PH12020550789A1 - Surface treatment apparatus - Google Patents

Surface treatment apparatus

Info

Publication number
PH12020550789A1
PH12020550789A1 PH12020550789A PH12020550789A PH12020550789A1 PH 12020550789 A1 PH12020550789 A1 PH 12020550789A1 PH 12020550789 A PH12020550789 A PH 12020550789A PH 12020550789 A PH12020550789 A PH 12020550789A PH 12020550789 A1 PH12020550789 A1 PH 12020550789A1
Authority
PH
Philippines
Prior art keywords
treatment fluid
treatment
divided regions
surface treatment
treatment apparatus
Prior art date
Application number
PH12020550789A
Inventor
Katsumi Ishii
Shigeyuki Watanabe
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Publication of PH12020550789A1 publication Critical patent/PH12020550789A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Spray Control Apparatus (AREA)

Abstract

A surface treatment device (1) having: treatment tanks (3-1 - 3-n) that have arranged therein a plurality of nozzle tubes (60) that spray treatment fluid on to a plurality of workpieces (2) to be immersed in treatment fluid; and a plurality of treatment fluid circulation devices (100). Each of the plurality of treatment fluid circulation devices: is connected to a respective one of a plurality of divided regions (6), which divide the treatment tanks in the longitudinal direction thereof and each include at least one of the plurality of nozzle tubes; and adjusts the treatment fluid recovered from each of the divided regions (6) and returns and supplies the same to at least one nozzle tube provided in each of the divided regions (6).
PH12020550789A 2017-10-20 2020-04-15 Surface treatment apparatus PH12020550789A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017203868 2017-10-20
PCT/JP2018/037758 WO2019078065A1 (en) 2017-10-20 2018-10-10 Surface treatment device

Publications (1)

Publication Number Publication Date
PH12020550789A1 true PH12020550789A1 (en) 2021-04-12

Family

ID=66173938

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12020550789A PH12020550789A1 (en) 2017-10-20 2020-04-15 Surface treatment apparatus

Country Status (6)

Country Link
JP (1) JP6875758B2 (en)
KR (1) KR20200073243A (en)
CN (1) CN111247274A (en)
PH (1) PH12020550789A1 (en)
TW (1) TWI677599B (en)
WO (1) WO2019078065A1 (en)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3088562B2 (en) * 1992-04-09 2000-09-18 川崎製鉄株式会社 Circulation method of plating solution in electroplating
EP2017374A3 (en) * 2000-03-17 2011-04-27 Ebara Corporation Plating apparatus and method
JP2002212786A (en) * 2001-01-17 2002-07-31 Ebara Corp Substrate processor
JP2003013291A (en) * 2001-06-29 2003-01-15 Almex Inc Plating apparatus
JP3989864B2 (en) * 2003-03-20 2007-10-10 木田精工株式会社 Plating equipment and plating line for plating line
JP5650899B2 (en) * 2009-09-08 2015-01-07 上村工業株式会社 Electroplating equipment
JP5613499B2 (en) * 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 Surface treatment equipment
JP5795965B2 (en) * 2011-05-30 2015-10-14 株式会社荏原製作所 Plating equipment
JP5795514B2 (en) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 Continuous plating equipment
KR101472637B1 (en) * 2012-12-27 2014-12-15 삼성전기주식회사 Electro Plating Cover Plate and Electro Plating Device having it
JP2014237865A (en) * 2013-06-06 2014-12-18 株式会社荏原製作所 Electrolytic copper plating apparatus
CN104862767B (en) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 Copper plating tank
CN106637331A (en) * 2015-10-28 2017-05-10 东莞市希锐自动化科技股份有限公司 Flexible PCB electroplating copper cylinder with board feeding device and jet flow mechanism

Also Published As

Publication number Publication date
TWI677599B (en) 2019-11-21
TW201923165A (en) 2019-06-16
JP6875758B2 (en) 2021-05-26
JPWO2019078065A1 (en) 2020-08-06
WO2019078065A1 (en) 2019-04-25
KR20200073243A (en) 2020-06-23
CN111247274A (en) 2020-06-05

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