JPWO2019078065A1 - Surface treatment equipment - Google Patents

Abstract

The surface treatment apparatus (1) includes a treatment tank (3-1 to 3-n) in which a plurality of nozzle pipes (60) for ejecting the treatment liquid onto a plurality of works (2) immersed in the treatment liquid are arranged, And a plurality of processing liquid circulation devices (100). Each of the plurality of treatment liquid circulation devices is divided into a plurality in the longitudinal direction of the treatment tank, and each of the plurality of treatment liquid circulation devices is connected to each one of a plurality of division regions (6) including at least one of a plurality of nozzle pipes. The treatment liquid recovered from each one of (6) is adjusted and supplied back to at least one nozzle tube provided in each one of the divided regions (6).

Description

The present invention relates to a surface treatment apparatus such as a plating apparatus, and more particularly, to a processing solution circulation system for adjusting a processing solution recovered from a processing tank and returning it to the processing tank.

The plating apparatus contains a plating solution in the processing tank. Patent Document 1 discloses a plating apparatus in which an impurity removing unit including a pump and a filter is provided outside the plating tank. The plating solution is discharged from the bottom of the plating tank, and a clean plating solution without slime is circulated from the bottom of the plating tank back into the plating tank by the impurity removing means. Further, since the plating components such as copper oxide are consumed by plating the work, copper oxide is conventionally supplied from a part of a long plating tank.

JP, 2003-013291, A

In Patent Document 1, when a clean plating solution discharged from the bottom of the plating tank and having slime removed by the impurity removing means is circulated back from the bottom of the plating tank into the plating tank, a clean plating solution is produced in the plating tank. Not evenly distributed. Further, conventionally, the consumed copper oxide has been supplied from a part of a long plating tank, so that there is a problem that the concentration of the plating solution in the processing tank varies.

It is an object of at least one aspect of the present invention to provide a surface treatment apparatus that can make the concentration of a fresh treatment liquid substantially uniform in a treatment tank.

(1) One aspect of the present invention is
A treatment tank in which a plurality of nozzle tubes for ejecting the treatment liquid onto a plurality of works immersed in the treatment liquid are arranged;
A plurality of processing liquid circulation devices,
Have
Each of the plurality of processing liquid circulation devices is divided into a plurality in the longitudinal direction of the processing tank, and each of the plurality of processing liquid circulation devices is connected to each one of a plurality of divided regions including at least one of the plurality of nozzle tubes. The surface treatment apparatus which adjusts the processing liquid collected from each one of the divided areas and supplies the adjusted processing liquid back to the at least one nozzle tube provided in each one of the plurality of divided areas.

According to one aspect of the present invention, each of the plurality of processing liquid circulation devices adjusts the processing liquid collected from each one of the plurality of divided regions obtained by dividing the processing tank in the longitudinal direction, and the plurality of divided regions is provided. Can be supplied back to at least one nozzle tube provided in each of the above. Therefore, the concentration of the fresh processing liquid after the adjustment becomes substantially uniform among the plurality of divided areas. Moreover, since the fresh treatment liquid is jetted toward the workpiece from at least one nozzle pipe in each divided region of the treatment tank, the fresh treatment liquid is dispersed in each divided region and even in each divided region. The concentration of the treatment liquid becomes almost uniform. The divided area of the processing tank is not limited to a physically divided area, and may have a structure in which the processing liquid is recovered at least in each divided area.

(2) In one aspect (1) of the present invention, each of the plurality of processing liquid circulation devices is for re-supplying a processing liquid collected by the circulation pump from a circulation pump and one of the plurality of divided regions. An adjusting tank for adjusting the processing liquid, and the processing liquid for re-supply from the adjusting tank can be supplied back to the at least one nozzle pipe by the circulation pump. In this way, the processing liquid collected by the circulation pump can be collectively adjusted in the adjustment tank, and the processing liquid for re-supply from the adjustment tank can be returned and supplied to at least one nozzle tube by the circulation pump.

(3) In one aspect (2) of the present invention, the adjusting tank can carry out at least one of charging a consumed component and adjusting the temperature with respect to the recovered processing liquid. When the surface treatment is plating, for example, the consumed components are the plating components and additives in the treatment liquid. The plating component is, for example, copper oxide in the case of copper plating. The additive is, for example, a brightening agent or a leveling agent in the case of plating. Temperature adjustment is to adjust the temperature of the processing liquid to an optimum temperature unique to the surface treatment. By adjusting any of them, the recovered treatment liquid is adjusted to a fresh re-supply treatment liquid. For example, the concentration of a plating component, an additive, or the like in the recovered treatment liquid, or the temperature of the treatment liquid may be monitored by a sensor, and the concentration or temperature may be adjusted when the value deviates from an appropriate value.

(4) In one aspect (2) of the present invention, the treatment liquid in the treatment tank is discharged and collected from the bottom side of the treatment tank, and each of the plurality of treatment liquid circulation devices is provided in the adjustment tank. It may further have a filter for filtering the above-mentioned resupply treatment liquid. Impurities such as dust with a high specific gravity mixed in the treatment liquid in the treatment tank accumulate at the bottom of the treatment tank. These impurities can be collected together with the processing liquid discharged from the bottom side of the processing tank and removed by a filter.

(5) In one aspect (4) of the present invention, an overflow tank may be further provided adjacent to the processing tank, and the processing liquid in the processing tank may be discharged and recovered through the overflow tank. Impurities with a low specific gravity mixed in the processing liquid in the processing tank float on the upper part of the processing liquid in the processing tank. These impurities are discharged and collected through the overflow tank together with the processing liquid overflowed from the processing tank, and can be similarly removed by a filter.

(6) In one aspect (1) to (5) of the present invention, the surface treatment apparatus is formed by connecting a plurality of processing units in the longitudinal direction, and each of the plurality of processing units includes the processing liquid. Each of the plurality of processing liquid circulation devices may be connected to each of the divided processing tanks of the plurality of processing units, including a divided processing tank to be housed. As described above, when the surface treatment apparatus is configured by connecting a plurality of treatment units, a treatment liquid circulation device can be attached to each treatment unit. However, two or more processing liquid circulating devices may be attached to each processing unit.

It is a schematic sectional drawing of the plating process part in the plating apparatus of the intermittent conveyance system which concerns on embodiment of this invention. It is a schematic plan view of one processing unit of the plating apparatus shown in FIG. It is a figure which shows the positional relationship between the workpiece stopped in one processing unit, and an anode. It is a perspective view of a conveyance jig which conveys a work. It is a figure which shows typically the connection of the conductive part on an anode, a cathode rail, and a rectifier. 6A and 6B are a front view and a sectional view of the cathode rail. 3 is a plane showing a nozzle tube which is horizontally reciprocally moved in a cell. It is a figure which shows the arrangement pitch of the ejection port of a nozzle tube. It is a figure which shows typically the processing liquid circulation apparatus connected to a division processing tank.

Hereinafter, preferred embodiments of the present invention will be described in detail. Note that the present embodiment described below does not unreasonably limit the content of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not necessarily.

1. Multiple Processing Units FIG. 1 is a sectional view of a plating apparatus (a surface processing apparatus in a broad sense) according to this embodiment. In FIG. 1, the plating apparatus 1 is configured such that a plating processing section for plating a work 2 such as a circuit board is formed by connecting one or more processing units 3-1 to 3-n (n is a natural number). The plurality of processing units 3-1 to 3-n may have substantially the same structure. In each of the plurality of processing units 3-1 to 3-n, the work 2 may be continuously conveyed or the work 2 may be intermittently conveyed. When the intermittent transfer type plating apparatus 1 is used, at least one of each of the plurality of processing units 3-1 to 3-n, M (M is an integer of 2 or more) in FIG. 1, for example, M=4 workpieces. 2 can be stopped intermittently. FIG. 1 shows a work 2 of the maximum size, and the plating apparatus 1 has general versatility capable of processing the work 2 of the maximum size or less. The intermittent transfer type plating apparatus 1 will be described below as an example.

The work 2 is intermittently conveyed in the direction A from the current stop position to the next stop position by an intermittent transfer device such as a pusher. In the present embodiment, one work 2 is stopped in four places in each processing unit. The carry-in unit 4 into which the work 2 is carried in by the downward movement in the B direction may be connected to the upstream side of the most upstream processing unit 3-1. When the work 2 in the processing unit 3-1 is intermittently transported, the work 2 in the carry-in unit 4 is also intermittently transported and moved to the processing unit 3-1. A unloading unit 5 that raises the workpiece 2 horizontally moved from the processing unit 3-n in the C direction and unloads the workpiece 2 may be connected to the downstream side of the most downstream processing unit 3-n. Before the work 2 in the processing unit 3-n is intermittently transferred, the work 2 in the carry-out unit 5 is carried out upward. However, the carry-in unit 4 and/or the carry-out unit 5 may be omitted. In this case, the work 2 is lowered to the most upstream stop position of the processing unit 3-1 and the work 2 at the most downstream stop position of the processing unit 3-n is raised and carried out.

FIG. 2 is a plan view of the processing unit 3-1 having the same configuration as the processing units 3-2 to 3-n. The processing unit 3-1 has a divided processing tank 6 in which a plating solution (processing solution in a broad sense) is stored. The work 2 is immersed in the plating solution in the divided treatment tank 6. The division processing tank 6 is a substantially box-shaped body having an open upper side, and openings 6A and 6B are provided in the upstream and downstream partitions, respectively, and between adjacent units (processing unit, carry-in unit or carry-out unit). The work 2 is allowed to move horizontally.

In the present embodiment, at least one anode 20 is provided on at least one side of the front surface and the back surface of the workpiece 2 at a plurality of, for example, four stop positions in the processing unit 3-1. In the present embodiment, an anode 20A facing the front surface of each one work 2 at each stop position and an anode 20B facing the back surface of the work 2 are provided. Each of the anodes 20 (20A, 20B) may include a plurality of split anodes that are electrically connected to each other. In this embodiment, the split anode 20A1 (20B1) on the upstream side and the split anode 20A2 (20B2) on the downstream side are split. The anode 20 may include three or more divided anodes, but since they are electrically connected to each other, they can be regarded as one anode.

FIG. 3 is a front view showing the positional relationship between the anodes 20A1 and 20A2 (20B1 and 20B2) arranged in the processing unit 3-1 and the work 2. As shown in FIG. 3, the work 2 is held by the transfer jig 30. As shown in FIGS. 2 and 3, each of the anodes 20 (20A, 20B) is arranged at a position facing the work 2 at the four stop positions. In short, as shown in FIG. 2, it suffices if a uniform electric field can be formed between the work 2 set as the cathode and the anode 20. The anode 20 shown in FIGS. 2 and 3 has a rectangular outline regardless of the shape of the anode 20, but the outline in plan view may be circular. The anode may be an insoluble anode and a soluble anode.

In the present embodiment, it is possible to have the shielding plate 23 that partitions one processing unit 3-1 into four cells 11-1 to 11-4. In each of the cells 11-1 to 11-4, the anodes 20 (20A1, 20A2, 20B1, 20B2) are arranged on both sides of the work 2 in a plan view. The shield plate 23 is provided to shield the influence of the electric field (the electric field between the anode and the cathode shown by the arrow in FIG. 2) between the adjacent cells. An opening 23A through which the work 2 passes is formed in the shielding plate 23.

2. Transport Jig FIG. 4 shows an example of the transport jig 30. The transfer jig 30 includes a horizontal arm section 300, a vertical arm section 310, a work holding section 320, a guided section 330, a power-supplied section 340, and a pushed piece 350. The horizontal arm unit 300 extends along a direction B orthogonal to the intermittent transport direction A. The vertical arm unit 310 is suspended from and held by the horizontal arm unit 300. The work holding unit 320 is fixed to the vertical arm unit 310. The work holding unit 320 includes an upper frame 321 and a lower frame 322 supported by the upper frame 321 so as to be vertically movable. The upper frame 321 is provided with a plurality of clampers 323 that clamp the upper part of the work 2. The lower frame 322 is provided with a plurality of clampers 324 that clamp the lower part of the work 2. A downward tension is applied to the work 2 by a lower clamper 324. However, the lower frame 322 and the clamper 324 may be omitted when the work 2 is thick or when power is not supplied from the bottom of the work 2.

The guided portion 330 is arranged along the processing units 3-2 to 3-n, and is guided by, for example, a guide rail (not shown) divided for each of the processing units 3-2 to 3-n to carry and cure. The tool 30 is linearly guided. The guided portion 330 may include a roller 331 that is in rolling contact with the top surface of the guide rail, and a roller 332 that is in rolling contact with both side surfaces of the guide rail (only the roller that is in rolling contact with one side surface is shown in FIG. 4).

The power-supplied part 340 contacts the cathode rail described in FIGS. 5 and 6, and sets the work 2 as a cathode via the horizontal arm part 300, the vertical arm part 310, and the work holding part 320 of the transfer jig 30. To do. The power-supplied part 340 includes two contacts 342 and 343 supported on the upstream side and the downstream side of the support arm 341 extending along the intermittent transport direction A. The contacts 342 and 343 are supported by the support arm 341 via a parallel link mechanism, and are biased by springs so as to be pressed against the cathode rail. The two contacts 342 and 343 are electrically connected to at least one of the clampers 323 and 324 to set the work 2 as a cathode.

The pushed piece 350 is fixed to, for example, the vertical arm portion 310, and is arranged directly above the work holding portion 320 with the pushed surface vertical. The pushed piece 350 is pushed from the direction C in the figure by an intermittent transfer device described later to transmit the intermittent transfer force to the transfer jig 30. The transfer jig 30 shown in FIG. 4 is provided with an engaged portion 360 used during continuous transfer, and the transfer jig 30 can be used for both intermittent transfer and continuous transfer.

3. Cathode Rail and Rectifier As shown in FIG. 5, each processing unit 3-1 to 3-n (FIG. 5 shows only two processing units) has at least one cathode rail 40. A plurality of cathode rails 40 may be arranged in parallel in parallel with the transport direction A. In this case, the plurality of cathode rails 40 may be connected to the same rectifier, or may be connected to different rectifiers and the current value may be independently controlled for each power feeding site. In this embodiment, one cathode rail 40 is provided. One cathode rail 40 is preferably divided into a plurality of divided cathode rails 40-1 to 40-n (FIG. 5 is divided into two divided cathode rails 40-1 and 40-40). -2 is shown), and are continuously connected in the transport direction A. Each of the divided cathode rails 40-1 to 40-n has a space (non-conductive portion) 42 on the insulating rail 41, and the work 2 is stopped, as shown in FIGS. 5 and 6A. It has a total of four conductive parts 43, one for each cell. Each of the four conductive parts 43 holds the work 2 at the four stop positions of the processing units 3-1 to 3-n and stops the power-supplied part 340 ( The two contacts 342, 343) are electrically connected. Note that FIG. 5 shows the liquid level L of the plating liquid contained in each processing unit 3-1 to 3-n, and the work 2 is immersed in the plating liquid. As shown in FIG. 6B, partition walls 44, 44 are provided at both ends in the width direction of the cathode rail 40, and a non-oil conductive fluid (for example, water) 45 is held on the conductive portion 43. You can With this configuration, the electrical contact between the power-supplied part 340 (the two contacts 342 and 343) and the conductive part 43 can be more reliably ensured via the conductive fluid 45. However, the conductivity of water is much lower than the conductivity of the conductive part 43 made of metal, so that the insulating property between the adjacent conductive parts 43 and 43 is maintained. Further, as shown in FIG. 6B, the bolts 46 for fixing the conductive portion 43 on the insulating rail 41 can be arranged on both sides of the traveling path of the power-supplied portion 340. As a result, it is not necessary to provide a counterbored hole for the bolt in the conductive portion 34, and the factor that causes resistance can be eliminated.

Each of the processing units 3-1 to 3-n has a total of four rectifiers 50 (one rectifier 50 is shown in FIG. 5), one for each cell in which the work 2 is stopped. Each one positive terminal 51 of the four rectifiers 50 is connected to the anode 20 (20A1, 20A2, 20B1, 20B2) arranged in each cell. Each one negative terminal 52 of the four rectifiers 50 is connected to the conductive portion 43 corresponding to each cell of the split cathode rails 40-1 to 40-n.

4. Current control when the work is stopped At four stop positions (cells) of each processing unit 3-1 to 3-n, the current flowing through the four works 2 is one rectifier 50 provided for each cell. Are independently controlled by each of the. In addition, since the cathodes are insulated from each other and the anodes are insulated from each other between the cells, it is possible to separately insulate each one work 2 and individually control the power supply to the works 2 by each rectifier 50. In addition, by separating the electric field between the cells by the shield plate 23, the influence between the cells is eliminated, and the individual power supply for each work 2 is secured. Thereby, the plating quality of the work 2 can be improved.

When the intermittent transfer method of the present embodiment is compared with the conventional continuous transfer method, the positional relationship between the workpiece (cathode) that is continuously transferred and the fixed anode constantly changes, whereas the intermittent transfer method of the present embodiment is stopped. The work (cathode) 2 can be directly opposed to the anode 20. As described above, the positional relationship between the cathode and the anode is constant while the work 2 is stopped, and each work is subjected to the same plating condition. Therefore, it is expected that the plating quality is improved. In particular, when the work 2 is stopped, the contact resistance does not fluctuate, so that precise current control becomes possible. Further, there is a counterbore hole for a fixing bolt in the middle of a long cathode rail used for continuous transportation, and the resistance value of the cathode rail varies from place to place and does not result in uniform resistance. Therefore, the current flowing through the work differs depending on the position during the continuous transfer of the work, but such a problem can be solved in the intermittent transfer. Further, in the present embodiment, the plating quality is not adversely affected by the continuous transfer speed of the work as in the continuous transfer.

However, the work 2 may be intermittently conveyed without necessarily performing the complete individual power supply as described above. That is, one or both of the cathode and the anode may be common (common cathode and/or common anode) in the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n.

5. Moving Scanning of Nozzle Tube In each of the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n, as shown in FIG. At least one nozzle tube 60 may be further provided between the front surface and the back surface) and the anode 20. Since the nozzle tubes 60 block the electric field formed between the work (cathode) 2 and the anode 20, the number of nozzle tubes 60 is preferably small even when a plurality of nozzle tubes 60 are provided. The nozzle tube 60 has a plurality of ejection ports 60A for ejecting the plating solution, as shown in FIG. The vertical pitch P of the jet outlets 60A of the nozzle pipe 60 shown in FIG. 9 is smaller than the pitch (for example, 7.5 mm) used in the conventional continuous transfer system, and is not less than the outer diameter of the jet outlets 60A and not more than 5 mm. You can This is to increase the amount of plating liquid supplied per unit time. In addition, it is preferable that the pitch P is small in order to evenly supply the plating liquid to small-sized chips and dense patterns. In FIG. 9, the nozzle tubes 60 on the front and back surfaces of the work 2 are opposed to each other with the work 2 interposed therebetween, but may be provided at non-opposing positions. If they are opposed to each other, it is possible to prevent the work 2 from being deformed by hydraulic pressure, and if they are not opposed to each other, it is easy to supply the plating liquid to the through holes of the work 2. Note that the nozzle tubes are also provided in the continuous transfer method, but the number of nozzle tubes is as large as a dozen or more per processing unit.

Although a large number of nozzle tubes are fixed in the continuous transfer system for workpieces, in the present embodiment employing the intermittent transfer system, the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n are provided. Thus, at least one nozzle tube 60 is horizontally scanned and moved, for example, in the directions of arrows A1 and A2 in FIG. 8 (both parallel to the intermittent transport direction A). Thereby, as shown in FIG. 9, the plating liquid can be uniformly ejected onto the entire surface of the work 2. Further, the moving speed of the nozzle tube 60 can be made higher than the moving speed of the work 2 in the continuous transfer system (for example, 0.8 m/min). This makes it possible to increase the amount of plating liquid supplied per unit time. It should be noted that when the work speed is increased in the continuous transfer system, the overall length of the processing tank becomes long and the device becomes large, but the device does not become large in the intermittent transfer as in the present embodiment.

Although a reciprocating mechanism of the nozzle tube 60 is not shown, a known mechanism for reciprocating linear movement (for example, a pinion-rack mechanism driven by a reversible motor, a piston-crank mechanism, etc.) can be adopted. The reciprocating mechanism can move the two nozzle tubes 60 so as to circulate and scan at least once the length range corresponding to at least the horizontal width of the work 2 stopped in each cell. This improves the in-plane uniformity of the workpiece 2 to be processed. In particular, it is preferable that the nozzle tube 60 be circulated and scanned at least once from the initial position to return to the initial position. This is because the shadow of the nozzle tube 60 is substantially uniformized within the work surface. It should be noted that the nozzle tube 60 may continue the reciprocal scanning movement during the operation of the apparatus, or may stop the reciprocating scanning movement during the intermittent transfer of the work 2.

According to this embodiment, at least one nozzle tube 60, for example, two nozzle tubes 60 can be scanned and moved with respect to the work 2 that is intermittently stopped, corresponding to the stop position of the work 2. As a result, a region that is a shadow of the nozzle tube 60 positioned between the work 2 and the anode 20 in plan view and that interferes with the electric field between the anode and the cathode moves as the nozzle tube 60 moves. Therefore, the area where the electric field is blocked by the nozzle tube 60 is not fixed, and the in-plane uniformity of the workpiece 2 to be processed is improved. The scanning movement direction of the nozzle tube 60 is not limited to the horizontal direction. For example, the nozzle tube 60 may be arranged horizontally and moved by scanning in the vertical direction, and the scanning movement direction may be any direction such as horizontal or vertical.

The nozzle tube 60 has a well-known structure and can entrain and eject the plating liquid in the vicinity of the ejection port 60A in the split processing tank. Therefore, the plating liquid rich in metal ions near the anode 20 can be ejected toward the work 2, and the throughput is improved.

The scanning movement of the nozzle tube 60 can be widely applied to the intermittent transfer type surface treatment apparatus, and the structure like the above-described embodiment, that is, the connection structure of a plurality of processing units, the cathode division structure, and the anode division is not necessarily required. It is not limited to the structure or the like. Further, since the present invention is not necessarily applied to the intermittent transfer type surface treatment apparatus, at least one nozzle tube is fixedly arranged in the continuous transfer type surface treatment apparatus.

6. Processing Liquid Circulating Device FIG. 9 schematically shows the processing liquid circulating device 100 connected to each of the processing units 3-1 to 3-n shown in FIG. In FIG. 9, the processing liquid circulation device 100 is connected to the divided processing tank 6 of the processing unit 3-1. However, a plurality of treatment liquid circulation devices 100 may be connected to the divided treatment tank 6, for example, one treatment liquid circulation device 100 may be connected to each of the four cells 11-1 to 11-4 shown in FIG. good. Alternatively, one processing liquid circulating device 100 may be connected to each of the plurality of divided processing tanks 6. However, the divided areas to which the processing liquid circulation device 100 is connected are not limited to those physically divided like the processing units 3-1 to 3-n and the cells 11-1 to 11-4.

In FIG. 9, the treatment liquid circulating device 100 adjusts the plating liquid recovered from the divided treatment tank 6 and is provided on both sides of the work 2 in each of the cells 11-1 to 11-4 of the divided treatment tank 6. Each of the two sets is supplied back to the eight sets of nozzle tubes 60. The processing liquid circulation device 100 has an adjustment tank 110. The adjusting tank 110 is in communication with the bottom of the split processing tank 6 via, for example, a normally-open valve 111. As shown in FIG. 9, when the split processing tank 6 has overflow tanks 7A and 7B on both sides in the width direction, the adjustment tank 110 is also communicated with the bottoms of the overflow tanks 7A and 7B.

The adjustment tank 110 can have a copper oxide charging part 112, an additive charging part 113, and a temperature control part 114. Copper oxide and additives are added to supplement the components consumed by copper plating. The temperature control is performed to adjust the temperature of the processing liquid to the optimum temperature unique to the surface treatment. Two return paths 120A and 120B are connected to the downstream side of the adjusting tank 110. The return path 120A is connected to each set of four nozzle tubes 60 provided on the front side of the work 2 in each of the cells 11-1 to 11-4 of the division processing tank 6. The return path 120B is connected to each of the cells 11-1 to 11-4 of the division processing tank 6 and to each set of four nozzle tubes 60 provided on the back side of the work 2. A circulation pump 121, a filter 122, and a flow meter 123 are provided in each of the two return paths 120A and 120B.

According to the present embodiment, each of the plurality of processing liquid circulation devices 100 adjusts the plating liquid collected from each one of the divided processing tanks 6 obtained by dividing the processing tank in the longitudinal direction, and the divided processing tanks 6 of the divided processing tanks 6 are adjusted. It is possible to return and supply as a processing liquid for re-supplying to a total of eight sets of nozzle tubes 60 provided for each one. Therefore, the concentration of the fresh plating solution after the adjustment is substantially equal among the plurality of divided treatment tanks 6. Moreover, in each of the divided processing tanks 6, a fresh plating solution is jetted toward the work 2 from a total of eight sets of nozzle tubes 60 that are moved and scanned. Therefore, the fresh plating liquid is dispersed in each of the divided processing tanks 6, and the concentration of the plating liquid becomes substantially uniform in each of the divided processing tanks 6. Further, by supplying the re-supply processing liquid from the upper side of the nozzle tube 60, it is possible to perform air bleeding.

The adjustment bath 110 can perform at least one of the addition of a consumed component such as an oxidizing cylinder and/or an additive and the temperature adjustment to the recovered plating solution. By any one of these adjustments, the recovered plating is adjusted to a fresh resupply processing liquid.

Impurities with a high specific gravity (metal-based, for example, copper oxide copper powder) contained in the plating solution recovered from the bottom of the split processing tank 6 having the inclined surface 6C, and contained in the plating solution recovered from the overflow tanks 7A and 7B. Impurities having a low specific gravity (for example, resin-based) can be removed by the filter 122. Thereby, the contamination of the re-supplied plating solution can be prevented and the nozzle tube 60 can be prevented from being clogged. In particular, when the line and space of the wiring formed on the work 2 becomes small, even a small amount of dust causes a short circuit defect. Since such dust is removed by the filter 122, it can be removed from the re-supplied plating solution. It should be noted that dust having a high specific gravity is prevented from remaining in the treatment tank while being convected by being collected from the bottom of the treatment tank through the normally-open nozzle 111.

Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term described in the specification or the drawings at least once together with a different term having a broader meaning or the same meaning can be replaced with the different term in any place in the specification or the drawing. Further, all combinations of the present embodiment and modifications are also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 surface treatment apparatus, 2 work, 3-1 to 3-n treatment unit, 6 division treatment tanks, 7A, 7B overflow tank, 20 (20A1, 20A2, 20B1, 20B2) anode, 30 transfer jig, 40, 40- 1, 40-2 Cathode rail (split cathode rail), 41 Insulation rail, 42 Interval (non-conducting part), 43 Conducting part, 50 Rectifier, 51 Positive terminal, 52 Negative terminal, 60 Nozzle tube, 60A Jet outlet, 100 Treatment Liquid circulation device, 110 adjusting tank, 112 oxidation cylinder charging section, 113 additive charging section, 114 temperature control section, 120A, 120B first and second return paths, 121 circulation pump, 122 filter

It is a schematic sectional drawing of the plating process part in the plating apparatus of the intermittent conveyance system which concerns on embodiment of this invention. It is a schematic plan view of one processing unit of the plating apparatus shown in FIG. It is a figure which shows the positional relationship between the workpiece stopped in one processing unit, and an anode. It is a perspective view of a conveyance jig which conveys a work. It is a figure which shows typically the connection of the conductive part on an anode, a cathode rail, and a rectifier. 6A and 6B are a front view and a sectional view of the cathode rail. FIG . 6 is a plan view showing a nozzle tube which is horizontally reciprocally moved in a cell. It is a figure which shows the arrangement pitch of the ejection port of a nozzle tube. It is a figure which shows typically the processing liquid circulation apparatus connected to a division processing tank.

FIG. 3 is a front view showing the positional relationship between the anodes 20A1 and 20A2 (20B1 and 20B2) arranged in the processing unit 3-1 and the work 2. As shown in FIG. 3, the work 2 is held by the transfer jig 30. As shown in FIGS. 2 and 3, each of the anodes 20 (20A, 20B) is arranged at a position facing the work 2 at the four stop positions. In short, as shown in FIG. 2, it suffices if a uniform electric field can be formed between the work 2 set as the cathode and the anode 20. The anode 20 shown in FIGS. 2 and 3 has a rectangular outline regardless of the shape of the anode 20, but the outline in plan view may be circular. The anode may be an insoluble anode or a soluble anode.

5. Moving Scan of Nozzle Tube In each of the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n, as shown in FIG. 7 , each surface of the work 2 at the stop position (in plan view) ( At least one nozzle tube 60 may be further provided between the front surface and the back surface) and the anode 20. Since the nozzle tubes 60 block the electric field formed between the work (cathode) 2 and the anode 20, the number of nozzle tubes 60 is preferably small even when a plurality of nozzle tubes 60 are provided. The nozzle tube 60 has a plurality of ejection ports 60A for ejecting the plating solution, as shown in FIG . The vertical pitch P of the ejection port 60A of the nozzle tube 60 shown in FIG. 8 is smaller than the pitch (for example, 7.5 mm) used in the conventional continuous transfer system, and should be not less than the outer diameter of the ejection port 60A and not more than 5 mm. You can This is to increase the amount of plating liquid supplied per unit time. In addition, it is preferable that the pitch P is small in order to evenly supply the plating liquid to small-sized chips and dense patterns. In FIG. 8 , the nozzle tubes 60 on the front and back surfaces of the work 2 are opposed to each other with the work 2 interposed therebetween, but may be provided at non-opposing positions. If they are opposed to each other, it is possible to prevent the work 2 from being deformed by hydraulic pressure, and if they are not opposed to each other, it is easy to supply the plating liquid to the through holes of the work 2. Note that the nozzle tubes are also provided in the continuous transfer method, but the number of nozzle tubes is as large as a dozen or more per processing unit.

Although a large number of nozzle tubes are fixed in the continuous transfer system for workpieces, in the present embodiment employing the intermittent transfer system, the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n are provided. Then, at least one nozzle tube 60 is horizontally scanned and moved, for example, in the directions of arrows A1 and A2 in FIG. 7 (both parallel to the intermittent transport direction A). Thereby, as shown in FIG. 8 , the plating liquid can be uniformly ejected onto the entire surface of the work 2. Further, the moving speed of the nozzle tube 60 can be made higher than the moving speed of the work 2 in the continuous transfer system (for example, 0.8 m/min). This makes it possible to increase the amount of plating liquid supplied per unit time. It should be noted that when the work speed is increased in the continuous transfer system, the overall length of the processing tank becomes long and the device becomes large, but the device does not become large in the intermittent transfer as in the present embodiment.

The adjusting tank 110 can perform at least one of charging a consumed component such as copper oxide and/or an additive and adjusting the temperature of the recovered plating solution. By any one of these adjustments, the recovered plating solution is adjusted to a fresh resupply processing solution.

Impurities with a high specific gravity (metal-based, for example, copper oxide copper powder) contained in the plating solution recovered from the bottom of the split processing tank 6 having the inclined surface 6C, and contained in the plating solution recovered from the overflow tanks 7A and 7B. Impurities having a low specific gravity (for example, resin-based) can be removed by the filter 122. Thereby, the contamination of the re-supplied plating solution can be prevented and the nozzle tube 60 can be prevented from being clogged. In particular, when the line and space of the wiring formed on the work 2 becomes small, even a small amount of dust causes a short circuit defect. Since such dust is removed by the filter 122, it can be removed from the plating solution re-supplied. It should be noted that dust having a large specific gravity is prevented from remaining in the treatment tank while being convected by being collected from the bottom of the treatment tank through the normally open bubble 111.

DESCRIPTION OF SYMBOLS 1 surface treatment apparatus, 2 work, 3-1 to 3-n treatment unit, 6 division treatment tanks, 7A, 7B overflow tank, 20 (20A1, 20A2, 20B1, 20B2) anode, 30 transfer jig, 40, 40- 1, 40-2 Cathode rail (split cathode rail), 41 Insulation rail, 42 Interval (non-conducting part), 43 Conducting part, 50 Rectifier, 51 Positive terminal, 52 Negative terminal, 60 Nozzle tube, 60A Jet outlet, 100 Treatment Liquid circulation device, 110 adjusting tank, 112 copper oxide charging section, 113 additive charging section, 114 temperature control section, 120A, 120B first and second return paths, 121 circulation pump, 122 filter

Claims (6)

A treatment tank in which a plurality of nozzle tubes for ejecting the treatment liquid onto a plurality of works immersed in the treatment liquid are arranged;
A plurality of processing liquid circulation devices,
Have
Each of the plurality of processing liquid circulation devices is divided into a plurality in the longitudinal direction of the processing tank, and each of the plurality of processing liquid circulation devices is connected to each one of a plurality of divided regions including at least one of the plurality of nozzle tubes. Surface treatment apparatus, wherein the treatment liquid recovered from each one of the divided areas is adjusted and returned to the at least one nozzle tube provided in each of the plurality of divided areas. .. In claim 1,
Each of the plurality of processing liquid circulation devices,
Circulation pump,
An adjusting tank for adjusting the processing liquid recovered by the circulation pump from one of the plurality of divided regions to a processing liquid for re-supply,
Including
The surface treatment apparatus, wherein the processing liquid for re-supply from the adjusting tank is supplied back to the at least one nozzle pipe by the circulation pump. In claim 2,
The surface treatment apparatus, wherein the adjustment tank carries out at least one of charging a component to be consumed and temperature adjustment with respect to the recovered processing liquid. In Claim 2 or 3,
The treatment liquid in the treatment tank is discharged and collected from the bottom side of the treatment tank,
The surface treatment apparatus, wherein each of the plurality of treatment liquid circulation devices further includes a filter for filtering the resupply treatment liquid from the adjustment tank. In claim 4,
Further having an overflow tank adjacent to the processing tank,
The surface treatment apparatus, wherein the processing liquid in the processing tank is discharged and collected through the overflow tank. In any one of Claim 1 thru|or 5,
The surface treatment apparatus is formed by connecting a plurality of treatment units in the longitudinal direction,
Each of the plurality of processing units includes a divided processing tank in which the processing liquid is stored,
The surface treatment apparatus, wherein each of the plurality of treatment liquid circulation devices is connected to each of the divided treatment tanks of the plurality of treatment units.

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