PH12019502478A1 - Electrolytic treatment assembly and surface treatment apparatus using same - Google Patents

Electrolytic treatment assembly and surface treatment apparatus using same

Info

Publication number
PH12019502478A1
PH12019502478A1 PH12019502478A PH12019502478A PH12019502478A1 PH 12019502478 A1 PH12019502478 A1 PH 12019502478A1 PH 12019502478 A PH12019502478 A PH 12019502478A PH 12019502478 A PH12019502478 A PH 12019502478A PH 12019502478 A1 PH12019502478 A1 PH 12019502478A1
Authority
PH
Philippines
Prior art keywords
positive electrode
surface treatment
nozzle
same
electrolytic treatment
Prior art date
Application number
PH12019502478A
Inventor
Katsumi Ishii
Shigeyuki Watanabe
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Publication of PH12019502478A1 publication Critical patent/PH12019502478A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

This electrolytic treatment assembly 100, which is fitted to a surface treatment tank 10 that performs an electrolytic treatment on the surface of a work 1 that is set on a negative electrode, comprises a nozzle unit 200 and a positive electrode unit 300 that is integrally connected with the nozzle unit. The nozzle unit comprises a plurality of nozzle pipes 210, a common pipe 220, and a pipe joint 230 which connects the common pipe to an external pipe. The positive electrode unit comprises a positive electrode box 320 and a power receiving part 330 which connects an insoluble positive electrode to an external power feeding part 40 that is set to the surface treatment tank. The positive electrode box comprises at least one insoluble positive electrode 310 which is arranged at a distance from the plurality of nozzle pipes in the horizontal direction, and a partition wall which is arranged at a distance from the insoluble positive electrode in the horizontal direction.
PH12019502478A 2017-09-20 2019-11-04 Electrolytic treatment assembly and surface treatment apparatus using same PH12019502478A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017180041 2017-09-20
PCT/JP2018/033749 WO2019059058A1 (en) 2017-09-20 2018-09-12 Electrolytic treatment assembly and surface treatment apparatus using same

Publications (1)

Publication Number Publication Date
PH12019502478A1 true PH12019502478A1 (en) 2020-07-20

Family

ID=65810719

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12019502478A PH12019502478A1 (en) 2017-09-20 2019-11-04 Electrolytic treatment assembly and surface treatment apparatus using same

Country Status (7)

Country Link
JP (1) JP6779547B2 (en)
KR (1) KR20200054134A (en)
CN (1) CN110753763A (en)
MY (1) MY194250A (en)
PH (1) PH12019502478A1 (en)
TW (1) TWI706060B (en)
WO (1) WO2019059058A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117779119A (en) * 2023-09-18 2024-03-29 赣州晨光稀土新材料有限公司 Electrolytic furnace for rare earth metal

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3352081B2 (en) 2001-02-01 2002-12-03 株式会社アスカエンジニアリング Printed circuit board copper plating equipment
JP2003013291A (en) * 2001-06-29 2003-01-15 Almex Inc Plating apparatus
JP5613499B2 (en) 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 Surface treatment equipment
KR101472637B1 (en) * 2012-12-27 2014-12-15 삼성전기주식회사 Electro Plating Cover Plate and Electro Plating Device having it
JP5785312B2 (en) * 2014-07-04 2015-09-30 アルメックスＰｅ株式会社 Surface treatment equipment
CN104862767B (en) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 Copper plating tank

Also Published As

Publication number Publication date
TW201925540A (en) 2019-07-01
TWI706060B (en) 2020-10-01
KR20200054134A (en) 2020-05-19
JPWO2019059058A1 (en) 2020-03-26
MY194250A (en) 2022-11-24
JP6779547B2 (en) 2020-11-04
WO2019059058A1 (en) 2019-03-28
CN110753763A (en) 2020-02-04

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