WO2019078065A1

WO2019078065A1 - Surface treatment device

Info

Publication number: WO2019078065A1
Application number: PCT/JP2018/037758
Authority: WO
Inventors: 勝己石井; 重幸渡邉
Original assignee: アルメックスＰｅ株式会社
Priority date: 2017-10-20
Filing date: 2018-10-10
Publication date: 2019-04-25
Also published as: JP6875758B2; PH12020550789A1; TWI677599B; CN111247274A; KR20200073243A; JPWO2019078065A1; TW201923165A

Abstract

A surface treatment device (1) having: treatment tanks (3–1 – 3–n) that have arranged therein a plurality of nozzle tubes (60) that spray treatment fluid on to a plurality of workpieces (2) to be immersed in treatment fluid; and a plurality of treatment fluid circulation devices (100). Each of the plurality of treatment fluid circulation devices: is connected to a respective one of a plurality of divided regions (6), which divide the treatment tanks in the longitudinal direction thereof and each include at least one of the plurality of nozzle tubes; and adjusts the treatment fluid recovered from each of the divided regions (6) and returns and supplies the same to at least one nozzle tube provided in each of the divided regions (6).

Description

Surface treatment equipment

The present invention relates to a surface treatment apparatus such as a plating apparatus, and more particularly to a treatment liquid circulation system for adjusting a treatment liquid collected from a treatment tank and returning it to the treatment tank.

The plating apparatus contains a plating solution in a processing tank. Patent Document 1 discloses a plating apparatus provided with an impurity removing means consisting of a pump and a filter outside the plating tank. The plating solution is discharged from the bottom of the plating tank, and a clean plating solution without slime is circulated from the bottom of the plating tank back to the inside of the plating tank by the means for removing impurities. Further, since plating components such as copper oxide are consumed by plating on a work, copper oxide is conventionally supplied from a part of a long plating tank.

Japanese Patent Application Publication No. 2003-013291

In Patent Document 1, when the clean plating solution discharged from the bottom of the plating tank and from which the slime is removed by the impurity removing means is returned from the bottom of the plating tank and circulated in the plating tank, the plating solution cleans in the plating tank. Not evenly distributed. Further, conventionally, since consumed copper oxide has been supplied from a part of a long plating tank, there is a problem that the concentration of the plating solution in the processing tank varies.

An object of at least one aspect of the present invention is to provide a surface treatment apparatus capable of substantially equalizing the concentration of fresh treatment liquid in a treatment tank.

(1) One aspect of the present invention is
A treatment tank in which a plurality of nozzle tubes are disposed to eject the treatment liquid to a plurality of workpieces immersed in the treatment liquid;
Multiple treatment liquid circulation devices,
Have
Each of the plurality of processing liquid circulation devices is divided into a plurality of portions in the longitudinal direction of the processing tank, and each is connected to each one of a plurality of divided regions including at least one of the plurality of nozzle tubes, The present invention relates to a surface treatment apparatus for adjusting a treatment liquid collected from each one of the divided areas and returning the solution to the at least one nozzle pipe provided in each one of the plurality of divided areas.

According to one aspect of the present invention, each of the plurality of treatment liquid circulation devices adjusts the treatment liquid collected from each one of the plurality of divided regions obtained by dividing the treatment tank in the longitudinal direction, to obtain the plurality of divided regions. Can be fed back to at least one nozzle tube provided in each one of Therefore, the concentration of the fresh processing solution after adjustment is substantially equal among the plurality of divided regions. Moreover, in each divided area of the processing tank, fresh processing liquid is jetted from the at least one nozzle pipe toward the work, so that the fresh processing liquid is dispersed in each divided area, and even in each divided area. The concentration of the processing solution is almost even. The divided area of the processing tank is not limited to the physically divided one, as long as the processing liquid is collected at least for each divided area.

(2) In one aspect (1) of the present invention, each of the plurality of processing liquid circulation devices is for resupplying the processing liquid recovered by the circulation pump and the circulation pump from one of the plurality of divided regions. And a control tank configured to adjust the processing solution, and the processing liquid for resupply from the control tank can be returned and supplied to the at least one nozzle pipe by the circulation pump. In this case, the treatment liquid collected by the circulation pump can be collectively adjusted in the adjustment tank, and the treatment liquid for resupply from the adjustment tank can be returned to the at least one nozzle pipe by the circulation pump.

(3) In one aspect (2) of the present invention, the adjusting tank can carry out at least one of charging of a component to be consumed and temperature adjustment to the recovered treatment liquid. The components to be consumed are, for example, plating components and additives in the processing solution when the surface treatment is plating. The plating component is, for example, copper oxide in the case of copper plating. The additive is, for example, a brightening agent, a smoothing agent, etc. in the case of plating. The temperature adjustment is to adjust the temperature of the treatment liquid to the optimum temperature inherent to the surface treatment. By any of these adjustments, the recovered treatment liquid is adjusted to a fresh re-supplying treatment liquid. For example, the concentration of plating components, additives, etc. in the recovered processing solution, or the temperature of the processing solution may be monitored by a sensor, and the concentration or temperature may be adjusted when the value is out of the proper value.

(4) In one aspect (2) of the present invention, the treatment liquid in the treatment tank is discharged from the bottom side of the treatment tank and collected, and each of the plurality of treatment liquid circulation devices is supplied from the adjustment tank And a filter for filtering the resupplying treatment liquid. Impurities such as heavy waste having a high specific gravity mixed in the treatment liquid in the treatment tank are collected at the bottom of the treatment tank. These impurities can be recovered together with the processing solution discharged from the bottom side of the processing tank and can be removed by a filter.

(5) In one aspect (4) of the present invention, the processing solution may further include an overflow tank adjacent to the processing tank, and the processing liquid in the processing tank may be discharged and recovered through the overflow tank. Impurities having a low specific gravity mixed in the treatment liquid in the treatment tank float on the upper portion of the treatment liquid in the treatment tank. These impurities are discharged and recovered through the overflow tank together with the processing solution overflowed from the processing tank, and can be similarly removed by a filter.

(6) In one aspect (1) to (5) of the present invention, the surface treatment apparatus is formed by connecting a plurality of processing units in the longitudinal direction, and each of the plurality of processing units has the treatment liquid Each of the plurality of processing liquid circulation devices may be connected to the divided processing tank of each of the plurality of processing units. As described above, in the case where the surface treatment apparatus is configured by connecting a plurality of treatment units, the treatment liquid circulation devices can be attached to each treatment unit. However, two or more processing liquid circulation devices may be attached to each processing unit.

It is a schematic sectional drawing of the plating process part in the plating apparatus of the intermittent conveyance system which concerns on embodiment of this invention. It is a schematic plan view of one processing unit of the plating apparatus shown in FIG. It is a figure which shows the positional relationship of the workpiece | work stopped within one processing unit, and an anode. It is a perspective view of a conveyance jig which conveys a work. It is a figure which shows typically the connection of the electroconductive part on an anode, a cathode rail, and a rectifier. 6 (A) and 6 (B) are a front view and a cross-sectional view of a cathode rail. It is a plane which shows a nozzle pipe reciprocated horizontally scanning movement in a cell. It is a figure which shows the arrangement pitch of the jet nozzle of a nozzle pipe | tube. It is a figure which shows typically the process liquid circulation apparatus connected to a division | segmentation process tank.

Hereinafter, preferred embodiments of the present invention will be described in detail. Note that the present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are essential as the solution means of the present invention. Not necessarily.

1. Plural Processing Units FIG. 1 is a cross-sectional view of a plating apparatus (surface treatment apparatus in a broad sense) according to the present embodiment. In FIG. 1, the plating apparatus 1 is configured by connecting one or more processing units 3-1 to 3-n (n is a natural number) to a plating processing unit for plating a workpiece 2 such as a circuit board. The plurality of processing units 3-1 to 3-n may have substantially the same structure. In each of the plurality of processing units 3-1 to 3-n, the workpiece 2 may be transported continuously, or the workpiece 2 may be transported intermittently. In the case of the intermittent conveyance type plating apparatus 1, at least one of the plurality of processing units 3-1 to 3-n, M (M is an integer of 2 or more) in FIG. 2 can be intermittently stopped. FIG. 1 shows a workpiece 2 of the maximum size, and the plating apparatus 1 has versatility to be able to process the workpiece 2 below the maximum size. Hereinafter, the intermittent conveyance type plating apparatus 1 will be described as an example.

The workpiece 2 is sequentially intermittently transported in the A direction from the current stop position to the next stop position by an intermittent transport device such as a pusher. In the present embodiment, one work 2 is stopped at four places in each processing unit. The loading unit 4 may be connected to the upstream side of the processing unit 3-1 at the most upstream position. The loading unit 4 may load the workpiece 2 by the downward movement in the B direction. When the workpiece 2 in the processing unit 3-1 is intermittently transported, the workpiece 2 in the loading unit 4 is also intermittently transported and moved to the processing unit 3-1. An unloading unit 5 may be connected to the downstream side of the most downstream processing unit 3-n for lifting the workpiece 2 horizontally moved from the processing unit 3-n in the C direction and unloading it. Before the workpiece 2 in the processing unit 3-n is intermittently transported, the workpiece 2 in the unloading unit 5 is unloaded upward. However, the loading unit 4 and / or the unloading unit 5 may be omitted. In this case, the work 2 is lowered to the most upstream stop position of the processing unit 3-1, and the work 2 at the most downstream stop position of the processing unit 3-n is lifted and carried out.

FIG. 2 is a plan view of the processing unit 3-1 having the same configuration as the processing units 3-2 to 3-n. The processing unit 3-1 includes a divided processing tank 6 in which a plating solution (processing solution in a broad sense) is stored. The workpiece 2 is immersed in the plating solution in the division processing tank 6. The divided processing tank 6 is a substantially box-like member opened at the upper side, and

openings

6A and 6B are provided in the upstream and downstream partitions respectively, and between the adjacent units (processing unit, loading unit or unloading unit) The horizontal movement of the work 2 is allowed at.

In the present embodiment, at least one anode 20 is provided on at least one side of the front surface and the back surface of the plurality of, for example, four stop positions in the processing unit 3-1. In the present embodiment, an anode 20A opposed to the front surface of each one work 2 at each stop position and an anode 20B opposed to the back surface of the work 2 are provided. Each of the anodes 20 (20A, 20B) can include a plurality of split anodes that are in electrical communication with one another. In this embodiment, it is divided into an upstream divided anode 20A1 (20B1) and a downstream divided anode 20A2 (20B2). The anode 20 may include divided anodes divided into three or more, but can be regarded as one anode because they are electrically connected to each other.

FIG. 3 is a front view showing the positional relationship between the anodes 20A1 and 20A2 (20B1 and 20B2) disposed in the processing unit 3-1 and the work 2. As shown in FIG. 3, the work 2 is held by the transfer jig 30. As shown in FIGS. 2 and 3, each of the anodes 20 (20A, 20B) is disposed at a position facing the workpiece 2 at four stop positions. The point is, as shown in FIG. 2, it is sufficient to form a uniform electric field between the work 2 set to the cathode and the anode 20. The contour of the anode shown in FIGS. 2 and 3 is rectangular regardless of the shape of the anode 20, but the contour in plan view may be circular. The anode may be an insoluble anode or a soluble anode.

In the present embodiment, it is possible to have a shielding plate 23 which divides one processing unit 3-1 into four cells 11-1 to 11-4. In each of the cells 11-1 to 11-4, anodes 20 (20A1, 20A2, 20B1, and 20B2) are disposed on both sides of the work 2 in a plan view. The shielding plate 23 is provided to block the influence of the electric field between the adjacent cells (the electric field between the anode and the cathode shown by the arrow in FIG. 2). The shielding plate 23 is formed with an opening 23A through which the workpiece 2 passes.

2. Conveying Jig FIG. 4 shows an example of the conveying jig 30. The transfer jig 30 includes a horizontal arm 300, a vertical arm 310, a workpiece holder 320, a guided portion 330, a power receiving portion 340, and a pushed piece 350. The horizontal arm unit 300 extends in a direction B orthogonal to the intermittent conveyance direction A. The vertical arm unit 310 is suspended by the horizontal arm unit 300 and held. The workpiece holding unit 320 is fixed to the vertical arm unit 310. The workpiece holding unit 320 includes an upper frame 321 and a lower frame 322 supported by the upper frame 321, for example, to be able to move up and down. The upper frame 321 is provided with a plurality of clampers 323 for clamping the upper portion of the work 2. The lower frame 322 is provided with a plurality of clampers 324 for clamping the lower part of the work 2. A downward tension is applied to the work 2 by the lower clamper 324. However, when the work 2 is thick or when power is not supplied from the lower part of the work 2, the lower frame 322 and the clamper 324 may be omitted.

The guided portion 330 is disposed along the processing units 3-2 to 3-n, and is guided, for example, to a guide rail (not shown) divided into each of the processing units 3-2 to 3-n. The tool 30 is linearly guided. The guided portion 330 can include a roller 331 in rolling contact with the top surface of the guide rail, and a roller 332 in rolling contact with both side surfaces of the guide rail (only rollers in rolling contact with one side surface in FIG. 4).

The power-supplied portion 340 contacts the cathode rail described in FIGS. 5 and 6, and sets the work 2 as a cathode via the horizontal arm portion 300, the vertical arm portion 310, and the work holding portion 320 of the transfer jig 30. Do. The power-supplied portion 340 includes two

contacts

342 and 343 supported on the upstream side and the downstream side of the support arm 341 extending along the intermittent transport direction A. The

contacts

342 and 343 are supported by the support arm 341 via a parallel link mechanism, and are spring biased so as to be pressed against the cathode rail. The two

contacts

342 and 343 are electrically connected to at least one of the

clampers

323 and 324 to set the work 2 as a cathode.

The pushed piece 350 is fixed to, for example, the vertical arm unit 310, and is disposed with the pushed surface vertical at a position directly above the workpiece holding unit 320. The pushed piece 350 is pushed from the direction of illustration C by an intermittent conveyance device described later to transmit the intermittent conveyance force to the conveyance jig 30. In addition, the engaged part 360 used at the time of continuous conveyance is provided in the conveyance jig 30 shown in FIG. 4, and the conveyance jig 30 can be used for both intermittent conveyance and continuous conveyance.

3. Cathode Rail and Rectifier As shown in FIG. 5, each processing unit 3-1 to 3-n (FIG. 5 shows only two processing units) has at least one cathode rail. A plurality of cathode rails 40 may be arranged in parallel in parallel with the transport direction A. In this case, the plurality of cathode rails 40 may be connected to the same rectifier, or may be connected to different rectifiers to control the current value independently for each feeding site. In the present embodiment, one cathode rail 40 is provided. One cathode rail 40 is preferably divided into a plurality of divided cathode rails 40-1 to 40-n (two divided cathode rails 40-1 and 40 in FIG. 5) divided into processing units 3-1 to 3-n. (Only shows -2), and is connected continuously in the transport direction A. As shown in FIGS. 5 and 6A, each of the divided cathode rails 40-1 to 40-n opens the gap (non-conductive portion) 42 on the insulating rail 41, and the work 2 is stopped. A total of four conductive parts 43 are provided for each cell. Each of the four conductive portions 43 holds and stops the work 2 at the four stop positions of each of the processing units 3-1 to 3-n. Electrically conducted with the two contacts 342, 343). Note that FIG. 5 shows the liquid level L of the plating solution contained in each of the processing units 3-1 to 3-n, and the work 2 is immersed in the plating solution. As shown in FIG. 6B, dividing

walls

44 and 44 are provided at both ends in the width direction of the cathode rail 40, and a non-oil-based conductive fluid (for example, water) 45 is held on the conductive portion 43. Can. In this case, the electrical contact between the power-supplied portion 340 (the two contacts 342 and 343) and the conductive portion 43 can be secured more reliably via the conductive fluid 45. However, since the conductivity of water is much lower than the conductivity of the conductive portion 43 which is a metal, the insulation between the adjacent conductive portions 43 is maintained. Also, as shown in FIG. 6B, the bolts 46 for fixing the conductive portion 43 on the insulating rail 41 can be disposed on both sides of the traveling path of the power-supplied portion 340. As a result, it is not necessary to provide the counterbore of the bolt in the conductive portion 34, and the factor of resistance can be eliminated.

Each of the processing units 3-1 to 3-n has a total of four rectifiers 50 (one rectifier 50 is shown in FIG. 5), one for each cell in which the work 2 is stopped. One positive terminal 51 of each of the four rectifiers 50 is connected to the anode 20 (20A1, 20A2, 20B1, 20B2) disposed in each cell. One negative terminal 52 of each of the four rectifiers 50 is connected to the conductive portion 43 corresponding to one cell of the divided cathode rails 40-1 to 40-n.

4. Current control at the time of stop of the work At four stop positions (cells) of each processing unit 3-1 to 3-n, the current flowing to the four works 2 is a rectifier 50 provided one for each cell Are independently controlled by each of the Moreover, since the cathodes are insulated between the cells and the anodes are also insulated, the work 2 can be individually controlled to be supplied with electric power by the respective rectifiers 50 by insulatingly separating each work 2. In addition, by separating the electric field between the cells by the shield plate 23, the individual power feeding for each work 2 is secured while eliminating the influence between the cells. Thereby, the plating quality of the work 2 can be improved.

When the intermittent transfer method of the present embodiment is compared with the conventional continuous transfer method, while the positional relationship between the work (cathode) transferred continuously and the fixed anode constantly changes, the stop of the present embodiment is stopped. The work (cathode) 2 can be made to face the anode 20 directly. As described above, while the work 2 is stopped, the positional relationship between the cathode and the anode becomes constant, and the work is subjected to the same plating condition, so it is expected that the plating quality is improved. In particular, when the work 2 is stopped, the fluctuation of the contact resistance is eliminated, and precise current control becomes possible. In addition, there is a counterbore or the like for a fixing bolt in the middle of a long cathode rail used for continuous transportation, and the resistance value of the cathode rail varies from place to place and does not become uniform resistance. Therefore, although the electric current which flows into a workpiece | work changes with positions during continuous conveyance of a workpiece | work, such a malfunction can be eliminated in intermittent conveyance. Furthermore, in the present embodiment, unlike the continuous transfer, the plating quality is not adversely affected by the continuous transfer speed of the work.

However, the work 2 may be intermittently transported without necessarily performing the completely individual power feeding as described above. That is, one or both of the cathode and the anode may be common (common cathode and / or common anode) in the four cells 11-1 to 11-4 of the processing units 3-1 to 3-n.

5. Movement scan of the nozzle tube In each of the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n, as shown in FIG. At least one nozzle tube 60 may be further provided between the front and back) and the anode 20. Since the nozzle tube 60 intercepts the electric field formed between the work (cathode) 2 and the anode 20, it is preferable that the number thereof is small even when a plurality of nozzle tubes 60 are provided. The nozzle pipe 60 has a plurality of jet outlets 60A for jetting the plating solution as shown in FIG. In the jet nozzle 60 shown in FIG. 9, the pitch P in the vertical direction is smaller than the pitch (for example, 7.5 mm) used in the conventional continuous transfer type, and is not less than the outer diameter of the

jet nozzle

60A and 5 mm or less Can. This is to increase the amount of plating solution supplied per unit time. In addition, in order to uniformly supply the plating solution to small size chips and dense patterns, the pitch P should be small. In FIG. 9, the nozzle pipes 60 on the front and back sides of the workpiece 2 are disposed opposite to each other with the workpiece 2 interposed therebetween. The opposing arrangement prevents the work 2 from being deformed by the fluid pressure, and the non-opposing arrangement makes it easier to supply the plating solution to the through holes of the work 2. Although the nozzle pipe is provided even in the continuous transfer method, the number thereof is as large as a dozen or so in one processing unit.

A large number of nozzle pipes are fixed in the continuous conveyance method of the work, but in the present embodiment adopting the intermittent conveyance method, in the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n. The horizontal scanning movement of at least one nozzle pipe 60 is performed, for example, in the arrow A1 direction and the A2 direction (both parallel to the intermittent conveyance direction A) in FIG. Thereby, as shown in FIG. 9, the plating solution can be ejected uniformly to the entire surface of the work 2. In addition, the moving speed of the nozzle tube 60 can be made faster than the moving speed (for example, 0.8 m / min) of the work 2 in the continuous transfer method. Thus, the amount of plating solution supplied per unit time can be increased. When the work speed is increased in the continuous transfer type, the entire length of the processing tank is increased and the size of the apparatus is increased. However, the size of the apparatus is not increased in the intermittent transfer as in this embodiment.

Although the reciprocating movement mechanism of the nozzle tube 60 is not shown, a known reciprocating linear movement mechanism (for example, a pinion-rack mechanism driven by a reversible motor, a piston-crank mechanism, etc.) can be adopted. This reciprocating movement mechanism can move the two nozzle pipes 60 so as to scan at least once by circulating at least once a length range corresponding to at least the horizontal width of the work 2 stopped at each cell. This improves the in-plane uniformity of the workpiece 2 to be processed. In particular, it is preferable that the initial position of the nozzle tube 60 be cyclically scanned at least once to return to the initial position. This is because the shadow of the nozzle tube 60 is substantially uniformed in the work surface. The nozzle tube 60 may continue the reciprocating scanning movement throughout the operation of the apparatus, or may stop the reciprocating scanning movement during the intermittent conveyance of the workpiece 2.

According to the present embodiment, at least one, for example, two nozzle pipes 60 can be scanned and moved with respect to the work 2 in correspondence with the stop position of the work 2 with respect to the work 2 intermittently stopped. As a result, an area in which the electric field between the anode and the cathode is blocked as a shadow of the nozzle pipe 60 located between the work 2 and the anode 20 in plan view moves with the movement of the nozzle pipe 60. Therefore, the area where the electric field is hindered by the nozzle tube 60 is not fixed, and the in-plane uniformity of the workpiece 2 to be processed is improved. The scanning movement direction of the nozzle tube 60 is not limited to the horizontal direction. For example, the nozzle tube 60 may be arranged horizontally and scanning movement may be performed in the vertical direction, and the scanning movement direction may be any direction such as horizontal or vertical.

The nozzle pipe 60 can entrain and eject the plating solution in the vicinity of the spout 60A in the divided processing tank by a known structure. Therefore, the plating solution rich in metal ions in the vicinity of the anode 20 can be jetted toward the work 2 to improve the throughput.

In addition, the scanning movement of the nozzle tube 60 can be widely applied to the surface treatment apparatus of the intermittent conveyance method, and the structure as in the embodiment described above, that is, the connection structure of a plurality of processing units, the cathode division structure, the anode division It is not limited to the structure etc. Further, since the present invention is not necessarily applied to the intermittent conveyance type surface treatment apparatus, at least one nozzle pipe is fixedly arranged in the continuous conveyance type surface treatment apparatus.

6. Treatment Liquid Circulation Device FIG. 9 schematically shows the treatment liquid circulation device 100 connected to each of the processing units 3-1 to 3-n shown in FIG. In FIG. 9, the treatment liquid circulation system 100 is connected to the divided treatment tank 6 of the treatment unit 3-1. However, a plurality of processing liquid circulation devices 100 may be connected to the division processing tank 6, and for example, even if one processing liquid circulation device 100 is connected to each of the four cells 11-1 to 11-4 shown in FIG. good. Alternatively, one processing liquid circulation device 100 may be connected to each of the plurality of divided processing tanks 6. However, the division regions to which the treatment liquid circulation apparatus 100 is connected are not limited to those physically divided as in the processing units 3-1 to 3-n and the cells 11-1 to 11-4.

In FIG. 9, the treatment liquid circulation system 100 is provided on both sides of the work 2 in each of the cells 11-1 to 11-4 of the division treatment tank 6 by adjusting the plating solution collected from the division treatment tank Each two sets of eight sets of nozzle tubes 60 are returned and supplied. The treatment liquid circulation system 100 has a control tank 110. The adjustment tank 110 is in communication with the bottom of the divided treatment tank 6 via, for example, a normally open valve 111. As shown in FIG. 9, when the

overflow tanks

7A and 7B are provided, for example, on both sides in the width direction of the divided processing tank 6, the adjustment tank 110 is also communicated with the bottoms of the

overflow tanks

7A and 7B.

The adjustment tank 110 can have a copper oxide input unit 112, an additive input unit 113, and a temperature control unit 114. Copper oxide and additives are added to supplement the components consumed by copper plating. Temperature adjustment is performed to adjust the temperature of the treatment solution to the optimum temperature specific to the surface treatment. On the downstream side of the adjustment tank 110, two

return paths

120A and 120B are connected. The return path 120 A is connected to a total of four sets of nozzle pipes 60 provided on the front side of the work 2 in the cells 11-1 to 11-4 of the divided processing tank 6. The return path 120 B is connected to a total of four sets of nozzle pipes 60 provided on the back side of the work 2 in each of the cells 11-1 to 11-4 of the divided processing tank 6. A circulation pump 121, a filter 122 and a flow meter 123 are provided in each of the two

return paths

120A and 120B.

According to the present embodiment, each of the plurality of processing solution circulation devices 100 adjusts the plating solution collected from each one of the divided processing tanks 6 obtained by dividing the processing tank in the longitudinal direction, A total of eight sets of nozzle pipes 60 provided in each one can be returned and supplied as a resupply processing liquid. Therefore, the concentration of the fresh plating solution after adjustment is substantially equal among the plurality of divided processing tanks 6. Moreover, in each divided processing tank 6, fresh plating solution is spouted toward the work 2 from a total of eight sets of nozzle pipes 60 which are moved and scanned. Therefore, the fresh plating solution is dispersed in each divided processing tank 6, and the concentration of the plating solution becomes almost even in each divided processing tank 6. Further, if the processing liquid for resupply is supplied from the upper side of the nozzle pipe 60, air can be removed.

The adjustment tank 110 can perform at least one of the consumption of the consumed components such as an oxidation cylinder and / or an additive, and temperature control on the recovered plating solution. With any of these adjustments, the recovered plating is adjusted to a fresh resupplying treatment solution.

Impurities with heavy specific gravity (metal-based, eg, copper oxide copper powder) contained in the plating solution collected from the bottom of the divided processing tank 6 having the inclined surface 6C, and contained in the plating solution collected from the

overflow tanks

7A and 7B Impurities with a low specific gravity (for example, resin system) can be removed by the filter 122. Thereby, the contamination of the re-supplied plating solution is prevented, and clogging of the nozzle tube 60 can also be prevented. In particular, when the line and space of the wiring formed on the work 2 are reduced, even a small amount of dust causes a short failure. Such dust is removed by the filter 122 and can be removed from the resupplied plating solution. In addition, the refuse with heavy specific gravity is prevented from being left in the treatment tank while convecting by being collected from the bottom of the treatment tank through the normally open nozzle 111.

It should be understood by those skilled in the art that although the present embodiment has been described in detail as described above, many modifications can be made without departing substantially from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included within the scope of the present invention. For example, in the specification or the drawings, the terms described together with the broader or synonymous different terms at least once can be replaced with the different terms anywhere in the specification or the drawings. Further, all combinations of the present embodiment and the modifications are also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Surface treatment apparatus, 2 workpiece | work, 3-1 to 3-n processing unit, 6 division | segmentation processing tank, 7A, 7B overflow tank, 20 (20A1, 20A2, 20B1, 20B2) anode, 30 conveyance jigs, 40, 40- 1, 40-2 Cathode Rail (Division Cathode Rail), 41 Insulating Rails, 42 Spacing (Non-Conductive Part), 43 Conductor, 50 Rectifiers, 51 Positive Terminal, 52 Negative Terminal, 60 Nozzle Tube, 60 A Spout, 100 Treatment Liquid circulation device, 110 adjustment tank, 112 oxidation cylinder input part, 113 additive input part, 114 temperature adjustment part, 120A, 120B first and second return paths, 121 circulation pump, 122 filter

Claims

A treatment tank in which a plurality of nozzle tubes are disposed to eject the treatment liquid to a plurality of workpieces immersed in the treatment liquid;
Multiple treatment liquid circulation devices,
Have
Each of the plurality of processing liquid circulation devices is divided into a plurality of portions in the longitudinal direction of the processing tank, and each is connected to each one of a plurality of divided regions including at least one of the plurality of nozzle tubes, A surface treatment apparatus characterized in that a treatment liquid collected from each one of the divided regions is adjusted and returned to the at least one nozzle pipe provided in each one of the plurality of divided regions. .
In claim 1,
Each of the plurality of processing liquid circulation devices is
A circulation pump,
An adjusting tank configured to adjust the processing liquid recovered by the circulating pump from one of the plurality of divided regions into a processing liquid for resupply;
Including
A surface treatment apparatus characterized in that the treatment liquid for resupply from the adjustment tank is supplied back to the at least one nozzle pipe by the circulation pump.
In claim 2,
A surface treatment apparatus characterized in that the adjustment tank implements at least one of charging of a component to be consumed and temperature adjustment to the recovered treatment liquid.
In claim 2 or 3,
The treatment liquid in the treatment tank is discharged from the bottom side of the treatment tank and collected.
A surface treatment apparatus characterized in that each of the plurality of treatment liquid circulation devices further includes a filter for filtering the treatment liquid for resupply from the adjustment tank.
In claim 4,
Further comprising an overflow tank adjacent to the processing tank,
A surface treatment apparatus characterized in that the treatment liquid in the treatment tank is discharged and recovered through the overflow tank.
In any one of claims 1 to 5,
The surface treatment apparatus is formed by connecting a plurality of treatment units in the longitudinal direction,
Each of the plurality of processing units includes a divided processing tank in which the processing liquid is stored,
A surface treatment apparatus characterized in that each of the plurality of treatment liquid circulation devices is connected to the divided treatment tank of each of the plurality of treatment units.