—Infrared
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Electric Cables (AREA)
- Paints Or Removers (AREA)
- Chemically Coating (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH34886 | 1986-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
PH23902A true PH23902A (en) | 1989-12-18 |
Family
ID=4184967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH34785A PH23902A (en) | 1986-01-30 | 1987-01-29 | Polymer compositions containing a dissolved dibenzalacetone palladium complex |
Country Status (5)
Country | Link |
---|---|
US (1) | US5045436A (fr) |
EP (1) | EP0233145B1 (fr) |
JP (1) | JPS62192584A (fr) |
DE (1) | DE3760813D1 (fr) |
PH (1) | PH23902A (fr) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5389496A (en) * | 1987-03-06 | 1995-02-14 | Rohm And Haas Company | Processes and compositions for electroless metallization |
US5030742A (en) * | 1988-12-16 | 1991-07-09 | Ciba-Geigy Corporation | Ultrathin layers of palladium(O) complexes |
AU635393B2 (en) * | 1989-12-21 | 1993-03-18 | Amesbury Group, Inc. | Catalytic, water-soluble polymeric films for metal coatings |
US5082734A (en) * | 1989-12-21 | 1992-01-21 | Monsanto Company | Catalytic, water-soluble polymeric films for metal coatings |
US5506091A (en) * | 1990-04-20 | 1996-04-09 | Nisshinbo Industries, Inc. | Photosensitive resin composition and method of forming conductive pattern |
US5310580A (en) * | 1992-04-27 | 1994-05-10 | International Business Machines Corporation | Electroless metal adhesion to organic dielectric material with phase separated morphology |
US5419954A (en) * | 1993-02-04 | 1995-05-30 | The Alpha Corporation | Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
WO2002059209A1 (fr) * | 2001-01-24 | 2002-08-01 | Toray Engineering Company,Limited | Solution de precurseur de resines polyimides, lamines pour composants electroniques fabriques a l'aide desdites solutions, et procede de production desdits lamines |
WO2004024323A1 (fr) * | 2002-09-13 | 2004-03-25 | Wako Pure Chemical Industries, Ltd. | Composition de catalyseur au palladium |
KR101178334B1 (ko) * | 2003-12-05 | 2012-08-29 | 컨덕티브 잉크젯 테크놀로지 리미티드 | 기판 상의 고체층 형성 방법 |
US8435603B2 (en) | 2003-12-05 | 2013-05-07 | Conductive Inkjet Technology Limited | Formation of solid layers on substrates |
DE102005015454B4 (de) * | 2005-04-04 | 2010-02-18 | Infineon Technologies Ag | Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip sowie Verfahren zur Herstellung desselben |
DE102005015455B4 (de) | 2005-04-04 | 2021-03-18 | Infineon Technologies Ag | Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie ein Verfahren zur Herstellung eines Kunststoffgehäuses |
DE102005037321B4 (de) * | 2005-08-04 | 2013-08-01 | Infineon Technologies Ag | Verfahren zur Herstellung von Halbleiterbauteilen mit Leiterbahnen zwischen Halbleiterchips und einem Schaltungsträger |
US8436197B2 (en) * | 2007-10-25 | 2013-05-07 | West Chester University Of Pennsylvania Of The State System Of Higher Education | Palladium complexes and polymerization and coupling processes thereof |
WO2020122819A1 (fr) * | 2018-12-14 | 2020-06-18 | Nanyang Technological University | Métallisation de structures imprimées tridimensionnelles |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900320A (en) * | 1971-09-30 | 1975-08-19 | Bell & Howell Co | Activation method for electroless plating |
US3950570A (en) * | 1974-05-02 | 1976-04-13 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
DE2451217C2 (de) * | 1974-10-29 | 1982-12-23 | Basf Ag, 6700 Ludwigshafen | Aktivierung von Substraten für die stromlose Metallisierung |
DE2451276C2 (de) * | 1974-10-29 | 1982-12-30 | Basf Ag, 6700 Ludwigshafen | Verfahren zur Herstellung starrer magnetischer Aufzeichnungsträger |
GB2085874B (en) * | 1980-09-04 | 1984-08-08 | Johnson Matthey Plc | Hydroformylation of olefins |
DD157989A3 (de) * | 1980-10-10 | 1982-12-22 | Lothar Gierth | Verfahren zur strukturierten chemisch-reduktiven metallabscheidung |
US4347232A (en) * | 1981-06-17 | 1982-08-31 | Fmc Corporation | Preparation of hydrogen peroxide from its elements |
DE3148280A1 (de) * | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
US4604303A (en) * | 1983-05-11 | 1986-08-05 | Nissan Chemical Industries, Ltd. | Polymer composition containing an organic metal complex and method for producing a metallized polymer from the polymer composition |
DE3326508A1 (de) * | 1983-07-22 | 1985-02-07 | Bayer Ag, 5090 Leverkusen | Verfahren zum aktivieren von substratoberflaechen fuer die direkte partielle metallisierung von traegermaterialien |
US4469714A (en) * | 1983-09-02 | 1984-09-04 | Okuno Chemical Industry Co., Ltd. | Composition for bonding electroconductive metal coating to electrically nonconductive material |
US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
-
1987
- 1987-01-26 DE DE8787810046T patent/DE3760813D1/de not_active Expired
- 1987-01-26 EP EP87810046A patent/EP0233145B1/fr not_active Expired
- 1987-01-29 PH PH34785A patent/PH23902A/en unknown
- 1987-01-30 JP JP62020351A patent/JPS62192584A/ja active Pending
-
1989
- 1989-03-03 US US07/319,884 patent/US5045436A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0233145A1 (fr) | 1987-08-19 |
US5045436A (en) | 1991-09-03 |
JPS62192584A (ja) | 1987-08-24 |
DE3760813D1 (en) | 1989-11-23 |
EP0233145B1 (fr) | 1989-10-18 |
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