CN116018430A - Surface treatment device - Google Patents

Surface treatment device Download PDF

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Publication number
CN116018430A
CN116018430A CN202180054900.2A CN202180054900A CN116018430A CN 116018430 A CN116018430 A CN 116018430A CN 202180054900 A CN202180054900 A CN 202180054900A CN 116018430 A CN116018430 A CN 116018430A
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China
Prior art keywords
tank
workpiece
liquid
treatment
anode
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CN202180054900.2A
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Chinese (zh)
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石井胜己
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Almex Technologies Inc
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Almex Technologies Inc
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Publication of CN116018430A publication Critical patent/CN116018430A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

The surface treatment device comprises: treatment tanks (100A, 100B) for storing a treatment liquid; anodes (142, 152) disposed in the processing tank; a jig (10) for holding a work (W) in a hanging manner and setting the work as a cathode; a liquid ejection member (200) disposed between the anode and the workpiece; and moving mechanisms (270A, 270B) for moving the liquid ejection member relative to the workpiece. The liquid discharge member includes at least one pair of plates (210, 220, 230) formed between the anode and the workpiece along an extending direction toward the workpiece and arranged so as to be separated from each other in a direction intersecting the extending direction, and the processing liquid flowing by the movement of the liquid discharge member is guided between the at least one pair of plates to be discharged toward the workpiece.

Description

Surface treatment device
Technical Field
The present invention relates to a surface treatment apparatus for performing surface treatment such as plating on a workpiece.
Background
In an apparatus for plating a workpiece such as a circuit board, as shown in patent document 1, a plating solution is sprayed toward the workpiece suspended in the plating solution from a plurality of nozzles arranged in the longitudinal direction of a nozzle pipe and provided in the longitudinal direction of the plating solution.
In an apparatus for plating a workpiece such as a circuit board or a semiconductor wafer, a paddle for stirring a processing liquid is used instead of a nozzle tube as disclosed in patent documents 2 and 3. The paddle of patent document 2 is a stirring bar, and the paddle of patent document 3 is a rectangular plate through which a plurality of longitudinal holes are formed, and reciprocates parallel to the main surface of the work. Patent documents 4 to 6 disclose that the nozzle of patent document 1 is provided on the blade of patent document 2 or 3.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2012-046782 (FIG. 5)
Patent document 2: japanese patent laid-open No. 2006-04172 (FIGS. 1-5)
Patent document 3: japanese patent laid-open publication No. 2014-185375 (FIGS. 1, 3-4, 6)
Patent document 4: japanese patent laid-open No. 2004-16129 (FIGS. 1-4)
Patent document 5: japanese patent laid-open No. 56-42976 (FIGS. 1-3)
Patent document 6: japanese patent laid-open No. 10-88397 (FIGS. 1-2)
Disclosure of Invention
Problems to be solved by the invention
However, since the nozzle pipes of patent document 1 are arranged at intervals in the width direction of the workpiece and the nozzles are arranged at intervals in the longitudinal direction on the respective nozzle pipes, it is difficult to uniformly discharge the plating solution to the workpiece. On the other hand, the paddle of patent document 2 merely agitates the plating solution. In patent documents 4 to 6, the processing liquid pumped by the liquid jet pump is ejected from the moving blade toward the workpiece, but the in-plane uniformity of the processing is not improved depending on the position of the nozzle, as in patent document 1. In patent documents 4 to 6, a liquid jet pump is required in addition to a driving source in order to move the paddle.
The invention aims to provide a surface treatment device which does not need a liquid jet pump, can reduce in-plane non-uniformity of treatment liquid sprayed to a workpiece, improves in-plane uniformity of surface treatment of the workpiece, and can improve productivity.
Means for solving the problems
(1) One embodiment of the present invention relates to a surface treatment apparatus, wherein,
the surface treatment device comprises:
a treatment tank for storing a treatment liquid;
an anode disposed in the treatment tank;
a jig for holding a workpiece immersed in the processing liquid so as to hang down the workpiece, the jig setting the workpiece as a cathode;
a liquid ejection member disposed in the processing liquid between the anode and the workpiece; and
a moving mechanism that moves the liquid ejecting member relative to the workpiece,
the liquid discharge member includes at least one pair of plates formed between the anode and the workpiece along an extending direction toward the workpiece and arranged so as to be separated from each other in a direction intersecting the extending direction, and the processing liquid flowing by the movement of the liquid discharge member is guided between the at least one pair of plates and discharged toward the workpiece.
According to one aspect of the present invention, the liquid ejecting member is moved relative to the workpiece suspended in the processing liquid, whereby the processing liquid can be ejected toward the workpiece without using the nozzle pipe. That is, the processing liquid flowing in the processing tank by the movement of the liquid ejecting member is guided between at least one pair of plates and ejected toward the workpiece. Thus, the fresh treatment liquid rich in the surface treatment component located near the anode can be supplied to the workpiece by collision of the treatment liquid with the workpiece, and productivity can be improved. In addition, since the processing liquid can be discharged to the workpiece through at least one pair of plates of the liquid discharge member that moves, the uniformity of the processing in the workpiece surface is improved as compared with the case where the processing liquid is discharged from a plurality of nozzles of the nozzle pipe.
(2) In one embodiment (1) of the present invention, there is provided a surface treatment apparatus, wherein,
the moving mechanism moves the liquid ejecting member in a reciprocating direction parallel to the work,
the liquid ejection part includes:
a first guide body having two surfaces intersecting the reciprocation direction; and
a second guide body and a third guide body which are respectively arranged with a gap from the two surfaces of the first guide body,
the at least one pair of plates includes:
a first pair of plates formed of the first guide body and the second guide body; and
a second pair of plates formed of the first guide body and the third guide body,
when the liquid ejecting member moves in the forward movement direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along the space between the first pair of plates to be ejected toward the workpiece,
when the liquid ejecting member moves in the return movement direction of the reciprocation direction, the processing liquid blocked by the first guide body is guided between the second pair of plates and ejected toward the workpiece.
In this way, the processing liquid guided along the first pair of plates formed by the first and second guide bodies is discharged onto the workpiece when the liquid discharge member moves forward, and the processing liquid guided along the second pair of plates formed by the first and third guide bodies is discharged onto the workpiece when the liquid discharge member moves backward.
(3) In one aspect (2) of the present invention, the anode may include a first anode and a second anode disposed on both sides of the workpiece, the liquid discharge member may include a first liquid discharge member disposed between the first anode and the workpiece, and a second liquid discharge member disposed between the second anode and the workpiece, and the movement mechanism may include a first movement mechanism that moves the first liquid discharge member, and a second movement mechanism that moves the second liquid discharge member. Thus, both surfaces of the workpiece can be processed.
(4) In one embodiment (3) of the present invention, the first liquid discharge member and the second liquid discharge member may be driven asynchronously, and the first driving source may be provided to apply a driving force to the first moving mechanism, and the second driving source may be provided to apply a driving force to the second moving mechanism. When the first and second liquid ejecting members are aligned with each other across the work, the processing liquid is ejected to both sides of the work in the same region of the work. In the case where the work has a through hole penetrating both sides, the treatment liquid is difficult to pass through the through hole. In the first and second liquid ejecting members, if the first and second liquid ejecting members are moved in synchronization with each other, the positions at which the first and second liquid ejecting members face each other are always the same with respect to the workpiece, but by moving the first and second liquid ejecting members out of synchronization with each other, the positions at which the first and second liquid ejecting members face each other can be made different with respect to the workpiece. Thus, the treatment liquid easily passes through the through-hole.
(5) In one embodiment (3) or (4) of the present invention, the processing tank may be divided into a first tank and a second tank by lowering and attaching the jig holding the workpiece from above the processing tank. In this way, the first liquid ejecting member can agitate the processing liquid in the first tank, the second liquid ejecting member can agitate the processing liquid in the second tank, and adverse effects of agitation in one tank on the other tank can be eliminated.
(6) In one aspect (5) of the present invention, the treatment tank may include buffer tanks, which are in communication with the first tank and the second tank and which receive the treatment liquid, outside the 2 side wall portions located at both ends in the reciprocation direction. In this way, the processing liquid pushed by the first liquid ejecting member and the second liquid ejecting member to both ends of the processing tank can be escaped into the buffer tank. In this way, the influence of the reflected wave of the processing liquid generated at both ends of the processing tank can be reduced. In addition, the buffer tank can ensure the flow of the processing liquid between the first tank and the second tank.
(7) In one embodiment (5) of the present invention, the processing tank may include a first processing tank and a second processing tank connected in a direction parallel to the reciprocation direction and divided by a first buffer tank. The clamp can comprise: a first jig that holds a first workpiece and divides the first processing tank into the first tank and the second tank; and a second jig that holds a second workpiece and divides the second processing tank into the first tank and the second tank. The first buffer tank may allow the treatment liquid to flow between the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second tank of the second treatment tank. The first treatment tank may include a second buffer tank located outside a first sidewall portion located at one end in the reciprocation direction, the second buffer tank being configured to circulate the treatment liquid between the first tank and the second tank in the first treatment tank. The second treatment tank may include a third buffer tank for allowing the treatment liquid to flow between the first tank and the second tank in the second treatment tank, on an outer side of the second side wall portion located at the other end in the reciprocation direction. In this way, the first workpiece and the second workpiece can be simultaneously processed, and at this time, the same operations and effects as those of the embodiment (6) of the present invention can be achieved.
Drawings
Fig. 1 is a plan view of a surface treatment apparatus according to a first embodiment of the present invention.
Fig. 2 is a cross-sectional view of the surface treatment apparatus.
Fig. 3 is a diagram for explaining the structure and operation of the liquid ejecting member.
Fig. 4 is a front view of the clamp.
Fig. 5 is a rear view of the clip.
In fig. 6, (a) to (C) of fig. 6 are diagrams showing the relationship between the rectifier and the clamper, respectively.
Fig. 7 is a plan view of a surface treatment apparatus according to a second embodiment of the present invention.
Detailed Description
In the following disclosure, a number of different implementations or examples are provided for implementing different features of the subject matter presented. Of course, these are merely examples and are not intended to be limiting. In addition, in the present disclosure, reference numbers and/or letters are sometimes repeated in each case. Such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, when the description is that the first element and the second element are "connected" or "connected", such description includes an embodiment in which the first element and the second element are directly connected or connected to each other, and also includes an embodiment in which the first element and the second element have 1 or more other elements interposed therebetween and are indirectly connected or connected to each other. In addition, when the description is "movement" of the first element with respect to the second element, such description includes an embodiment of a relative movement in which at least one of the first element and the second element moves with respect to the other.
1. First embodiment
Fig. 1 is a schematic view of a surface treatment apparatus, for example, a plating apparatus, according to the present embodiment. The plating apparatus 1 includes a flat-plate-shaped jig 10 for holding a workpiece W, and a surface treatment tank 100A provided with the jig 10. With respect to the workpiece W, a first major surface (e.g., front surface) W will be in a positive-negative relationship F And a second main surface (e.g. back surface) W B At least one of the surfaces is a surface to be processed, and both surfaces are surfaces to be processed in the present embodiment.
1.1. Surface treatment tank
In fig. 1 and 2, a surface treatment tank 100A for storing a treatment liquid such as a plating liquid 2 has support portions 110 and 120 for detachably supporting a jig 10, and the jig 10 holds a workpiece W in a vertical state. The lower support portion 110 has a slit into which the lower end portion of the jig 10 is inserted. The upper support 120 also has a slit into which the side edge of the jig 10 is inserted. The jig 10 is lowered from the upper opening of the surface treatment tank 100A, and the supported portions 110 and 120 are held in a vertical state. The upper support portion 120 has a terminal group (not shown) that contacts terminal groups 35A, 35B, 45A, 45B of the jig 10, which will be described later. By lowering the jig 10 from above and supporting it by the upper supporting portion 120, the terminal groups 35A, 35B, 45A, 45B of the jig 10 can be connected to a rectifier (not shown) located outside the surface treatment tank 100A. Here, the surface treatment tank 100A is divided into a first tank 101 and a second tank 102 by the support portions 110 and 120, the jig 10 supported by the support portions 110 and 120, and the workpiece W held by the jig 10, as shown in fig. 1 and 2. Further, the first groove 101 and the second groove 102 do not necessarily need to be sealed in a liquid-tight manner. As shown in fig. 1 and 2, the surface treatment tank 100A has openings 103, 104 in its lower portion. The opening 103 is formed facing the first groove, and the opening 104 is formed facing the second groove 102. For example, the adjusted plating solution 2 is supplied from the upper opening to the surface treatment tank 100A, and is discharged from the openings 103 and 104. The discharged plating solution 2 is repeatedly supplied to the surface treatment tank 100A after being subjected to filtration treatment, replenishment of each main component, and the like. The plating solution 2 may be supplied from the openings 103 and 104, and the overflow plating solution may be discharged, for example.
As shown in fig. 1 and 2, the surface treatment tank 100A has front faces W respectively corresponding to the workpieces W F And a back surface W B Opposing anode portions, such as a first anode casing 140 and a second anode casing 150. The first anode casing 140 is held with the front surface W of the workpiece W F The first anode 142 and the second anode box 150 are disposed opposite to each other and are held on the back surface W of the workpiece W B An opposing second anode 152. To perform electroplating, at least one rectifier is connected to the first anode 142 and the second anode 152, and the workpiece W is set as a cathode via the jig 10.
As shown in fig. 1 and 2, the surface treatment tank 100A has a liquid ejection part 200 (200A and 200B) between the workpiece W and the anodes 142, 152. The liquid ejecting member 200 (200A and 200B) is disposed on the main surface W of the workpiece W F 、W B And move in parallel reciprocating directions. Details of the liquid ejecting members 200 (200A and 200B) will be described later.
1.2. Workpiece
The work W is, for example, a rectangular circuit board, and is plated with copper by the plating apparatus 1. However, the kind of plating is not limited. The circuit substrate W may be on the front surface W F And/or back surface W B With vias or through-front-face W F And a back surface W B Is formed in the substrate. In this case, the inner walls of the via and the through hole are also plated. In addition, the front surface W of the workpiece W F Back surface W B The respective plating areas may also be greatly different.
1.3. Clamp
The jig 10 holding the workpiece W will be described with reference to fig. 4 as a front view of the jig 10 and fig. 5 as a rear view of the jig 10. The workpiece W can be attached to and detached from the jig 10 by, for example, an automatic apparatus. The jig 10 has a jig main body 12 formed of, for example, a flat plate made of an insulating material. The jig main body 12 has a rectangular hole 14 having an area slightly larger than that of the rectangular workpiece W. The workpiece W is disposed in the hole 14. The jig 10 has electrodes 15A to 15D shown in fig. 4 and electrodes 15E to 15H shown in fig. 5 along the periphery 4 side of the rectangular hole 14. The electrodes 15A to 15H are insulated from each other. A plurality of holders 20 are held by the electrodes 15A to 15H. The clamper 20 clamps the workpiece W from the front and back sides of the workpiece W. As shown in fig. 4 and 5, holder 20 may comprise: a holder 21 for holding an upper edge portion of the workpiece W; a holder 22 for holding a left edge portion of the workpiece W; a holder 23 for holding a lower edge portion of the workpiece W; and a holder 24 for holding a right edge portion of the workpiece W. The holder 21 here comprises a front face W of the workpiece W F A clamping piece 31 (fig. 4) in contact with the back surface W of the workpiece W B The contacting clamping piece 41 (fig. 5). In the present embodiment, the clamping piece 31 is electrically insulated from the clamping piece 41. Likewise, holder 22 comprises electrically insulating clamping tabs 32, 42, holder 23 comprises electrically insulating clamping tabs 33, 43, and holder 24 comprises electrically insulating clamping tabs 34, 44. In addition, the clamping piece 31 is in communication with the electrode 15A, and the clamping piece 32 is in communication withElectrode 15B is in communication with clamp 33 with electrode 15C, clamp 34 with electrode 15D, clamp 41 with electrode 15E, clamp 42 with electrode 15H, clamp 43 with electrode 15G, and clamp 44 with electrode 15F. In this way, the clamping pieces 31 to 34 and 41 to 44 are insulated from each other, and thus different currents can flow through the front and rear surfaces of the workpiece W, and different currents can flow through the front and rear surfaces from the 4 sides.
As shown in fig. 4 and 5, conductive patterns 31A, 32A1, 32A2, 33A, 31B, 33B, 34B1, 34B2 electrically connected to the holder 20 are formed on the holder body 12 of the insulating material. In the left region of the front face of the jig main body 12, as shown in fig. 4, the clamping piece 31L of the gripper 21L located in the left region among the plurality of grippers 21 is connected to the conductive pattern 31A via the electrode 15A. The clamping piece 32U of the upper-region-located gripper 22U of the plurality of grippers 22 is connected to the conductive pattern 32A1 via the electrode 15B. The clamping piece 32L of the holder 22L located in the lower region of the plurality of holders 22 is connected to the conductive pattern 32A2 via the electrode 15B. The clamp piece 33L of the clamp 23L located in the left region among the plurality of clamps 23 is connected to the conductive pattern 33A via the electrode 15C. These conductive patterns 31A, 32A1, 32A2, 33A are connected to a terminal group 35A, for example, via a wiring 36A, wherein the terminal group 35A is formed on a protruding portion 16A protruding in the width direction, for example, in the upper portion of the jig main body 12.
In the right region of the front face of the jig main body 12, as shown in fig. 4, the clamping piece 31R of the clamper 21R located in the right region among the plurality of clampers 21 is connected to the conductive pattern 31B via the electrode 15A. The clamping piece 34U of the upper-region-located gripper 24U of the plurality of grippers 24 is connected to the conductive pattern 34B2 via the electrode 15D. The clamp piece 34L of the clamp 24L located in the lower region of the plurality of clamps 24 is connected to the conductive pattern 34B1 via the electrode 15D. The grip piece 33R of the grip 23R located in the right region among the plurality of grips 23 is connected to the conductive pattern 33B via the electrode 15C. These conductive patterns 31B, 33B, 34B1, 34B2 are connected to a terminal group 35B formed, for example, on a protruding portion 16B protruding in the width direction at the upper portion of the jig main body 12, for example, via a wiring 36B. Thus, on the front surface W of the rectangular workpiece W F In this way, current control can be independently performed with a maximum of 4 divisions up, down, left, and right.
On the other hand, in the right region of the back surface of the jig main body 12, as shown in fig. 5, the grip piece 41R of the grip 21R located in the right region (left region as viewed from the front) among the plurality of grips 21 is connected to the conductive pattern 41A via the electrode 15E. The grip piece 42U of the grip 22U located in the upper region among the plurality of grips 22 is connected to the conductive pattern 42A1 via the electrode 15H. The grip piece 42L of the grip 22L located in the lower region of the plurality of grips 22 is connected to the conductive pattern 42A2 via the electrode 15H. The grip piece 43R of the gripper 23R located in the right region (left region as viewed from the front) among the plurality of grippers 23 is connected to the conductive pattern 43A via the electrode 15G. These conductive patterns 41A, 42A1, 42A2, 43A are connected to a terminal group 45A, for example, via a wiring 37A, wherein the terminal group 45A is formed on the protruding portion 16A of the jig main body 12.
In the left region of the back surface of the jig main body 12, as shown in fig. 5, the clamping piece 41L of the clamp 21L located in the left region among the plurality of clamps 21 is connected to the conductive pattern 41B via the electrode 15E. The clamping piece 44U of the upper-region-located gripper 24U of the plurality of grippers 24 is connected to the conductive pattern 44B1 via the electrode 15F. The clamping piece 44L of the holder 24L located in the lower region of the plurality of holders 24 is connected to the conductive pattern 44B2 via the electrode 15F. The clamp piece 43 of the clamp 23 located in the left region among the plurality of clamps 23 is connected to the conductive pattern 43B via the electrode 15G. These conductive patterns 41B, 43B, 44B1, 44B2 are connected to a terminal group 45B formed on the protruding portion 16B of the jig main body 12 via, for example, a wiring 37B. Thus, even on the back surface W of the rectangular workpiece W B The current control can be independently performed with a maximum of 4 divisions up, down, left, and right.
By insulating the conductive patterns 41A, 41B, 42A1, 42A2, 43A, 43B, 44B1, 44B2 formed on the front and rear surfaces of the jig 10, adhesion of plating can be prevented. The electrodes 15A to 15D shown in fig. 4 and the electrodes 15E to 15H shown in fig. 5 are arranged near the peripheral edge of the workpiece W, and can function as dummy electrodes that eliminate the so-called dog bones (dog bones) which are abnormalities in plating thickness caused by concentration of an electric field generated at the peripheral edge of the workpiece W. In order to prevent adhesion of plating layers and to adjust the electrode exposure amount, the electrodes 15A to 15D shown in fig. 4 and the electrodes 15E to 15H shown in fig. 5 may be covered with insulators 17A to 17D capable of position adjustment, which make the electrode exposure portions variable in the regions between the adjacent 2 holders (refer to japanese patent application No. 2019-15827 of the applicant of the present application).
The holder may hold the workpiece W by covering a minute gap formed around the workpiece W in the hole 14 of the holder 10. In this way, the interior of the surface treatment tank 100A can be substantially completely divided into the first tank 101 and the second tank 102 located on the front and rear surfaces of the workpiece W by the jig 10, the workpiece W, and the support portions 110 and 120 of the surface treatment tank 100A.
1.4. Rectifier device
In the present embodiment, the workpiece W is independently set on at least the front surface W F And a back surface W B As shown in fig. 6 (a) to 6 (C), a plurality of rectifiers are preferably provided for the flowing current. In fig. 6 (a), 2 rectifiers 300A, 300B are provided, the rectifier 300A and the front face W of the work W F The contact clamping pieces 31 to 34 are electrically connected, and the rectifier 300B is connected to the back surface W of the work W B The contact clamping pieces 41 to 44 are electrically connected. By independently controlling the 2 rectifiers 300A and 300B, the power supply voltage can be independently set on the front surface W of the workpiece W F And a back surface W B A flowing current. Thus, even if the front surface W of the workpiece W F And a back surface W B The plating areas are greatly different from each other, and the current can be adjusted according to the plating area or the plating portion. In this case, contacts electrically connected to the first anode 142 and the second anode 152 by the 2 rectifiers 300A and 300B are disposed at the centers of the first anode 142 and the second anode 152, for example.
In fig. 6 (B), 4 rectifiers 310A to 310D are provided, and the rectifier 310A and the front surface W of the workpiece W are provided F The upper region of the clamping plates 31, 32U, 34U contacting the front surface W of the workpiece W, and a rectifier 310B F The clamping pieces 33, 32L, 34L contacting the lower region of the workpiece W are electrically connected, and the rectifier 310C is connected to the back surface W of the workpiece W B The upper region of the clamping pieces 41, 42U, 44U contacting the upper surface of the workpiece W, and the rectifier 310D is electrically connected to the back surface W of the workpiece W B The clamping pieces 43, 42L, 44L contacting the lower regions of the pair of contact pads are electrically connected. Thus, on the front surface W of the workpiece W F And a back surface W B The current flowing in the 2 regions (i.e., 4 regions in total) of the upper region and the lower region of the workpiece W can be independently controlled. In this case, the contacts of the 4 rectifiers 310A to 310D electrically connected to the first anode 142 and the second anode 152 are arranged corresponding to a total of 4 regions of the upper region of the first anode 142, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152.
In fig. 6 (C), 8 rectifiers 320A to 320H are provided, and the rectifier 320A and the front surface W of the workpiece W are provided F The clamping pieces 31L, 32U contacting the upper left region of the workpiece W are electrically connected, and the rectifier 320B is connected with the front surface W of the workpiece W F The clamping pieces 32L, 33L contacting the lower left region of the workpiece W are electrically connected, and the rectifier 320C is connected with the front surface W of the workpiece W F The clamping pieces 31R, 34U contacting the upper right region of the workpiece W are electrically connected, and the rectifier 320D is connected with the front surface W of the workpiece W F The clamping pieces 33R, 34L contacting the lower right region of the workpiece W are electrically connected, and the rectifier 320E is connected to the back surface W of the workpiece W B The upper left-hand region of the workpiece W is electrically connected to the clamping pieces 41L, 44U, and the rectifier 320F is connected to the back surface W of the workpiece W B The clamping pieces 43L, 44L contacting the lower left region of the workpiece W are electrically connected, and the rectifier 320G is connected to the back surface W of the workpiece W B The clamping pieces 41R, 42U contacting the upper right region of the workpiece W are electrically connected, and the rectifier 320H is connected to the back surface W of the workpiece W B The clamping pieces 42L, 43R contacting the lower right region of the pair are electrically connected. Thus, on the front surface W of the workpiece W F And a back surface W B The currents flowing in the 4 regions (i.e., the total of 8 regions on the front and back surfaces) of the upper left region, the lower left region, the upper right region, and the lower right region of the workpiece W can be independently controlled. In this case, the contacts of the 8 rectifiers 320A to 320H electrically connected to the first anode 142 and the second anode 152 are connected to the upper left region, the lower left region, the upper right region, and the lower right region of the first anode 142, the upper left region of the second anode 152, and the upper region of the first anode 142The domains, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152 are correspondingly arranged for a total of 8 regions. However, the division may be performed so that the total of the front and back sides exceeds 8 divisions.
1.5. Liquid ejecting member
The liquid ejection part 200 can include: is arranged on the front surface W of the workpiece W F A first liquid ejection part 200A between the first anode 142; and is arranged on the back surface W of the workpiece W B And a second liquid ejection part 200B between the second anode 152. The first liquid ejecting member 200A is disposed on the front surface W of the workpiece W by a first reciprocating mechanism 270 (first moving mechanism) a F And move in parallel reciprocating directions. The second liquid ejecting member 200B is disposed on the rear surface W of the workpiece W by a second reciprocating mechanism (second moving mechanism) 270B B And move in parallel reciprocating directions. The first and second reciprocating mechanisms 270A and 270B can be various rotary motion-reciprocating linear motion conversion mechanisms such as a slider crank mechanism and an eccentric cam, and detailed description thereof is omitted here.
In the present embodiment, the front surface W of the workpiece W F And a back surface W B One liquid ejection member 200A, 200B is provided, respectively. The liquid ejection members 200A, 200B preferably reciprocate with a travel longer than the width of the workpiece W. In this way, the liquid ejection members 200A, 200B are not folded back at positions overlapping the widthwise ends of the workpiece W. Therefore, the time at which the liquid ejecting member 200 becomes a shadow of the electric field between the cathode and the anode is not different between the both ends of the workpiece W and the positions other than the both ends. Or the front surface W of the workpiece W F And a back surface W B A plurality of liquid ejection members are provided on each surface of the sheet. In this way, the moving stroke of each liquid ejection member can be shortened. However, the time for which the liquid ejecting member 200 becomes a shadow of the electric field with respect to the anode 142, 152 varies depending on the region (for example, both ends and the center) of the workpiece W, which is disadvantageous in this point.
As shown in fig. 3, the liquid ejection part 200 (200A and 200B) includes: a first guide body 210 having two surfaces intersecting, for example, orthogonal to the reciprocation direction; and a second guide 220 and a third guide 230, which are disposed on both sides of the first guide 210, for example, with a gap between both surfaces of the first guide 210. Each of the adjacent 2 guide bodies among the first to third guide bodies 210 to 230 is configured as a pair of plate materials that are formed between the anode 142, 152 and the workpiece W along the extending direction toward the workpiece W and are arranged so as to be separated in the direction intersecting the extending direction. As shown in fig. 2, has a height extending throughout at least the vertical length of the workpiece W. A first passage 201 is formed between a first pair of plates formed by the first guide body 210 and the second guide body 220. A second passage 202 is formed between a second pair of plates formed by the first guide body 210 and the third guide body 230. The first guide body 210 is formed longer than the second guide body 220 and the third guide body 230, for example, and both ends thereof protrude from the corresponding ends of the second guide body 220 and the third guide body 230. The end of the first guide body 210 facing the workpiece W is tapered, for example. The end portion of the first guide body 210 on the side close to the anode boxes 140, 150 is fixed to a base end portion 240 extending parallel to the workpiece W, for example. The second guide body 220 and the third guide body 230 may further have a fourth guide body 250 extending, for example, parallel to the base end portion 240. A third passage 203 is formed between the base end 240 and a fourth guide body 250 extending from the second guide body 220. The third passage 203 communicates with the first passage 201, and guides the processing liquid to the first passage 201. Similarly, a fourth passage 204 is formed between the base end 240 and a fourth guide 250 extending from the third guide 230. The fourth passage 204 communicates with the second passage 202, and guides the processing liquid to the second passage 202. The first guide body 210 is connected to the second guide body 220 and the third guide body 230 with a constant gap therebetween by a flat spacer 260. As shown in fig. 2, the spacers 260 may be provided in plurality at intervals in the height direction.
In the first liquid ejection member 200A, for example, the base end portion 240 thereof is coupled to a first reciprocating mechanism 270A to which a driving force is applied by a first driving source 280A, for example, whereby the first liquid ejection member 200A moves in the reciprocating direction A, B of fig. 2. Similarly, in the second liquid ejection member 200B, for example, the base end portion 240 thereof is coupled to the second reciprocating mechanism 270B to which a driving force is applied by the second driving source 280B, for example, whereby the second liquid ejection member 200B moves in the reciprocating direction A, B of fig. 2. When the liquid discharge member 200 (200A and 200B) moves in the forward movement direction a of fig. 3 in the reciprocation direction A, B of fig. 2, the plating liquid blocked by the first guide body 210 is guided along the first passage 201 between the first pair of plate materials formed by the first guide body 210 and the second guide body 220 and discharged toward the workpiece W. When the liquid discharge member 200A moves in the return movement direction B in the reciprocation direction A, B, the plating liquid blocked by the first guide body 210 is guided along the second passage 202 between the second pair of plates formed by the first guide body 210 and the third guide body 230, and discharged toward the workpiece W. The second liquid discharge member 200B also discharges the plating liquid toward the workpiece W through the first passage 201 when moving in the forward moving direction a, and discharges the plating liquid toward the workpiece W through the second passage 202 when moving in the backward moving direction B, similarly to the first liquid discharge member 200A. Further, it is not necessarily required to provide both the first passage 201 and the second passage 202. In any case of movement of the liquid ejecting member 200 (200A and 200B) in the reciprocation direction A, B, the third passage 203 and the fourth passage 204 may be formed of, for example, other guide bodies such as inclined or bent members so as to guide the processing liquid to a common passage between at least one pair of the plates.
In this way, the processing liquid 2 collides with the workpiece W, thereby being capable of aligning the main surface W of the workpiece W F 、W B The nearby treatment liquid is stirred to prevent the stagnation of the treatment liquid, and the fresh treatment liquid 2 rich in plating components in the vicinity of the anode tanks 140 and 150 can be supplied to the workpiece W. Thereby, the plating treatment is promoted. The liquid discharge members 200 (200A and 200B) can discharge the processing liquid 2 to the workpiece W uniformly except for the spacers 260 in the longitudinal direction of fig. 2. Since the spacers 260 can be formed in a thin plate shape, the in-plane uniformity of the processing of the workpiece W is not impaired.
Here, the first driving source 280A and the second driving source 280B can be driven asynchronously. When the first and second liquid discharge members 200A and 200B face each other across the workpiece W, the treatment liquid 2 is discharged toward both surfaces of the workpiece W in the same region of the workpiece W. In the case where the work W has a through hole penetrating both sides, the processing liquid 2 is difficult to pass through the through hole. In one reciprocation of the first and second liquid ejection members 200A, 200B, if the first and second liquid ejection members are moved synchronously, the positions at which the first and second liquid ejection members face each other are always the same, but by moving the first and second liquid ejection members asynchronously, the positions at which the first and second liquid ejection members face each other can be made different each time. Thus, plating can be reliably performed into the through hole regardless of the position of the through hole formed in the work W. The first drive source 280A and the second drive source 280B may move the liquid ejecting members 200A and 200B at different speeds. Thus, the pressure of the processing liquid 2 applied to the work W is different between the front and rear surfaces WF, WB. By this pressure difference, the treatment liquid can easily pass through the through-hole. In this case, the first drive source 280A and the second drive source 280B may be driven in synchronization, or the first and second drive sources 280A and 280B may be the same drive source.
Further, the jig 10 holding the workpiece W is lowered from above and attached, whereby the surface treatment tank 100A is divided into a first tank 101 and a second tank 102. Here, when the first and second liquid ejecting members 200A and 200B are reciprocated, the liquid flow blocked by the second and third guide bodies 220 and 230 and rebounded becomes a stirring flow for stirring the entire inside of the tank. At this time, the first liquid discharge member 200A can agitate the processing liquid in the first tank 101, and the second liquid discharge member 200B can agitate the processing liquid in the second tank 102, and the adverse effect of agitation in one tank on the other can be eliminated.
In addition, the surface treatment tank 100A may have buffer tanks 107, 108 on the outer sides of the 2 side wall portions 105, 106, wherein the 2 side wall portions 105, 106 are located at both ends in the reciprocation direction A, B. An opening 105A formed in the side wall portion 105 communicates the first groove 101 with the buffer groove 107. An opening 105B formed in the side wall portion 105 communicates the second groove 102 with the buffer groove 107. An opening 106A formed in the side wall portion 106 communicates the first groove 101 with the buffer groove 108. An opening 106B formed in the side wall portion 106 communicates the second groove 102 with the buffer groove 108. In this way, the processing liquid pushed by the liquid ejection members 200 (200A and 200B) to both ends of the processing tank 100A can be escaped into the buffer tanks 107 and 108. In this way, the influence of the reflected waves of the processing liquid generated at both ends of the processing tank 100A can be reduced. In addition, the flow of the processing liquid between the first tank 101 and the second tank 102 can be ensured via the buffer tanks 107 and 108.
2. Second embodiment
Fig. 7 is a plan view of a surface treatment apparatus according to a second embodiment of the present invention. In fig. 7, the processing bath 100B can include a first processing bath 100B1 and a second processing bath 100B2, which are connected in a direction parallel to the reciprocation direction and partitioned by a first buffer bath 109. The jig may comprise: a first jig 10A that holds a first workpiece W1 and divides the first processing tank 100B1 into a first tank 101 and a second tank 102; and a second jig 10B that holds the second workpiece W2 and divides the second processing tank 100B2 into a first tank 101 and a second tank 102. In this case, the first buffer tank 109 may include first to fourth openings 109A1, 109A2, 109B1, and 109B2 for communicating the first tank 101 of the first processing tank 100B1, the first tank 101 of the second processing tank 100B2, the second tank 102 of the first processing tank 100B1, and the second tank 102 of the second processing tank 100B2 with each other. The first processing tank 100B1 may include a second buffer tank 107 for allowing the processing liquid to flow between the first tank 101 and the second tank 102 in the first processing tank 100B1, outside the first side wall 105 provided at one end in the reciprocation direction. The second processing tank 100B2 may include a third buffer tank 108 for allowing the processing liquid to flow between the first tank 101 and the second tank 102 in the second processing tank 100B2, outside the second side wall 106 provided at the other end in the reciprocation direction. In this way, the first workpiece W1 and the second workpiece W2 can be processed simultaneously, and the same operations and effects as those of the processing bath 100A of fig. 1 can be obtained. In addition, a central wall may be provided instead of the first buffer 109 groove. In this case, the central wall may have: a first opening communicating with the first tank 101 of the first treatment tank 100B1 and the first tank 101 of the second treatment tank 100B 2; and a second opening that communicates the second tank 102 of the first processing tank 100B1 and the second tank 102 of the second processing tank 100B 2. However, in this case, the first groove 101 cannot be communicated with the second groove 102.
In the second embodiment, the first jig 10A and the second jig 10B may be integrally formed. Further, 2 first liquid ejection members 200A may be driven by the same driving source, and other 2 second liquid ejection members 200B may be driven by the same driving source. The surface treatment tank may be formed by connecting first to nth (N is an integer of 2 or more) treatment tanks in a broad sense. When N is not less than 3, N-1 partition walls are provided in parallel with the side wall portions at both ends in the forward direction.
Description of the reference numerals
1: a surface treatment device;
2: a treatment liquid;
10. 10A, 10B: a clamp;
12: a main body plate;
13A: a lower part;
13B: a first side portion;
13C: a second side portion;
14: a rectangular opening;
16A, 16B: a protruding piece;
21. 41: a first gripper;
22. 42: a second gripper;
23. 43: a third gripper;
24. 44: a fourth gripper;
31A to 34B2, 41A to 44B2: a conductive pattern;
35A, 35B, 45A, 45B: a terminal group;
36A to 37B: wiring;
100A, 100B: a surface treatment tank;
101: a first groove;
102: a second groove;
103. 104: an opening;
105. 106: a side wall portion;
105A, 105B, 106A, 106B: an opening;
107. 108, 109: a buffer tank;
109A, 109B: a first opening, a second opening;
110: a lower support portion;
120: an upper support portion;
142: a first anode;
152: a second anode;
200 (200A, 200B): a liquid ejection part;
201 to 204: first to fourth passages;
210: a first guide body;
220: a second guide body;
230: a third guide body;
240: a base;
250: a fourth guide body;
260: a spacer;
270A, 270B: a moving mechanism;
270A: a first moving mechanism;
270B: a second moving mechanism;
w: a workpiece;
W F : a first major face;
W B : a second major face.

Claims (7)

1. A surface treatment device is characterized in that,
the surface treatment device comprises:
a treatment tank for storing a treatment liquid;
an anode disposed in the treatment tank;
a jig for holding a workpiece immersed in the processing liquid so as to hang down the workpiece, the jig setting the workpiece as a cathode;
a liquid ejection member disposed in the processing liquid between the anode and the workpiece; and
a moving mechanism that moves the liquid ejecting member relative to the workpiece,
the liquid discharge member includes at least one pair of plates formed between the anode and the workpiece along an extending direction toward the workpiece and arranged so as to be separated from each other in a direction intersecting the extending direction, and the processing liquid flowing by the movement of the liquid discharge member is guided between the at least one pair of plates and discharged toward the workpiece.
2. A surface treatment apparatus according to claim 1, wherein,
the moving mechanism moves the liquid ejecting member in a reciprocating direction parallel to the work,
the liquid ejection part includes:
a first guide body having two surfaces intersecting the reciprocation direction; and
a second guide body and a third guide body which are respectively arranged with a gap from the two surfaces of the first guide body,
the at least one pair of plates includes:
a first pair of plates formed of the first guide body and the second guide body; and
a second pair of plates formed of the first guide body and the third guide body,
when the liquid ejecting member moves in the forward movement direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along the space between the first pair of plates to be ejected toward the workpiece,
when the liquid ejecting member moves in the return movement direction of the reciprocation direction, the processing liquid blocked by the first guide body is guided between the second pair of plates and ejected toward the workpiece.
3. A surface treatment apparatus according to claim 2, wherein,
the anode comprises a first anode and a second anode which are arranged on two sides of the workpiece,
the liquid ejection part includes: a first liquid ejection member disposed between the first anode and the workpiece; and a second liquid ejecting member disposed between the second anode and the workpiece,
the moving mechanism includes: a first moving mechanism that moves the first liquid ejecting member; and a second moving mechanism that moves the second liquid ejection member.
4. A surface treatment apparatus according to claim 3, wherein,
the surface treatment apparatus further includes a first driving source that imparts a driving force to the first moving mechanism and a second driving source that imparts a driving force to the second moving mechanism, and the first liquid ejection member and the second liquid ejection member are driven asynchronously.
5. A surface treatment apparatus according to claim 3 or 4, wherein,
the jig holding the workpiece is installed by being lowered from above the processing tank, whereby the processing tank is divided into a first tank and a second tank.
6. A surface treatment apparatus according to claim 5, wherein,
the treatment tank includes buffer tanks outside the 2 side wall parts, wherein the 2 side wall parts are positioned at two ends of the treatment tank in the reciprocating direction, and the buffer tanks are communicated with the first tank and the second tank to store the treatment liquid.
7. A surface treatment apparatus according to claim 5, wherein,
the treatment tank includes a first treatment tank and a second treatment tank connected in a direction parallel to the reciprocation direction and divided by a first buffer tank,
the clamp comprises: a first jig that holds a first workpiece and divides the first processing tank into the first tank and the second tank; and a second jig which holds a second workpiece and divides the second processing tank into the first tank and the second tank,
the first buffer tank allows the treatment liquid to flow between the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second tank of the second treatment tank,
the first treatment tank includes a second buffer tank for allowing the treatment liquid to flow between the first tank and the second tank in the first treatment tank, on an outer side of a first side wall portion located at one end in the reciprocation direction,
the second treatment tank includes a third buffer tank for allowing the treatment liquid to flow between the first tank and the second tank in the second treatment tank, on an outer side of the second side wall portion located at the other end in the reciprocation direction.
CN202180054900.2A 2020-09-16 2021-09-07 Surface treatment device Pending CN116018430A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-155212 2020-09-16
JP2020155212 2020-09-16
PCT/JP2021/032786 WO2022059554A1 (en) 2020-09-16 2021-09-07 Surface treatment device

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CN116018430A true CN116018430A (en) 2023-04-25

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CN (1) CN116018430A (en)
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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6389700A (en) * 1986-10-03 1988-04-20 C Uyemura & Co Ltd Plating liquid injection type plating treatment device
JP4365143B2 (en) 2003-06-16 2009-11-18 株式会社荏原製作所 Method for stirring plating treatment liquid and plating treatment apparatus
JP2006041172A (en) 2004-07-27 2006-02-09 Univ Waseda Method and device for plating printed wiring board having through hole
JP6761763B2 (en) * 2017-02-06 2020-09-30 株式会社荏原製作所 Paddles, plating equipment with the paddles, and plating methods
JP6790016B2 (en) * 2018-04-10 2020-11-25 上村工業株式会社 Surface treatment equipment, surface treatment method and paddle

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TW202227676A (en) 2022-07-16

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