PH20386A - Method of encapsulated electronic components by axtrusion of plastic material - Google Patents

Method of encapsulated electronic components by axtrusion of plastic material

Info

Publication number
PH20386A
PH20386A PH29769A PH29769A PH20386A PH 20386 A PH20386 A PH 20386A PH 29769 A PH29769 A PH 29769A PH 29769 A PH29769 A PH 29769A PH 20386 A PH20386 A PH 20386A
Authority
PH
Philippines
Prior art keywords
axtrusion
plastic material
electronic components
encapsulated electronic
encapsulated
Prior art date
Application number
PH29769A
Other languages
English (en)
Inventor
Sahakian Diran-Robert
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR8218253A external-priority patent/FR2535526B1/fr
Application filed by Philips Nv filed Critical Philips Nv
Publication of PH20386A publication Critical patent/PH20386A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PH29769A 1982-10-29 1983-10-28 Method of encapsulated electronic components by axtrusion of plastic material PH20386A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8218253A FR2535526B1 (fr) 1982-10-29 1982-10-29 Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
FR8310571A FR2549291B2 (fr) 1982-10-29 1983-06-27 Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques

Publications (1)

Publication Number Publication Date
PH20386A true PH20386A (en) 1986-12-08

Family

ID=26223131

Family Applications (1)

Application Number Title Priority Date Filing Date
PH29769A PH20386A (en) 1982-10-29 1983-10-28 Method of encapsulated electronic components by axtrusion of plastic material

Country Status (6)

Country Link
US (1) US4540533A (ko)
EP (1) EP0110447B1 (ko)
KR (1) KR900007902B1 (ko)
DE (1) DE3368891D1 (ko)
FR (1) FR2549291B2 (ko)
PH (1) PH20386A (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63501121A (ja) * 1985-08-15 1988-04-28 アムジエン 酵母細胞からｂ型肝炎表面抗原を抽出するための細胞溶解法および緩衝液
US4952342A (en) * 1987-07-02 1990-08-28 Loctite Corproration Dual cure method for making a rotted electrical/mechanical device
US5057348A (en) * 1985-11-26 1991-10-15 Loctite Corporation Potted electrical/mechanical devices, and dual cure potting method
US4721453A (en) * 1986-03-05 1988-01-26 Gte Communication Systems Corporation Apparatus for encapsulating semiconductors
DE3785039T2 (de) * 1986-07-07 1993-10-07 Loctite Corp Eingekapselte elektrische oder mechanische geräte und vergussverfahren mit zweifach-härtung.
GB8618285D0 (en) * 1986-07-26 1986-09-03 Fusion Plastics Ltd Electroweldable sockets
EP0290697A3 (en) * 1987-05-12 1989-03-15 Shen-Yuan Chen Light emitting diodes (led) lamp and its quick manufacturing method
US5101264A (en) * 1988-03-31 1992-03-31 Mitsui Petrochemical Ind. Light-emitting or receiving device with smooth and hard encapsulant resin
JPH03116857A (ja) * 1989-09-29 1991-05-17 Mitsui Petrochem Ind Ltd 発光または受光装置
GB2284306B (en) * 1991-03-13 1995-10-11 Standard Products Co Electroluminescent light strip
US5391346A (en) * 1991-11-20 1995-02-21 Rohm Co., Ltd. Method for making molded photointerrupters
US5940986A (en) * 1997-05-16 1999-08-24 White Consolidated Industries, Inc. Heat staked moisture sensor electrodes
JP2005167092A (ja) * 2003-12-04 2005-06-23 Nitto Denko Corp 光半導体装置の製造方法
JP2005259847A (ja) * 2004-03-10 2005-09-22 Nitto Denko Corp 光半導体装置の製造方法
DE102008024551A1 (de) * 2008-05-21 2009-11-26 Tesa Se Verfahren zur Verkapselung von optoelektronischen Bauteilen
DE102012214488B4 (de) * 2012-08-14 2022-07-28 Osram Gmbh Herstellen eines bandförmigen Leuchtmoduls
DE102012214484A1 (de) * 2012-08-14 2014-02-20 Osram Gmbh Verfahren zum Herstellen eines bandförmigen Leuchtmoduls
DE102014104423B4 (de) * 2014-03-28 2016-01-14 Döllken-Weimar Gmbh LED-Band und Verfahren zur Herstellung eines LED-Bandes

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2513421A (en) * 1946-10-23 1950-07-04 A Responsabilite Societe Caste Process of manufacturing resistors
FR981373A (fr) * 1948-12-10 1951-05-25 Procédé de fabrication de profilés en matière plastique, appareil pour la mise en oeuvre de ce procédé et produit obtenu au moyen de cet appareil
US2963747A (en) * 1957-05-15 1960-12-13 Western Electric Co Method of plastic encapsulation using irradiation
GB960097A (en) * 1960-04-14 1964-06-10 Dubilier Condenser Co 1925 Ltd Improvements in or relating to the production of encapsulated electrical components
US3045199A (en) * 1960-12-12 1962-07-17 Stackpole Carbon Co Engine ignition system cable
AT253623B (de) * 1964-06-04 1967-04-10 Installationsmaterial Ab Anordnung zum Einhüllen eines streifenförmigen Bauteiles in eine keramische od. ähnl. Masse
DE1514418A1 (de) * 1965-03-18 1969-06-26 Siemens Ag Verfahren zum serienmaessigen Herstellen von Halbleiterbauelementen in Kunststoffgehaeusen nach dem Bandmontageprinzip
DE1614868A1 (de) * 1967-09-30 1970-12-23 Telefunken Patent Halbleiteranordnung
US3813199A (en) * 1971-03-23 1974-05-28 Ind Plastic Specialties Co Apparatus for producing trim strip assembly
US3869701A (en) * 1972-03-02 1975-03-04 Douglas G Waltz Plurality of electronic elements connected together by interconnecting wires and connecting joints
US3915780A (en) * 1973-08-02 1975-10-28 Texas Instruments Inc Extruded epoxy packaging system
US4148856A (en) * 1974-08-16 1979-04-10 Corning Glass Works Method for continuous component encapsulation
SE389991B (sv) * 1974-09-19 1976-11-29 Ericsson Telefon Ab L M Metod for kapsling av elektriska komponenter samt anordning herfor
US3937644A (en) * 1974-10-31 1976-02-10 Philip Morris Incorporated Apparatus for applying a backing of plastic material to a cutting blade
US4042654A (en) * 1975-03-13 1977-08-16 Eastman Kodak Company Manufacture of plastic parts by radiation molding
GB1545511A (en) * 1975-05-07 1979-05-10 Schlegel Uk Ltd Extruded edge protector trim strip
US4073835A (en) * 1976-01-30 1978-02-14 Toyo Ink Manufacturing Co., Ltd. Method of resin encapsulating electrical parts with UV curing of fire retardant resin
DE2830472C3 (de) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
US4321425A (en) * 1979-02-02 1982-03-23 Emmel Leroy L Lattice cable and composite dielectric transmission line and method of making same
US4294782A (en) * 1979-04-10 1981-10-13 Jerome Bauer Method for substantially instantaneous liquid molding of an article
US4330929A (en) * 1979-12-06 1982-05-25 Siemens Corporation Process for making an electrical component having a metallic casing with a conformable plastic coating
JPS6022620B2 (ja) * 1980-02-21 1985-06-03 積水樹脂株式会社 軟質外皮を有するバンドの製造方法

Also Published As

Publication number Publication date
DE3368891D1 (en) 1987-02-12
EP0110447B1 (fr) 1987-01-07
FR2549291A2 (fr) 1985-01-18
KR840006462A (ko) 1984-11-30
FR2549291B2 (fr) 1986-05-09
EP0110447A1 (fr) 1984-06-13
US4540533A (en) 1985-09-10
KR900007902B1 (ko) 1990-10-22

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