CN116145215A - Electroplating Chi Fei target assembly and electroplating device - Google Patents

Electroplating Chi Fei target assembly and electroplating device Download PDF

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Publication number
CN116145215A
CN116145215A CN202310167494.1A CN202310167494A CN116145215A CN 116145215 A CN116145215 A CN 116145215A CN 202310167494 A CN202310167494 A CN 202310167494A CN 116145215 A CN116145215 A CN 116145215A
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CN
China
Prior art keywords
support
target assembly
electroplating
fei
chi
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Pending
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CN202310167494.1A
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Chinese (zh)
Inventor
韩友生
方荣平
赵改兵
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Kunshan Dongwei Technology Co Ltd
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Kunshan Dongwei Technology Co Ltd
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Application filed by Kunshan Dongwei Technology Co Ltd filed Critical Kunshan Dongwei Technology Co Ltd
Priority to CN202310167494.1A priority Critical patent/CN116145215A/en
Publication of CN116145215A publication Critical patent/CN116145215A/en
Priority to CN202310739721.3A priority patent/CN116536737A/en
Priority to CN202310739750.XA priority patent/CN116555875A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Control Of Conveyors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

The invention relates to the technical field of semiconductor electroplating, in particular to an electroplating pool flying target assembly and an electroplating device. The electroplating pool flying target assembly mainly comprises a bracket, a first connecting plate, a second connecting plate and a fixed shaft. The lower end face of the bracket is provided with a roller, and the roller is configured to slide on a slide rail at the top of the electroplating bath. The first connecting plate and the second connecting plate are arranged on the bracket. One end of the fixed shaft is connected with the first connecting plate, and the other end of the fixed shaft is connected with the second connecting plate; a plurality of mounting positions are arranged on the fixed shaft at equal intervals, and the mounting positions are used for mounting the electroplating clamp. The electroplating pool flying target assembly has high stability and reliability, can improve the production efficiency, improves the productivity of an electroplating device and saves the cost.

Description

Electroplating Chi Fei target assembly and electroplating device
Technical Field
The invention relates to the technical field of semiconductor electroplating, in particular to an electroplating pool flying target assembly and an electroplating device.
Background
At present, electroplating is generally performed by adopting an electroplating tank in the semiconductor electroplating process, a flying target assembly is erected on the electroplating tank, and the flying target assembly carries a product to move in electrolyte in the electroplating tank, so that the electroplating process is completed.
The electroplated Chi Fei target assembly in the prior art has the defects of limited quantity of products carried by the target assembly, low productivity and low operation efficiency. If the throughput is increased by simply increasing the number of target assemblies to be electroplated Chi Fei, the investment cost of the apparatus will be increased. If the productivity is increased only by increasing the size and volume of the electroplated Chi Fei target assembly, the center position of the electroplated Chi Fei target assembly is collapsed, the stability and reliability of the electroplated Chi Fei target assembly are reduced, and even the electroplating quality of the product is affected.
Therefore, there is a need to design a plating cell target assembly and a plating apparatus to solve the above technical problems.
Disclosure of Invention
The first object of the invention is to provide a plating cell flying target assembly which has high stability and reliability, can improve the production efficiency and saves the cost.
To achieve the purpose, the invention adopts the following technical scheme:
the invention provides an electroplating pool flying target assembly, which comprises:
the lower end face of the bracket is provided with a roller which is configured to slide on a sliding rail at the top of the electroplating bath;
the first connecting plate and the second connecting plate are arranged on the bracket;
the fixed shaft is connected with the first connecting plate at one end, and is connected with the second connecting plate at the other end; a plurality of mounting positions are arranged on the fixed shaft at equal intervals and are used for mounting the electroplating clamp.
As an alternative technical scheme of the electroplating pool flying target assembly, the bracket comprises a first supporting piece, a second supporting piece and a third supporting piece, wherein the first supporting piece is connected with the third supporting piece, the second supporting piece is connected with the third supporting piece, and the third supporting piece and the fixed shaft are arranged in parallel;
one end of the first supporting piece, which is close to the third supporting piece, is inclined towards the fixed shaft, and one end of the second supporting piece, which is close to the third supporting piece, is inclined towards the fixed shaft.
As an alternative to the plating cell target assembly, the plating Chi Fei target assembly further includes a first stiffener plate mounted to the third support member.
As an alternative technical scheme of the electroplating pool flying target assembly, a first through hole is formed in the first reinforcing plate, and the fixed shaft penetrates through the first through hole.
As an alternative technical scheme of the electroplating pool flying target assembly, a first avoidance position is formed on the first reinforcing plate, and part of the third supporting piece is accommodated in the first avoidance position.
As an alternative to the plating cell target assembly, the plating Chi Fei target assembly further includes a plurality of second stiffening plates mounted on the first support and/or mounted on the second support.
As an alternative technical scheme of the electroplating pool flying target assembly, a second through hole is formed in the second reinforcing plate, and the fixed shaft penetrates through the second through hole.
As an alternative technical scheme of the electroplating pool flying target assembly, a second avoidance position is formed on the second reinforcing plate, part of the first supporting piece is accommodated in the second avoidance position, and/or part of the second supporting piece is accommodated in the second avoidance position.
As an alternative technical scheme of the electroplating pool flying target assembly, the second reinforcing plate is provided with a conducting plate, and the conducting plate is electrically connected with an external power supply.
A second object of the present invention is to provide an electroplating apparatus which has high stability and reliability, and can improve productivity and working efficiency thereof, thereby achieving the purpose of saving cost.
To achieve the purpose, the invention adopts the following technical scheme:
the invention provides an electroplating device, which comprises an electroplating bath and the electroplating Chi Fei target assembly, wherein the electroplating Chi Fei target assembly is arranged on the top of the electroplating bath in a sliding manner.
The beneficial effects of the invention at least comprise:
the invention provides an electroplating pool flying target assembly which mainly comprises a bracket, a first connecting plate, a second connecting plate and a fixed shaft. The lower end face of the bracket is provided with a roller, and the roller is configured to slide on a slide rail at the top of the electroplating bath. The first connecting plate and the second connecting plate are arranged on the bracket. One end of the fixed shaft is connected with the first connecting plate, and the other end of the fixed shaft is connected with the second connecting plate; a plurality of mounting positions are arranged on the fixed shaft at equal intervals, and the mounting positions are used for mounting the electroplating clamp. The stability and the reliability of the electroplating pool flying target assembly can be improved through the arrangement of the support, the first connecting plate and the second connecting plate, and the phenomenon that the fixed shaft shakes in the moving process is avoided. Meanwhile, the mounting positions of the electroplating clamps are arranged on each fixed shaft at equal intervals, so that the number of the electroplating clamps hung on the flying target assembly of the electroplating pool can be increased, the actual machining efficiency and the productivity of the electroplating device are improved, and the cost is saved.
The invention also provides an electroplating device which has high stability and reliability, can improve the productivity and the working efficiency, and achieves the aim of saving the cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings needed in the description of the embodiments of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the contents of the embodiments of the present invention and these drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic diagram of an electroplated Chi Fei target assembly provided in an embodiment of the invention;
fig. 2 is a front view of an electroplated Chi Fei target assembly provided by an embodiment of the invention.
Reference numerals
100. A bracket; 110. a roller; 120. a first support; 130. a second support; 140. a third support; 200. a first connection plate; 300. a second connecting plate; 400. a fixed shaft; 500. an electroplating clamp; 510. a product; 600. a first reinforcing plate; 610. a first avoidance bit; 700. a second reinforcing plate; 710. a second avoidance bit; 720. and a conductive sheet.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
As shown in fig. 1-2, the electroplating Chi Fei target assembly provided by the embodiment has a simple structure and high stability and reliability, can improve the production efficiency, improve the productivity of an electroplating device and save the cost.
Specifically, the plating Chi Fei target assembly in the present embodiment mainly includes a holder 100, a first connecting plate 200, a second connecting plate 300, and a fixed shaft 400. Wherein the lower end surface of the bracket 100 is provided with a roller 110, and the roller 110 is configured to slide on a slide rail on top of a plating tank (not shown in the drawing). The first and second connection plates 200 and 300 are disposed on the bracket 100. One end of the fixing shaft 400 is connected with the first connection plate 200, and the other end of the fixing shaft 400 is connected with the second connection plate 300; the fixing shaft 400 is provided with a plurality of mounting positions at equal intervals for mounting the plating jig 500. The plating jig 500 holds a product 510 thereon, and the product 510 may be, for example, a silicon wafer, a PCB circuit board, a ceramic semiconductor, or the like.
Based on the above design, the stent 100 in the present embodiment is made of stainless steel material. The support 100 is connected with an external driving device, and the driving device drives the support 100 to enable the roller 110 on the support 100 to slide on the slide rail at the top of the electroplating bath, so that the movement of the electroplating bath flying target assembly is realized, and the movement of the electroplating Chi Fei target assembly from the feeding end to the discharging end is realized. Alternatively, one end of the fixing shaft 400 in the present embodiment is detachably connected to the first connection plate 200 through a bolt, and the other end of the fixing shaft 400 is detachably connected to the second connection plate 300 through a bolt, thereby facilitating the later replacement and maintenance. The arrangement of the bracket 100, the first connecting plate 200 and the second connecting plate 300 can improve the stability and reliability of the plating cell flying target assembly, and avoid the phenomenon that the fixing shaft 400 shakes in the moving process.
Alternatively, the driving means may be provided as a cylinder, an electric cylinder, a motor, or the like, thereby achieving driving of the bracket 100 by the driving means.
The number of the fixing shafts 400 in the present embodiment may be plural, for example, 3, 4, 5, etc., and the plurality of fixing shafts 400 may be disposed at equal intervals. And a plurality of mounting positions are provided on each fixing shaft 400, for example, 5, 6, 7, 8, etc. mounting positions may be provided, and two adjacent mounting positions are provided at equal intervals. Therefore, the electroplating pool flying target assembly is provided with the plurality of electroplating clamps 500 at equal intervals, so that the electroplating efficiency and the productivity are improved, and meanwhile, the electroplating uniformity of the product 510 can be improved and the electroplating quality is improved due to equal intervals among the plurality of mounting positions. The number and length of the fixing shafts 400 in the present embodiment are not limited, and the operator can flexibly increase or decrease the number and size of the fixing shafts 400 according to the size of the electrolytic cell to match the productivity of the actual electroplating apparatus.
Compared with the prior art, in the present embodiment, the stability and reliability of the plating pool target assembly can be improved through the arrangement of the bracket 100, the first connecting plate 200 and the second connecting plate 300, and the phenomenon that the fixing shaft 400 shakes in the moving process is avoided. Meanwhile, the mounting positions of the hanging electroplating clamps 500 are arranged on each fixed shaft 400 at equal intervals, so that the number of the hanging electroplating clamps 500 of the flying target assembly of the electroplating pool can be increased, the actual machining efficiency and the productivity of the electroplating device are improved, and the cost is saved.
As shown in fig. 1-2, in the present embodiment, the bracket 100 includes a first support 120, a second support 130, and a third support 140, the first support 120 is connected to the third support 140, the second support 130 is connected to the third support 140, and the third support 140 and the fixed shaft 400 are disposed in parallel. One end of the first support 120 near the third support 140 is inclined toward the fixed shaft 400, and one end of the second support 130 near the third support 140 is inclined toward the fixed shaft 400. By arranging the first supporting member 120, the second supporting member 130 and the third supporting member 140, the bracket 100 can be in an arch bridge structure, so that the strength of the bracket 100 is improved, and the flexibility and stability of the bracket are improved. The middle stress of the fixing shaft 400 (i.e., the stress of the third supporting member 140) can be transmitted to the first supporting member 120 and the second supporting member 130 at both ends as much as possible, so that the overall stability is improved and the service life of the bracket 100 is prolonged.
As shown in fig. 1-2, to improve stability and reliability of the carrier 100, the electroplated Chi Fei target assembly further comprises a first reinforcing plate 600, the first reinforcing plate 600 being mounted on the third support 140.
Further, the first reinforcing plate 600 is provided with a first through hole, and the fixing shaft 400 is disposed through the first through hole. For example, the first through holes may be provided in 3, the fixing shafts 400 in 3, and each fixing shaft 400 passes through one through hole.
Further, the first reinforcement plate 600 is provided with a first avoidance hole 610, and a portion of the third support member 140 is accommodated in the first avoidance hole 610. For example, the first avoidance bit 610 is set to two, and the two avoidance bits are respectively located at two sides of the first through hole. Illustratively, the two crossbars of the third support 140 are respectively received in the two first relief recesses 610 of one first reinforcing plate 600.
Alternatively, the first reinforcing plate 600 in the present embodiment is made of PE (polyethylene) material, and strength is improved while insulation is ensured. Of course, the operator may also select other materials with high strength and good insulation performance to make the first reinforcing plate 600 according to actual requirements, which will not be described herein again.
With continued reference to fig. 1-2, in this embodiment, the electroplated Chi Fei target assembly further comprises a plurality of second stiffening plates 700, the second stiffening plates 700 being mounted on the first support 120 and/or the second stiffening plates 700 being mounted on the second support 130. Illustratively, the second reinforcing plates 700 in the present embodiment are provided in 4, wherein 2 second reinforcing plates 700 are erected on the first support 120, and 2 second reinforcing plates 700 are erected on the second support 130. The arrangement of the second reinforcing plate 700 can further improve the stability and reliability of the electroplating pool target assembly, and avoid the phenomenon of shaking instability of the electroplating Chi Fei target assembly in the operation process.
Further, the second reinforcing plate 700 is provided with second through holes, the fixing shafts 400 are arranged through the second through holes, and the number of the second through holes corresponds to the number of the fixing shafts 400.
Further, the second reinforcement plate 700 is provided with a second avoidance position 710, and a part of the first supporting member 120 is accommodated in the second avoidance position 710, and/or a part of the second supporting member 130 is accommodated in the second avoidance position 710. For example, the second avoidance bits 710 are two, and the two avoidance bits are respectively located at two sides of the second through hole. Illustratively, the second reinforcing plate 700 is provided in plurality, and the two cross bars of the first support 120 are respectively accommodated in the two second avoidance holes 710 of the same second reinforcing plate 700. The two crossbars of the second supporting member 130 are respectively received in the two second avoidance holes 710 of the same second reinforcing plate 700.
Alternatively, the second reinforcing plate 700 in the present embodiment is made of PE (polyethylene) material, and strength is improved while insulation is ensured. Of course, the operator can also select other materials with high strength and good insulation performance to make the second reinforcing plate 700 according to actual requirements, which will not be described herein.
As shown in fig. 2, the second reinforcing plate 700 in this embodiment is provided with a conductive sheet 720, and the conductive sheet 720 is electrically connected to an external power source (not shown). Preferably, both sides of the second reinforcing plate 700 are provided with the conductive sheet 720, and an external power source can supply current to the product 510 on the plating jig 500 at both sides of the conductive sheet 720 through the conductive sheet 720, thereby implementing a plating process.
In addition, the first connection plate 200 and the second connection plate 300 in the present embodiment are made of PE (polyethylene) material, and strength is improved while insulation is ensured. Of course, the operator can also select other materials with high strength and good insulation performance to make the first connecting plate 200 and the second connecting plate 300 according to actual requirements, which will not be repeated here. Meanwhile, the outer circumferential side of the fixing shaft 400 is coated with an insulating layer, so that metal ions in the electrolyte are prevented from being electroplated on the fixing shaft 400, thereby affecting an electroplating process.
The embodiment also provides an electroplating device, which comprises an electroplating tank and the electroplating Chi Fei target assembly, wherein the electroplating Chi Fei target assembly is slidably arranged on the top of the electroplating tank. The electroplating device has high stability and reliability, can improve the productivity and the working efficiency, and achieves the aim of saving the cost.
It is to be understood that the foregoing is only illustrative of the presently preferred embodiments of the invention and the technical principles that have been developed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Note that in the description of this specification, a description of reference to the terms "some embodiments," "other embodiments," and the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims (10)

1. A electroplated Chi Fei target assembly, comprising:
the electroplating device comprises a bracket (100), wherein a roller (110) is arranged on the lower end surface of the bracket (100), and the roller (110) is configured to slide on a sliding rail at the top of the electroplating bath;
a first connection plate (200) and a second connection plate (300), the first connection plate (200) and the second connection plate (300) being arranged on the bracket (100);
a fixed shaft (400), wherein one end of the fixed shaft (400) is connected with the first connecting plate (200), and the other end of the fixed shaft (400) is connected with the second connecting plate (300); a plurality of mounting positions are arranged on the fixed shaft (400) at equal intervals, and the mounting positions are used for mounting the electroplating clamp (500).
2. The electroplated Chi Fei target assembly of claim 1, wherein the bracket (100) comprises a first support (120), a second support (130) and a third support (140), the first support (120) is connected to the third support (140), the second support (130) is connected to the third support (140), and the third support (140) and the stationary shaft (400) are disposed in parallel;
one end of the first support (120) close to the third support (140) is inclined toward the fixed shaft (400), and one end of the second support (130) close to the third support (140) is inclined toward the fixed shaft (400).
3. The electroplated Chi Fei target assembly of claim 2, further comprising a first stiffener plate (600), the first stiffener plate (600) being mounted on the third support (140).
4. A plated Chi Fei target assembly according to claim 3, wherein the first reinforcing plate (600) has a first through hole formed therein, and the fixing shaft (400) is provided through the first through hole.
5. A plated Chi Fei target assembly according to claim 3, wherein the first stiffener (600) has a first relief (610) formed therein, and a portion of the third support (140) is received within the first relief (610).
6. The electroplated Chi Fei target assembly of claim 3, further comprising a plurality of second stiffening plates (700), the second stiffening plates (700) being mounted on the first support (120) and/or the second stiffening plates (700) being mounted on the second support (130).
7. The electroplated Chi Fei target assembly of claim 6, wherein the second stiffener plate (700) has a second through hole formed therein, the stationary shaft (400) passing through the second through hole.
8. The electroplated Chi Fei target assembly of claim 6, wherein the second stiffener (700) has a second relief (710) formed thereon, a portion of the first support (120) being received within the second relief (710), and/or a portion of the second support (130) being received within the second relief (710).
9. The electroplated Chi Fei target assembly of claim 6, wherein the second stiffener (700) has a conductive sheet (720) disposed thereon, the conductive sheet (720) being electrically connected to an external power source.
10. A plating apparatus comprising a plating cell and a plating Chi Fei target assembly according to any of claims 1-9, the plating Chi Fei target assembly being slidingly disposed on top of the plating cell.
CN202310167494.1A 2023-02-27 2023-02-27 Electroplating Chi Fei target assembly and electroplating device Pending CN116145215A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202310167494.1A CN116145215A (en) 2023-02-27 2023-02-27 Electroplating Chi Fei target assembly and electroplating device
CN202310739721.3A CN116536737A (en) 2023-02-27 2023-06-21 Flying target conveying device and electroplating equipment
CN202310739750.XA CN116555875A (en) 2023-02-27 2023-06-21 Synchronous conveying system for multiple steel belts and flying targets and electroplating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310167494.1A CN116145215A (en) 2023-02-27 2023-02-27 Electroplating Chi Fei target assembly and electroplating device

Publications (1)

Publication Number Publication Date
CN116145215A true CN116145215A (en) 2023-05-23

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN202310167494.1A Pending CN116145215A (en) 2023-02-27 2023-02-27 Electroplating Chi Fei target assembly and electroplating device
CN202310739750.XA Pending CN116555875A (en) 2023-02-27 2023-06-21 Synchronous conveying system for multiple steel belts and flying targets and electroplating equipment
CN202310739721.3A Pending CN116536737A (en) 2023-02-27 2023-06-21 Flying target conveying device and electroplating equipment

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202310739750.XA Pending CN116555875A (en) 2023-02-27 2023-06-21 Synchronous conveying system for multiple steel belts and flying targets and electroplating equipment
CN202310739721.3A Pending CN116536737A (en) 2023-02-27 2023-06-21 Flying target conveying device and electroplating equipment

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CN (3) CN116145215A (en)

Also Published As

Publication number Publication date
CN116536737A (en) 2023-08-04
CN116555875A (en) 2023-08-08

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Application publication date: 20230523