CN116018430A - Surface treatment device - Google Patents
Surface treatment device Download PDFInfo
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- CN116018430A CN116018430A CN202180054900.2A CN202180054900A CN116018430A CN 116018430 A CN116018430 A CN 116018430A CN 202180054900 A CN202180054900 A CN 202180054900A CN 116018430 A CN116018430 A CN 116018430A
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- 238000004381 surface treatment Methods 0.000 title claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 160
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 32
- 125000006850 spacer group Chemical group 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000013019 agitation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
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Abstract
Description
技术领域technical field
本发明涉及对工件实施镀敷等表面处理的表面处理装置。The present invention relates to a surface treatment device for performing surface treatment such as plating on a workpiece.
背景技术Background technique
在对电路基板等工件进行镀敷的装置中,如专利文献1所示,从在镀敷液中纵向设置的沿着喷嘴管的纵向排列的多个喷嘴,朝向垂下到镀敷液中的工件喷射镀敷液。In an apparatus for plating workpieces such as circuit boards, as shown in Patent Document 1, a plurality of nozzles arranged vertically in the plating solution along the longitudinal direction of the nozzle pipe are directed toward the workpiece hanging down in the plating solution. Spray the plating solution.
在对电路基板或半导体晶片等工件进行镀敷的装置中,如专利文献2及3所示,代替喷嘴管而使用了对处理液进行搅拌的桨叶。专利文献2的桨叶是搅拌棒,专利文献3的桨叶是贯通形成有多个纵长孔的矩形板,这些桨叶与工件的主面平行地往复移动。在专利文献4~6中公开了将专利文献1的喷嘴设置于专利文献2或3的桨叶上的方案。In an apparatus for plating workpieces such as circuit boards and semiconductor wafers, as shown in Patent Documents 2 and 3, paddles for agitating a treatment liquid are used instead of nozzle pipes. The paddle of Patent Document 2 is a stirring rod, and the paddle of Patent Document 3 is a rectangular plate having a plurality of elongated holes formed therethrough, and these paddles reciprocate parallel to the main surface of the workpiece. Patent Documents 4 to 6 disclose that the nozzle of Patent Document 1 is provided on the paddle of Patent Document 2 or 3 .
现有技术文献prior art literature
专利文献patent documents
专利文献1:日本特开2012-046782号公报(图5)Patent Document 1: Japanese Patent Laid-Open No. 2012-046782 (FIG. 5)
专利文献2:日本特开2006-04172号公报(图1-5)Patent Document 2: Japanese Unexamined Patent Publication No. 2006-04172 (Figs. 1-5)
专利文献3:日本特开2014-185375号公报(图1、3-4、6)Patent Document 3: Japanese Patent Application Laid-Open No. 2014-185375 (Fig. 1, 3-4, 6)
专利文献4:日本特开2004-16129号公报(图1-4)Patent Document 4: Japanese Unexamined Patent Publication No. 2004-16129 (Figs. 1-4)
专利文献5:日本特开昭56-42976号公报(图1-3)Patent Document 5: Japanese Patent Application Laid-Open No. 56-42976 (Fig. 1-3)
专利文献6:日本特开平10-88397号公报(图1-2)Patent Document 6: Japanese Patent Application Laid-Open No. 10-88397 (FIGS. 1-2)
发明内容Contents of the invention
发明所要解决的课题The problem to be solved by the invention
但是,专利文献1的喷嘴管在工件的宽度方向上隔开间隔地配置,而且,在各喷嘴管上,在纵向上隔开间隔地配置有喷嘴,因此难以向工件均匀地喷出镀敷液。另一方面,专利文献2的桨叶仅是对镀敷液进行搅拌。在专利文献4~6中,由液体喷射泵压送的处理液从移动的桨叶朝向工件喷出,但处理的面内均匀性依赖于喷嘴的位置而未得到改善,这与专利文献1相同。而且,在专利文献4~6中,为了使桨叶移动,除了驱动源之外还需要液体喷射泵。However, the nozzle tubes of Patent Document 1 are arranged at intervals in the width direction of the workpiece, and the nozzles are arranged at intervals in the longitudinal direction on each nozzle tube, so it is difficult to uniformly discharge the plating solution to the workpiece. . On the other hand, the paddle of Patent Document 2 merely agitates the plating solution. In Patent Documents 4 to 6, the processing liquid pressurized by the liquid jet pump is sprayed from the moving paddle toward the workpiece, but the in-plane uniformity of processing depends on the position of the nozzle and is not improved, which is the same as Patent Document 1 . Furthermore, in Patent Documents 4 to 6, in order to move the blades, a liquid jet pump is required in addition to the drive source.
本发明的目的在于提供一种表面处理装置,其不需要液体喷射泵,能够降低向工件喷出的处理液的面内不均匀性,提高工件的表面处理的面内均匀性,而且能够提高生产率。The object of the present invention is to provide a surface treatment device that does not require a liquid jet pump, can reduce the in-plane unevenness of the treatment liquid sprayed on the workpiece, improve the in-plane uniformity of the surface treatment of the workpiece, and can improve productivity. .
用于解决课题的手段means to solve the problem
(1)本发明的一个方式涉及一种表面处理装置,其中,(1) One aspect of the present invention relates to a surface treatment device in which
所述表面处理装置具有:The surface treatment device has:
处理槽,其收纳处理液;a treatment tank, which accommodates a treatment liquid;
阳极,其配置于所述处理槽内;an anode, which is arranged in the treatment tank;
夹具,其使浸渍于所述处理液的工件垂下地保持该工件,且将所述工件设定为阴极;a jig that holds the workpiece immersed in the treatment liquid so that the workpiece hangs down, and sets the workpiece as a cathode;
液体喷出部件,其在所述阳极与所述工件之间配置于所述处理液中;以及a liquid ejection member disposed in the treatment liquid between the anode and the workpiece; and
移动机构,其使所述液体喷出部件相对于所述工件移动,a movement mechanism that moves the liquid ejection member relative to the workpiece,
所述液体喷出部件包含至少一对板材,所述至少一对板材在所述阳极与所述工件之间沿着朝向所述工件的延伸方向形成,并且在与所述延伸方向交叉的方向上分离地配置,在所述至少一对板材之间引导通过所述液体喷出部件的移动而流动的所述处理液并使所述处理液朝向所述工件喷出。The liquid ejection member includes at least one pair of plates formed between the anode and the work in an extending direction toward the work and in a direction crossing the extending direction. Separately arranged, the processing liquid flowing by the movement of the liquid ejection member is guided between the at least one pair of plates and the processing liquid is ejected toward the workpiece.
根据本发明的一个方式,通过使液体喷出部件相对于垂下到处理液中的工件移动,不使用喷嘴管就能够朝向工件喷射处理液。即,将通过液体喷出部件的移动而在处理槽内流动的处理液在至少一对板材之间引导并朝向所述工件喷出。由此,通过处理液与工件碰撞,能够将位于阳极附近的表面处理成分丰富的新鲜的处理液供给至工件,生产率得到提高。另外,由于能够通过移动的液体喷出部件的至少一对板材之间将处理液向工件喷出,因此,与从喷嘴管的多个喷嘴喷出处理液的情况相比,工件面内的处理的均匀性得到提高。According to one aspect of the present invention, the processing liquid can be sprayed toward the workpiece without using a nozzle pipe by moving the liquid ejection member relative to the workpiece suspended in the processing liquid. That is, the treatment liquid flowing in the treatment tank by the movement of the liquid ejection member is guided between at least one pair of plates and ejected toward the workpiece. As a result, fresh processing liquid rich in surface treatment components located in the vicinity of the anode can be supplied to the workpiece by colliding the processing liquid with the workpiece, thereby improving productivity. In addition, since the processing liquid can be discharged to the workpiece through at least a pair of plate members of the moving liquid discharge member, compared with the case where the processing liquid is discharged from a plurality of nozzles of the nozzle tube, the processing within the workpiece surface is more efficient. uniformity is improved.
(2)在本发明的一个方式(1)中,涉及一种表面处理装置,其中,(2) One aspect (1) of the present invention relates to a surface treatment device in which
所述移动机构使所述液体喷出部件在与所述工件平行的往复方向上移动,the movement mechanism moves the liquid ejection member in a reciprocating direction parallel to the workpiece,
所述液体喷出部件包含:The liquid ejection part includes:
第一引导体,其具有与所述往复方向交叉的两个面;以及a first guide body having two faces intersecting the reciprocating direction; and
第二引导体和第三引导体,它们分别与所述第一引导体的所述两个面隔开间隙地配置,a second guide body and a third guide body which are respectively arranged with a gap between the two surfaces of the first guide body,
所述至少一对板材包含:The at least one pair of plates comprises:
第一一对板材,它们由所述第一引导体和所述第二引导体形成;和a first pair of sheets formed by said first guide body and said second guide body; and
第二一对板材,它们由所述第一引导体和所述第三引导体形成,a second pair of sheets formed by said first guide body and said third guide body,
在所述液体喷出部件向所述往复方向中的前进移动方向移动时,将由所述第一引导体阻挡的处理液沿着所述第一一对板材之间引导而朝向所述工件喷出,When the liquid ejection member moves in a forward movement direction in the reciprocating direction, the treatment liquid blocked by the first guide body is guided along a space between the first pair of plates and ejected toward the workpiece. ,
在所述液体喷出部件向所述往复方向中的返回移动方向移动时,将由所述第一引导体阻挡的处理液沿着所述第二一对板材之间引导而朝向所述工件喷出。When the liquid ejection member moves in a return movement direction in the reciprocating direction, the treatment liquid blocked by the first guide body is guided along a space between the second pair of plate materials to be ejected toward the workpiece. .
这样,在液体喷出部件例如前进移动时,沿着由第一、第二引导体形成的第一一对板材之间被引导的处理液被喷出到工件上,在液体喷出部件例如返回移动时,沿着由第一、第三引导体形成的第二一对板材之间被引导的处理液被喷出到工件上。In this way, when the liquid ejection member moves forward, for example, the treatment liquid guided between the first pair of plates formed by the first and second guides is ejected onto the workpiece, and when the liquid ejection member, for example, returns When moving, the treatment liquid guided along the space between the second pair of plates formed by the first and third guide bodies is sprayed onto the workpiece.
(3)在本发明的一个方式(2)中,所述阳极能够包含配置于所述工件的两侧的第一阳极以及第二阳极,所述液体喷出部件能够包含配置于所述第一阳极与所述工件之间的第一液体喷出部件、以及配置于所述第二阳极与所述工件之间的第二液体喷出部件,所述移动机构能够包含使所述第一液体喷出部件移动的第一移动机构、以及使所述第二液体喷出部件移动的第二移动机构。这样,能够对工件的两面进行处理。(3) In one aspect (2) of the present invention, the anode may include a first anode and a second anode arranged on both sides of the workpiece, and the liquid ejection member may include a first anode arranged on the first anode. A first liquid ejection member disposed between the anode and the workpiece, and a second liquid ejection member disposed between the second anode and the workpiece, the moving mechanism may include ejecting the first liquid a first movement mechanism that moves the discharge member, and a second movement mechanism that moves the second liquid discharge member. In this way, both sides of the workpiece can be processed.
(4)在本发明的一个方式(3)中,可以是,还具有对所述第一移动机构赋予驱动力的第一驱动源和对所述第二移动机构赋予驱动力的第二驱动源,所述第一液体喷出部件和所述第二液体喷出部件被不同步地驱动。当第一、第二液体喷出部件隔着工件正对时,会在工件的同一区域向其两面喷出处理液。在工件具有贯通两面的通孔的情况下,处理液难以穿过通孔。在第一、第二液体喷出部件的一次往复移动中,如果使第一、第二液体喷出部件同步地移动,则第一、第二液体喷出部件正对的位置相对于工件来说总是相同,但通过使第一、第二液体喷出部件不同步地移动,能够使第一、第二液体喷出部件正对的位置相对于工件每次都不同。由此,处理液容易穿过通孔。(4) In one aspect (3) of the present invention, a first drive source that applies a driving force to the first moving mechanism and a second driving source that applies a driving force to the second moving mechanism may be further included. , the first liquid ejection member and the second liquid ejection member are driven asynchronously. When the first and second liquid ejection members face each other across the workpiece, the processing liquid is ejected from the same region of the workpiece to both surfaces thereof. In the case where the workpiece has a through hole penetrating both surfaces, it is difficult for the processing liquid to pass through the through hole. In one reciprocating movement of the first and second liquid ejection members, if the first and second liquid ejection members are moved synchronously, the position where the first and second liquid ejection members are facing is It is always the same, but by moving the first and second liquid ejection members asynchronously, the positions where the first and second liquid ejection members face each other can be changed every time. Thus, the treatment liquid easily passes through the through hole.
(5)在本发明的一个方式(3)或(4)中,也可以是,通过将保持有所述工件的所述夹具从所述处理槽的上方降下并安装,由此,所述处理槽被划分为第一槽和第二槽。这样,第一液体喷出部件能够搅拌第一槽内的处理液,第二液体喷出部件能够搅拌第二槽内的处理液,而且,能够排除一方的槽中的搅拌给另一方的槽带来的不良影响。(5) In one aspect (3) or (4) of the present invention, the jig holding the workpiece may be lowered from above the processing tank and installed, whereby the processing The slots are divided into first slots and second slots. In this way, the first liquid ejection member can agitate the treatment liquid in the first tank, the second liquid ejection member can agitate the treatment liquid in the second tank, and the agitation in one tank can be eliminated from being brought to the other tank. coming adverse effects.
(6)在本发明的一个方式(5)中,所述处理槽能够在沿所述往复方向位于两端的2个侧壁部的外侧分别包含缓冲槽,该缓冲槽与所述第一槽和所述第二槽连通而收纳所述处理液。这样,能够使被第一液体喷出部件和第二液体喷出部件推到处理槽的两端的处理液逃逸到缓冲槽中。这样,能够降低在处理槽的两端产生的处理液的反射波的影响。另外,也能够通过缓冲槽确保处理液在第一槽与第二槽之间的流通。(6) In one aspect (5) of the present invention, the processing tank may include buffer tanks respectively on the outer sides of the two side wall parts located at both ends in the reciprocating direction, and the buffer tanks are separated from the first tank and the first tank. The second tank communicates to accommodate the treatment liquid. In this way, the processing liquid pushed to both ends of the processing tank by the first liquid ejection member and the second liquid ejection member can escape into the buffer tank. In this way, it is possible to reduce the influence of reflected waves of the treatment liquid generated at both ends of the treatment tank. In addition, the circulation of the treatment liquid between the first tank and the second tank can also be ensured by the buffer tank.
(7)在本发明的一个方式(5)中,所述处理槽能够包含在与所述往复方向平行的方向上连结、且被第一缓冲槽划分的第一处理槽和第二处理槽。所述夹具能够包含:第一夹具,其保持第一工件并将所述第一处理槽划分为所述第一槽和所述第二槽;以及第二夹具,其保持第二工件并将所述第二处理槽划分为所述第一槽和所述第二槽。所述第一缓冲槽能够使所述处理液在所述第一处理槽的所述第一槽、所述第二处理槽的所述第一槽、所述第一处理槽的所述第二槽以及所述第二处理槽的所述第二槽之间流通。所述第一处理槽能够在位于所述往复方向的一端的第一侧壁部的外侧包含使所述处理液在所述第一处理槽中的所述第一槽与所述第二槽之间流通的第二缓冲槽。所述第二处理槽能够在位于所述往复方向的另一端的第二侧壁部的外侧包含使所述处理液在所述第二处理槽中的所述第一槽与所述第二槽之间流通的第三缓冲槽。这样,能够同时处理第一工件及第二工件,此时,能够起到与本发明的一个实施方式(6)相同的作用和效果。(7) In one aspect (5) of the present invention, the processing tank may include a first processing tank and a second processing tank connected in a direction parallel to the reciprocating direction and divided by a first buffer tank. The jig can include: a first jig that holds a first workpiece and divides the first processing tank into the first tank and the second tank; and a second jig that holds a second workpiece and divides the first processing tank into the first tank and the second tank; The second treatment tank is divided into the first tank and the second tank. The first buffer tank can make the treatment liquid flow in the first tank of the first treatment tank, the first tank of the second treatment tank, and the second tank of the first treatment tank. The communication between the second tank and the second processing tank. The first treatment tank may contain the treatment liquid between the first tank and the second tank in the first treatment tank on the outside of the first side wall portion located at one end in the reciprocating direction. The second buffer tank for circulation. The second treatment tank may contain the first tank and the second tank in which the treatment liquid is contained in the second treatment tank on the outside of the second side wall portion located at the other end in the reciprocating direction. The third buffer tank for circulation between. In this way, the first workpiece and the second workpiece can be processed simultaneously, and in this case, the same operations and effects as those of the embodiment (6) of the present invention can be exhibited.
附图说明Description of drawings
图1是本发明的第一实施方式的表面处理装置的俯视图。Fig. 1 is a plan view of a surface treatment device according to a first embodiment of the present invention.
图2是表面处理装置的剖视图。Fig. 2 is a cross-sectional view of the surface treatment device.
图3是用于说明液体喷出部件的结构以及动作的图。FIG. 3 is a diagram for explaining the structure and operation of a liquid ejection member.
图4是夹具的主视图。Fig. 4 is a front view of the jig.
图5是夹具的后视图。Figure 5 is a rear view of the jig.
在图6中,图6的(A)至图6的(C)分别是示出整流器与夹持器的关系的图。In FIG. 6 , FIG. 6(A) to FIG. 6(C) are diagrams showing the relationship between the rectifier and the holder, respectively.
图7是本发明的第二实施方式的表面处理装置的俯视图。Fig. 7 is a plan view of a surface treatment device according to a second embodiment of the present invention.
具体实施方式Detailed ways
在以下的公开中,提供用于实施所提示的主题的不同特征的多个不同的实施方式或实施例。当然,这些仅为示例,并非用于限定于此。此外,在本公开中,有时在各例子中使参照号码和/或文字反复。这样的反复是为了实现简洁明了,其自身不需要在与各实施方式和/或所说明的结构之间存在关系。进而,在记述为第一要素与第二要素“连接”或“连结”时,这样的记述包含第一要素和第二要素相互直接地连接或连结的实施方式,并且也包含第一要素和第二要素具有介于它们之间的1个以上的其他要素而相互间接地连接或连结的实施方式。另外,在记述为第一要素相对于第二要素“移动”时,这样的记述包含第一要素和第二要素中的至少一方相对于另一方移动的相对移动的实施方式。In the following disclosure, a number of different implementations or examples are provided for implementing different features of the proposed subject matter. Of course, these are only examples and are not intended to be limited thereto. In addition, in this disclosure, reference numerals and/or characters may be repeated in each example. Such repetition is for the sake of clarity and does not itself require a relationship to the various embodiments and/or illustrated structures. Furthermore, when it is described that the first element and the second element are "connected" or "connected", such description includes embodiments in which the first element and the second element are directly connected or connected to each other, and also includes the first element and the second element. An embodiment in which two elements are indirectly connected or linked with one or more other elements interposed therebetween. In addition, when it is described that the first element “moves” relative to the second element, such description includes an embodiment in which at least one of the first element and the second element moves relative to the other.
1.第一实施方式1. First Embodiment
图1是本实施方式的表面处理装置、例如电镀装置的概略图。电镀装置1具有保持工件W的平板状的夹具10、和设置该夹具10的表面处理槽100A。关于工件W,将处于正反关系的第一主面(例如正面)WF和第二主面(例如背面)WB中的至少一方作为被处理面,在本实施方式中将双方作为被处理面。FIG. 1 is a schematic diagram of a surface treatment device, such as a plating device, according to the present embodiment. The plating apparatus 1 has a flat-
1.1.表面处理槽1.1. Surface treatment tank
在图1和图2中,收纳处理液例如镀敷液2的表面处理槽100A具有装卸自如地支承夹具10的支承部110、120,所述夹具10以垂直状态保持工件W。下部支承部110具有供夹具10的下端部插入的狭缝。上部支承部120也具有供夹具10的侧缘部插入的狭缝。夹具10从表面处理槽100A的上部开口下降,被支承部110、120以垂直状态保持。上部支承部120具有与夹具10的后述的端子组35A、35B、45A、45B接触的端子组(未图示)。由此,通过使夹具10从上方下降而被上部支承部120支承,由此能够将夹具10的端子组35A、35B、45A、45B与位于表面处理槽100A的外部的整流器(未图示)连接。在此,利用支承部110、120、被支承于该支承部110、120的夹具10、以及被保持于夹具10的工件W,如图1和图2所示,将表面处理槽100A划分为第一槽101和第二槽102。并且,第一槽101及第二槽102不一定需要被液密地密封。如图1和图2所示,表面处理槽100A在其下部具有开口103、104。开口103面向第一槽而形成,开口104面向第二槽102而形成。针对表面处理槽100A,例如从上部开口供给调整后的镀敷液2,并将其从开口103、104排出。排出的镀敷液2在通过过滤处理、针对各主成分的补充等进行调整后被反复供给至表面处理槽100A。此外,也可以是,镀敷液2被从开口103、104供给,并且,例如将溢出的镀敷液排出。In FIGS. 1 and 2 , a
如图1和图2所示,表面处理槽100A具有分别与工件W的正面WF和背面WB对置的阳极部、例如第一阳极箱140和第二阳极箱150。第一阳极箱140保持与工件W的正面WF对置的第一阳极142,第二阳极箱150保持与工件W的背面WB对置的第二阳极152。为了实施电镀,至少一个整流器与第一阳极142及第二阳极152连接,且经由夹具10将工件W设定为阴极。As shown in FIGS. 1 and 2 , the
如图1和图2所示,表面处理槽100A在工件W与阳极142、152之间具有液体喷出部件200(200A和200B)。液体喷出部件200(200A和200B)在与工件W的主面WF、WB平行的往复方向上移动。关于液体喷出部件200(200A以及200B)的详细内容,将在后面叙述。As shown in FIGS. 1 and 2 , the
1.2.工件1.2. Artifacts
工件W例如是矩形的电路基板,通过电镀装置1进行例如镀铜。但是,镀敷的种类不限。电路基板W可以在正面WF和/或背面WB具有过孔,也可以具有贯通正面WF和背面WB的通孔。在该情况下,过孔和通孔的内壁也被镀敷。另外,工件W的正面WF及背面WB上的各自的镀敷面积也可以大不相同。The workpiece W is, for example, a rectangular circuit board, and is subjected to, for example, copper plating by the plating apparatus 1 . However, the type of plating is not limited. The circuit board W may have a via hole on the front WF and/or the back WB , or may have a via hole penetrating the front WF and the back WB . In this case, the inner walls of the vias and through-holes are also plated. In addition, the respective plating areas on the front WF and the back WB of the workpiece W may be greatly different from each other.
1.3.夹具1.3. Fixtures
使用作为夹具10的主视图的图4和作为夹具10的后视图的图5,对保持工件W的夹具10进行说明。工件W相对于夹具10的装卸例如能够通过自动设备来进行。夹具10具有例如由平板形成的夹具主体12,其中,该平板由绝缘材料构成。夹具主体12具有面积比矩形的工件W的面积稍大的矩形的孔14。工件W被配置于孔14。夹具10沿着矩形的孔14的周围4边具有图4所示的电极15A~15D和图5所示的电极15E~15H。这些电极15A~15H相互绝缘。在各电极15A~15H上保持有多个夹持器20。夹持器20从工件W的正反面夹着工件W进行夹持。如图4及图5所示,夹持器20可包含:夹持器21,其夹持工件W的上缘部;夹持器22,其夹持工件W的左侧缘部;夹持器23,其夹持工件W的下缘部;及夹持器24,其夹持工件W的右侧缘部。在此,夹持器21包含与工件W的正面WF接触的夹紧片31(图4)和与工件W的背面WB接触的夹紧片41(图5)。在本实施方式中,夹紧片31与夹紧片41电绝缘。同样地,夹持器22包含电绝缘的夹紧片32、42,夹持器23包含电绝缘的夹紧片33、43,夹持器24包含电绝缘的夹紧片34、44。另外,夹紧片31与电极15A导通,夹紧片32与电极15B导通,夹紧片33与电极15C导通,夹紧片34与电极15D导通,夹紧片41与电极15E导通,夹紧片42与电极15H导通,夹紧片43与电极15G导通,夹紧片44与电极15F导通。这样,夹紧片31~34以及41~44相互绝缘,由此,能够在工件W的正反面流过不同的电流,并且能够从正反面各自的4条边流过不同的电流。The
如图4及图5所示,在绝缘材料的夹具主体12上形成有与夹持器20电连接的导电图案31A、32A1、32A2、33A、31B、33B、34B1、34B2。在夹具主体12的正面的左区域,如图4所示,多个夹持器21中的位于左区域的夹持器21L的夹紧片31L经由电极15A与导电图案31A连接。多个夹持器22中的位于上区域的夹持器22U的夹紧片32U经由电极15B而与导电图案32A1连接。多个夹持器22中的位于下区域的夹持器22L的夹紧片32L经由电极15B而与导电图案32A2连接。多个夹持器23中的位于左区域的夹持器23L的夹紧片33L经由电极15C而与导电图案33A连接。这些导电图案31A、32A1、32A2、33A例如经由配线36A与端子组35A连接,其中,该端子组35A形成于例如在夹具主体12的上部沿宽度方向突出的突出部16A。As shown in FIGS. 4 and 5 ,
在夹具主体12的正面的右区域,如图4所示,多个夹持器21中的位于右区域的夹持器21R的夹紧片31R经由电极15A与导电图案31B连接。多个夹持器24中的位于上区域的夹持器24U的夹紧片34U经由电极15D而与导电图案34B2连接。多个夹持器24中的位于下区域的夹持器24L的夹紧片34L经由电极15D而与导电图案34B1连接。多个夹持器23中的位于右区域的夹持器23R的夹紧片33R经由电极15C而与导电图案33B连接。这些导电图案31B、33B、34B1、34B2例如经由配线36B与端子组35B连接,其中,该端子组35B形成于例如在夹具主体12的上部沿宽度方向突出的突出部16B。这样,在矩形工件W的正面WF上,能够以上下左右的最大4分割独立地进行电流控制。In the right area of the front surface of the clip
另一方面,在夹具主体12的背面的右区域,如图5所示,多个夹持器21中的位于右区域(从正面观察为左区域)的夹持器21R的夹紧片41R经由电极15E而与导电图案41A连接。多个夹持器22中的位于上区域的夹持器22U的夹紧片42U经由电极15H而与导电图案42A1连接。多个夹持器22中的位于下区域的夹持器22L的夹紧片42L经由电极15H而与导电图案42A2连接。多个夹持器23中的位于右区域(从正面观察为左区域)的夹持器23R的夹紧片43R经由电极15G而与导电图案43A连接。这些导电图案41A、42A1、42A2、43A例如经由配线37A与端子组45A连接,其中,该端子组45A形成于夹具主体12的突出部16A。On the other hand, in the right area of the back surface of the clamp
在夹具主体12的背面的左区域,如图5所示,多个夹持器21中的位于左区域的夹持器21L的夹紧片41L经由电极15E与导电图案41B连接。多个夹持器24中的位于上区域的夹持器24U的夹紧片44U经由电极15F而与导电图案44B1连接。多个夹持器24中的位于下区域的夹持器24L的夹紧片44L经由电极15F而与导电图案44B2连接。多个夹持器23中的位于左区域的夹持器23的夹紧片43经由电极15G而与导电图案43B连接。这些导电图案41B、43B、44B1、44B2例如经由配线37B与形成于夹具主体12的突出部16B的端子组45B连接。这样,即使在矩形工件W的背面WB,也能够以上下左右的最大4分割独立地进行电流控制。In the left area of the rear surface of the
通过对形成于夹具10的正反面的导电图案41A、41B、42A1、42A2、43A、43B、44B1、44B2进行绝缘涂敷,能够防止镀层附着。另外,图4所示的电极15A~15D和图5所示的电极15E~15H被配置于工件W的周缘附近,能够作为虚设电极发挥功能,其中,该虚设电极消除由在工件W的周缘产生的电场集中所引起的镀敷厚度的异常、即所谓的狗骨(dog bone)。为了防止镀层附着和为了调整电极露出量,可以用在相邻的2个夹持器间的区域使电极露出部分可变的能够进行位置调整的绝缘体17A~17D来覆盖图4所示的电极15A~15D和图5所示的电极15E~15H(参照本申请申请人的日本特愿2019-15827号)。Plating adhesion can be prevented by applying insulating coating to the
此外,夹持器也可以覆盖夹具10的孔14中的形成于工件W的周围的微小的间隙来保持工件W。这样,通过夹具10及工件W、以及表面处理槽100A的支承部110、120,能够将表面处理槽100A内大致完全分隔为位于工件W的正反面的第一槽101和第二槽102。In addition, the clamper may hold the workpiece W by covering a slight gap formed around the workpiece W in the
1.4.整流器1.4. Rectifier
在本实施方式中,为了至少独立地设定在工件W的正面WF和背面WB流动的电流,如图6的(A)~图6的(C)所示,优选设置多个整流器。在图6的(A)中,设置有2个整流器300A、300B,整流器300A与和工件W的正面WF接触的夹紧片31~34电连接,整流器300B与和工件W的背面WB接触的夹紧片41~44电连接。通过独立地控制2个整流器300A、300B,能够独立地设定在工件W的正面WF和背面WB流动的电流。这样,即使工件W的正面WF和背面WB上的各自的镀敷面积大不相同,也能够根据镀敷面积或镀敷部位来调整电流。此外,在该情况下,2个整流器300A、300B与第一阳极142及第二阳极152电连接的触点例如配置于第一阳极142及第二阳极152各自的中心。In this embodiment, in order to independently set the currents flowing in at least the front WF and the back WB of the workpiece W, it is preferable to provide a plurality of rectifiers as shown in FIG. 6(A) to FIG. 6(C). In (A) of FIG. 6 , two rectifiers 300A and 300B are provided. The rectifier 300A is electrically connected to the clamping
在图的6(B)中,设置有4个整流器310A~310D,整流器310A与和工件W的正面WF的上区域接触的夹紧片31、32U、34U电连接,整流器310B与和工件W的正面WF的下区域接触的夹紧片33、32L、34L电连接,整流器310C与和工件W的背面WB的上区域接触的夹紧片41、42U、44U电连接,整流器310D与和工件W的背面WB的下区域接触的夹紧片43、42L、44L电连接。这样,在工件W的正面WF和背面WB的各自中,能够独立地控制在工件W的上区域和下区域这2个区域(即,在正反面共计4个区域)中流动的电流。此外,在该情况下,关于4个整流器310A~310D与第一阳极142及第二阳极152电连接的触点,与第一阳极142的上区域、第一阳极142的下区域、第二阳极152的上区域以及第二阳极152的下区域共计4个区域相对应地进行配置。In Figure 6(B), four rectifiers 310A to 310D are provided. The rectifier 310A is electrically connected to the clamping
在图6的(C)中,设置有8个整流器320A~320H,整流器320A与和工件W的正面WF的左上区域接触的夹紧片31L、32U电连接,整流器320B与和工件W的正面WF的左下区域接触的夹紧片32L、33L电连接,整流器320C与和工件W的正面WF的右上区域接触的夹紧片31R、34U电连接,整流器320D与和工件W的正面WF的右下区域接触的夹紧片33R、34L电连接,整流器320E与和工件W的背面WB的左上区域接触的夹紧片41L、44U电连接,整流器320F与和工件W的背面WB的左下区域接触的夹紧片43L、44L电连接,整流器320G与和工件W的背面WB的右上区域接触的夹紧片41R、42U电连接,整流器320H与和工件W的背面WB的右下区域接触的夹紧片42L、43R电连接。这样,在工件W的正面WF和背面WB的各自中,能够独立地控制在工件W的左上区域、左下区域、右上区域和右下区域这4个区域(即,在正反面共计8个区域)中流过的电流。另外,在该情况下,对于8个整流器320A~320H与第一阳极142和第二阳极152电连接的触点,与第一阳极142的左上区域、左下区域、右上区域和右下区域、以及第二阳极152的左上区域、第一阳极142的上区域、第一阳极142的下区域、第二阳极152的上区域及第二阳极152的下区域共计8个区域相对应地进行配置。但是,也可以在正反面共计超过8分割地进行分割。In FIG. 6(C), eight rectifiers 320A to 320H are provided. The rectifier 320A is electrically connected to the
1.5.液体喷出部件1.5. Liquid ejection parts
液体喷出部件200能够包含:配置在工件W的正面WF与第一阳极142之间的第一液体喷出部件200A;和配置在工件W的背面WB与第二阳极152之间的第二液体喷出部件200B。第一液体喷出部件200A通过第一往复移动机构270(第一移动机构)A在与工件W的正面WF平行的往复方向上移动。第二液体喷出部件200B通过第二往复移动机构(第二移动机构)270B在与工件W的背面WB平行的往复方向上移动。关于第一、第二往复移动机构270A、270B,能够利用滑块曲柄机构、偏心凸轮等各种旋转运动-往复直线运动转换机构,在此省略详细的说明。The
在本实施方式中,对工件W的正面WF和背面WB分别设置一个液体喷出部件200A、200B。液体喷出部件200A、200B优选以比工件W的宽度长的移动行程往复移动。这样,液体喷出部件200A、200B不会在与工件W的宽度方向的端部重叠的位置折回。因此,液体喷出部件200成为阴极-阳极之间的电场的影子的时间在工件W的两端和两端以外的位置不会不同。也可以对工件W的正面WF和背面WB的各面设置多个液体喷出部件。这样,能够缩短每一个液体喷出部件的移动行程。但是,液体喷出部件200相对于阳极142、152成为电场的影子的时间根据工件W的区域(例如两端和中央)而不同,在这一点上不利。In this embodiment, one
如图3所示,液体喷出部件200(200A和200B)包含:第一引导体210,其具有与往复方向交叉例如正交的两个面;以及第二引导体220和第三引导体230,它们在第一引导体210的例如两侧与第一引导体210的两个面隔着间隙分别配置。第一~第三引导体210~230中的相邻的各2个引导体构成为在阳极142、152与工件W之间沿着朝向工件W的延伸方向形成、且在与该延伸方向交叉的方向上分离地配置的各一对板材。如图2所示,具有遍及工件W的至少垂直长度延伸的高度。在由第一引导体210和第二引导体220形成的第一一对板材之间形成有第一通路201。在由第一引导体210和第三引导体230形成的第二一对板材之间形成有第二通路202。第一引导体210例如形成得比第二引导体220和第三引导体230长,其两端部比第二引导体220和第三引导体230的对应的端部突出。另外,第一引导体210的与工件W对置的端部例如为末端变细的形状。第一引导体210的靠近阳极箱140、150的一侧的端部固定于与工件W例如平行地延伸的基端部240。第二引导体220和第三引导体230可以还具有与基端部240例如平行地延伸的第四引导体250。在基端部240与从第二引导体220延伸的第四引导体250之间形成有第三通路203。第三通路203与第一通路201连通,向第一通路201引导处理液。同样地,在基端部240与从第三引导体230延伸的第四引导体250之间形成有第四通路204。第四通路204与第二通路202连通,向第二通路202引导处理液。第一引导体210与第二引导体220及第三引导体230通过平板的间隔件260保持一定的间隔地连结。如图2所示,该间隔件260能够在高度方向上隔开间隔地设置多个。As shown in FIG. 3, the liquid ejection member 200 (200A and 200B) includes: a
关于第一液体喷出部件200A,例如其基端部240与例如由第一驱动源280A赋予驱动力的第一往复移动机构270A连结,由此,第一液体喷出部件200A在图2的往复方向A、B上移动。同样地,关于第二液体喷出部件200B,例如其基端部240与例如由第二驱动源280B赋予驱动力的第二往复移动机构270B连结,由此,第二液体喷出部件200B在图2的往复方向A、B上移动。当液体喷出部件200(200A及200B)向图2的往复方向A、B中的图3的前进移动方向A移动时,沿着由第一引导体210和第二引导体220形成的第一一对板材之间的第一通路201引导被第一引导体210阻挡的镀敷液,使其向工件W喷出。在液体喷出部件200A向往复方向A、B中的返回移动方向B移动时,沿着由第一引导体210和第三引导体230形成的第二一对板材之间的第二通路202引导被第一引导体210阻挡的镀敷液,并使其朝向工件W喷出。第二液体喷出部件200B也与第一液体喷出部件200A同样地在向前进移动方向A移动时经由第一通路201使镀敷液朝向工件W喷出,并在向返回移动方向B移动时经由第二通路202使镀敷液朝向工件W喷出。并且,不一定需要设置第一通路201及第二通路202双方。在液体喷出部件200(200A以及200B)的往复方向A、B上的移动的任意情况下,第三通路203和第四通路204例如也可以由倾斜或者弯曲等其他引导体形成,以将处理液引导至至少一对板材间的共用通路。Regarding the first
这样,通过处理液2与工件W碰撞,能够对工件W的主面WF、WB附近的处理液进行搅拌而防止处理液的滞留,而且,还能够将处于阳极箱140、150附近的镀敷成分丰富的新鲜的处理液2供给至工件W。由此,促进了镀敷处理。另外,液体喷出部件200(200A以及200B)能够在图2的纵向上除了间隔件260以外均匀地向工件W喷出处理液2。由于间隔件260能够形成为薄板状,因此不会损害工件W的处理的面内均匀性。In this way, when the processing liquid 2 collides with the workpiece W, the processing liquid near the main surfaces WF and WB of the workpiece W can be stirred to prevent the processing liquid from stagnating, and the plating near the
在此,第一驱动源280A和第二驱动源280B能够不同步地驱动。若第一、第二液体喷出部件200A、200B隔着工件W正对,则会在工件W的同一区域朝向其两面喷出处理液2。在工件W具有贯通两面的通孔的情况下,处理液2难以穿过通孔。在第一、第二液体喷出部件200A、200B的一次往复移动中,若使第一、第二液体喷出部件同步地移动,则第一、第二液体喷出部件正对的位置始终相同,但通过使第一、第二液体喷出部件不同步地移动,能够使第一、第二液体喷出部件正对的位置每次都不同。由此,无论形成于工件W的通孔的位置如何,都能够可靠地向通孔内实施镀敷。另外,第一驱动源280A和第二驱动源280B也可以分别使速度不同地移动液体喷出部件200A、200B。这样,作用于工件W的处理液2的压力在正面和背面WF、WB不同。利用该压力差,能够使处理液容易地通过通孔。在该情况下,既可以使第一驱动源280A和第二驱动源280B同步地驱动,也可以将第一、第二驱动源280A、280B设为同一驱动源。Here, the
另外,保持有工件W的夹具10从上方下降而安装,由此,表面处理槽100A被划分为第一槽101和第二槽102。在此,若使第一、第二液体喷出部件200A、200B往复移动,则被第二、第三引导体220、230阻挡而反弹的液流成为对槽内整体进行搅拌的搅拌流。此时,第一液体喷出部件200A能够搅拌第一槽101内的处理液,第二液体喷出部件200B能够搅拌第二槽102内的处理液,而且,能够排除一方的槽中的搅拌给另一方带来的不良影响。In addition, the
另外,表面处理槽100A可以在2个侧壁部105、106的外侧具有缓冲槽107、108,其中,这2个侧壁部105、106在往复方向A、B上位于两端。形成于侧壁部105的开口105A使第一槽101与缓冲槽107连通。形成于侧壁部105的开口105B使第二槽102与缓冲槽107连通。形成于侧壁部106的开口106A使第一槽101与缓冲槽108连通。形成于侧壁部106的开口106B使第二槽102与缓冲槽108连通。这样,能够使被液体喷出部件200(200A和200B)分别推到处理槽100A的两端的处理液逃逸到缓冲槽107、108中。这样,能够降低在处理槽100A的两端产生的处理液的反射波的影响。另外,也能够经由缓冲槽107、108确保第一槽101与第二槽102之间的处理液的流通。In addition, the
2.第二实施方式2. Second Embodiment
图7是本发明的第二实施方式的表面处理装置的俯视图。在图7中,处理槽100B能够包含第一处理槽100B1和第二处理槽100B2,它们在与往复方向平行的方向上连结且被第一缓冲槽109划分开。夹具可以包含:第一夹具10A,其保持第一工件W1并将第一处理槽100B1划分为第一槽101和第二槽102;以及第二夹具10B,其保持第二工件W2并将第二处理槽100B2划分为第一槽101和第二槽102。在该情况下,第一缓冲槽109可以包含使第一处理槽100B1的第一槽101、第二处理槽100B2的第一槽101、第一处理槽100B1的第二槽102、第二处理槽100B2的第二槽102相互连通的第一~第四开口109A1、109A2、109B1、109B2。另外,第一处理槽100B1可以在设置于往复方向的一端的第一侧壁部105的外侧包含使处理液在第一处理槽100B1中的第一槽101与第二槽102之间流通的第二缓冲槽107。第二处理槽100B2可以在设置于往复方向的另一端的第二侧壁部106的外侧包含使处理液在第二处理槽100B2中的第一槽101与第二槽102之间流通的第三缓冲槽108。这样,能够同时处理第一工件W1和第二工件W2,能够起到与图1的处理槽100A同样的作用和效果。另外,也可以设置中央壁来代替第一缓冲109槽。在该情况下,中央壁可以具有:与第一处理槽100B1的第一槽101和第二处理槽100B2的第一槽101连通的第一开口;以及使第一处理槽100B1的第二槽102和第二处理槽100B2的第二槽102连通的第二开口。但是,在该情况下,无法使第一槽101与第二槽102连通。Fig. 7 is a plan view of a surface treatment device according to a second embodiment of the present invention. In FIG. 7 , the
此外,在第二实施方式中,也可以一体地构成第一夹具10A和第二夹具10B。另外,也可以是,用同一驱动源驱动2个第一液体喷出部件200A,用同一驱动源驱动其他2个第二液体喷出部件200B。另外,表面处理槽可以在广义上连结第一~第N(N为2以上的整数)处理槽而构成。在N≥3的情况下,与位于往复方向上的两端的侧壁部平行地设置(N-1)个间隔壁。In addition, in the second embodiment, the
标号说明Label description
1:表面处理装置;1: Surface treatment device;
2:处理液;2: treatment liquid;
10、10A、10B:夹具;10, 10A, 10B: Fixtures;
12:主体板;12: main board;
13A:下部;13A: lower part;
13B:第一侧部;13B: first side;
13C:第二侧部;13C: second side;
14:矩形开口;14: rectangular opening;
16A、16B:突出片;16A, 16B: protruding pieces;
21、41:第一夹持器;21, 41: the first gripper;
22、42:第二夹持器;22, 42: the second holder;
23、43:第三夹持器;23, 43: the third gripper;
24、44:第四夹持器;24, 44: the fourth holder;
31A~34B2、41A~44B2:导电图案;31A~34B2, 41A~44B2: conductive patterns;
35A、35B、45A、45B:端子组;35A, 35B, 45A, 45B: terminal group;
36A~37B:配线;36A~37B: Wiring;
100A、100B:表面处理槽;100A, 100B: surface treatment tank;
101:第一槽;101: first slot;
102:第二槽;102: second slot;
103、104:开口;103, 104: opening;
105、106:侧壁部;105, 106: side wall part;
105A、105B、106A、106B:开口;105A, 105B, 106A, 106B: openings;
107、108、109:缓冲槽;107, 108, 109: buffer tanks;
109A、109B:第一开口、第二开口;109A, 109B: first opening, second opening;
110:下部支承部;110: lower supporting part;
120:上部支承部;120: upper supporting part;
142:第一阳极;142: first anode;
152:第二阳极;152: second anode;
200(200A、200B):液体喷出部件;200 (200A, 200B): liquid ejection parts;
201~204:第一~第四通路;201~204: the first to the fourth passage;
210:第一引导体;210: the first guiding body;
220:第二引导体;220: the second guiding body;
230:第三引导体;230: the third guiding body;
240:基部;240: base;
250:第四引导体;250: the fourth guide body;
260:间隔件;260: spacer;
270A、270B:移动机构;270A, 270B: moving mechanism;
270A:第一移动机构;270A: first moving mechanism;
270B:第二移动机构;270B: the second moving mechanism;
W:工件;W: workpiece;
WF:第一主面;W F : the first main face;
WB:第二主面。W B : the second principal surface.
Claims (7)
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