CN110753763A

CN110753763A - Electrolytic processing assembly and surface processing device using same

Info

Publication number: CN110753763A
Application number: CN201880039005.1A
Authority: CN
Inventors: 石井胜己; 渡边重幸
Original assignee: Almex PE Inc
Current assignee: Almex PE Inc
Priority date: 2017-09-20
Filing date: 2018-09-12
Publication date: 2020-02-04
Also published as: WO2019059058A1; TWI706060B; TW201925540A; JP6779547B2; KR20200054134A; PH12019502478A1; JPWO2019059058A1; MY194250A

Abstract

An electrolytic processing module (100) mounted in a surface processing tank (10) for performing electrolytic processing on the surface of a workpiece (1) set as a cathode comprises a nozzle unit (200) and an anode unit (300) integrally connected with the nozzle unit. The nozzle unit includes a plurality of nozzle pipes (210), a common pipe (220), and a pipe joint (230) that connects the common pipe to an external pipe. The anode unit comprises an anode case (320) and a power supply receiving part (330) for connecting the insoluble anode to an external power supply part (40) provided in the surface treatment tank. The anode tank includes at least one insoluble anode (310) disposed at a position horizontally spaced apart from the plurality of nozzle pipes, and a partition wall horizontally spaced apart from the insoluble anode.

Description

Electrolytic processing assembly and surface processing device using same

Technical Field

The present invention relates to an electrolytic processing module disposed in a surface treatment tank such as an electrolytic plating apparatus, and a surface treatment apparatus using the same.

Background

In a surface treatment apparatus such as an electrolytic plating apparatus, as shown in patent document 1, for example, a mesh tank and a nozzle pipe are provided on both sides of a conveyance path of a workpiece in a plating tank. An anode ball (soluble anode) as a consumable article is housed in a conductive mesh case. The nozzle pipe is disposed between the workpiece and the mesh box. A plurality of discharge ports (nozzles) are arranged in the nozzle tube row, and the plating solution can be discharged to the surface to be processed of the workpiece.

In patent document 2, an insoluble anode plate having a plurality of through holes formed therein is integrated with a nozzle tube fixed to the back surface side of the insoluble anode plate. The nozzle pipe is fixed to the insoluble anode plate at a position corresponding to the through hole, and the treatment liquid is ejected to the workpiece through the nozzle pipe and the through hole.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2012 and 046782

Patent document 2: japanese laid-open patent publication No. 2002-226993

Disclosure of Invention

Problems to be solved by the invention

In the soluble electrode of patent document 1, the electrode material is dissolved to become a plating component. The soluble electrode is a consumable and needs to be replaced. In addition, the soluble electrode is not formed of only the plating component, and has a disadvantage of containing impurities (for example, phosphorus P). On the other hand, in the insoluble electrode of patent document 2, the electrode material does not dissolve, and positive metal ions (for example, copper oxide) in the plating solution in the plating tank become plating components, and the insoluble electrodeThe electrode is used only as an electrode, and is superior to a soluble electrode in this respect. In particular, for example, in the implementation of ten A/dm²About ten odd A/dm²At a high current density, the soluble electrode is consumed more, and therefore, it is desirable to use an insoluble electrode.

In addition, in patent document 2, since the anode and the nozzle pipe are integrally connected, the anode and the nozzle pipe can be integrally taken out from the plating tank at the time of maintenance or the like, and workability is improved.

However, in patent document 2, the insoluble anode plate has many through holes, which is essential, and therefore the resistance of the anode plate increases. Similarly, an increase in electrical resistance cannot be avoided even with the conductive mesh box of patent document 1. The insoluble anode plate of patent document 2 is exposed in the plating tank. In order to avoid a reduction in plating quality due to the adhesion of negative ions in the plating tank to the insoluble anode plate, the entire surface of the insoluble anode plate must be covered with an ion exchange membrane. If the periphery of the insoluble anode plate is surrounded by partition walls to prevent the invasion of negative ions, the jet flow from the nozzle pipe to the workpiece is also blocked by the diaphragm.

An object of some aspects of the present invention is to provide an electrolytic processing module and a surface treatment apparatus using the same, which can prevent negative ions in a processing tank from entering an insoluble anode side without increasing the resistance of an anode, and can improve the workability of maintenance by integrating the insoluble anode and a nozzle pipe.

Means for solving the problems

(1) One embodiment of the present invention relates to an electrolytic processing module to be mounted in a surface treatment tank for electrolytically processing a surface of a workpiece set as a cathode,

the electrolytic processing assembly has a nozzle unit; and

an anode unit integrally connected to the nozzle unit,

the nozzle unit includes:

a plurality of nozzle pipes for ejecting the processing liquid from different positions in the vertical direction;

a common pipe for supplying the processing liquid to the plurality of nozzle pipes; and

a pipe joint for connecting the common pipe to an external pipe provided in the surface treatment tank,

the anode unit includes:

at least one insoluble anode disposed at a position horizontally spaced apart from the plurality of nozzle pipes;

an anode tank including a partition wall disposed apart from the at least one insoluble anode in the horizontal direction, the at least one insoluble anode being surrounded by the partition wall; and

and a power supply receiving portion for connecting the at least one insoluble anode to an external power supply portion provided in the surface treatment tank.

According to the electrolytic processing module of one aspect of the present invention, the pipe joint of the nozzle unit is attached to and detached from the external pipe, and the supplied portion of the anode unit is attached to and detached from the external power supply portion, whereby the nozzle unit and the anode unit can be integrally attached to and detached from the surface treatment tank. This improves workability of installation and maintenance of the components. Moreover, the insoluble anode does not require a mesh portion and a large number of through holes, and therefore, the resistance does not increase. The periphery of the insoluble anode is partitioned by the partition walls and the surface treatment tank, and the partition walls are normally permeable to metal ions (positive ions) in the treatment liquid, while the negative ions generated in the surface treatment tank can be prevented from entering the insoluble anode plate side. Since the plurality of nozzle pipes are located outside the partition wall, the operation of ejecting the processing liquid from the plurality of nozzle pipes is not hindered by the partition wall.

(2) In one aspect (1) of the present invention, the supplied power portion may include a connection terminal portion electrically connected to the external power supply portion disposed at an edge portion of the upper opening portion of the surface treatment tank, and the common pipe may be formed to communicate with upper end portions of the plurality of nozzle pipes and to extend horizontally above the plurality of nozzle pipes. In this way, the connection between the pipe joint of the module and the external pipe of the surface treatment tank and the connection between the supplied portion of the module and the external power supply portion of the surface treatment tank can be performed on the upper side of the surface treatment tank. This improves workability of attaching and detaching the module to and from the surface treatment tank.

(3) In the aspect (2) of the present invention, the common pipe may be disposed at a position higher than an upper end portion of the anode unit, and the pipe joint may pass above the anode unit and be connected to the external pipe disposed at the edge portion of the upper opening portion of the surface treatment tank. Thus, when the module is inserted into the surface treatment tank from just above the upper opening of the surface treatment tank, there is no member that interferes with the module. The module inserted into the surface treatment tank is connected to an external power supply part and an external pipe provided at the edge of the upper opening of the surface treatment tank, so that the workability of installing the module in the surface treatment tank can be improved. This further improves the workability of attaching and detaching the module to and from the surface treatment tank.

(4) In one aspect (1) to (3) of the present invention, lower end portions of the plurality of nozzle pipes may be fixed to a lower end portion of the anode tank. Thus, the upper and lower end portions of the plurality of nozzle pipes are stably supported.

(5) In one aspect (1) to (4) of the present invention, at least a front side partition wall of the partition wall facing the plurality of nozzle pipes may be formed of a material that selectively transmits metal ions in the processing liquid. Thus, the metal ions generated in the partition walls can be supplied to the workpiece side through the front-side partition walls, and electrolytic treatment of the workpiece surface can be promoted.

(6) In one aspect (5) of the present invention, a back-side partition wall of the partition walls, which is opposed to the front-side partition wall, may have an opening through which the processing liquid flows. In this way, the processing liquid can be supplied from above or below the partition wall, discharged from the opening of the rear-side partition wall, and circulated within the partition wall.

(7) In the aspect (6) of the present invention, the at least one insoluble anode may include a plurality of insoluble anodes disposed with a gap between two insoluble anodes adjacent in the horizontal direction, and the backside partition wall may have the opening at a position facing the gap between the two insoluble anodes. In this way, the treatment liquid between the insoluble anode and the front-side partition walls can be guided to the opening through the gap, and the circulation of the treatment liquid in the partition walls can be promoted.

(8) In one aspect (1) to (7) of the present invention, the anode box may hold a shadow mask that shields a part of an electric field formed between the at least one insoluble anode and the workpiece. The use of the shadow mask prevents the electric field from being formed in an unnecessary region, and improves the electrolytic processing quality of the workpiece.

(9) In one embodiment (8) of the present invention, the shadow mask may include a1 st shadow mask that shields a lower region of the electrolysis and a 2 nd shadow mask that shields an upper region of the electrolysis. This can prevent the electric field from concentrating on the upper and lower edges of the workpiece.

(10) In one aspect (9) of the present invention, the anode box may include an adjustment mechanism for adjusting a mounting position of each of the 1 st and 2 nd shadow masks in a vertical direction. Thus, the mounting positions of the 1 st and 2 nd shadow masks in the vertical direction can be adjusted so that the height of the aperture window of the electric field matches the dimension of the workpiece in the vertical direction.

(11) Another aspect of the present invention relates to a surface treatment apparatus including:

a surface treatment tank for performing electrolytic treatment on the surface of the workpiece; and

the electrolytic processing module according to any one of (1) to (10) above disposed in the surface treatment tank.

According to another aspect of the present invention, there is provided a surface treatment apparatus capable of exhibiting the operations and effects described in the above (1) to (10).

Drawings

FIG. 1 is a sectional view of a continuous plating apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the electrolytic processing component in the plating tank of FIG. 1, as viewed from the workpiece side.

FIG. 3 is a top view of a portion of the continuous plating apparatus of FIG. 1.

FIG. 4 is a view showing 2 modules arranged along the longitudinal direction of the plating tank of FIG. 1.

Fig. 5 is a diagram showing a shadow mask held to a component.

Fig. 6 is a diagram showing a1 st shadow mask and a 2 nd shadow mask.

Fig. 7 is a sectional view of an adjustment mechanism for adjusting the mounting positions of the 1 st and 2 nd shadow masks in the vertical direction.

Detailed Description

The preferred embodiments of the present invention will be described in detail below. The embodiments described below are not intended to unduly limit the contents of the present invention described in the claims, and not all of the configurations described in the embodiments are necessarily essential as means for solving the present invention.

1. Outline of continuous plating apparatus

Fig. 1 is a sectional view of a surface treatment apparatus of the present embodiment, for example, a continuous plating apparatus, and fig. 2 is a plan view. In fig. 1, a plating tank 10 is a tank for storing a workpiece 1 suspended and supported by a conveyance jig 20 in a plating solution 2 and plating the workpiece 1. The plating tank 10 has a peripheral wall and a bottom wall, and contains a plating solution 2 as a processing solution.

The workpiece 1 is a circuit board, a flexible circuit board, or the like, and both surfaces thereof are, for example, processed surfaces. The conveying jig 20 can continuously convey the workpiece and energize the workpiece 1. The workpiece 1 functions as a cathode. In practice, a power supply portion (which may be a transfer rail) in sliding contact with the transfer jig 20 is connected to a negative terminal of the power supply, and the workpiece 1 is set as a cathode by the power supply portion and the transfer jig 20.

The work 1 suspended and supported by the conveyance jig 20 is continuously conveyed in a direction perpendicular to the paper surface of fig. 1, i.e., a conveyance direction a shown in fig. 2. The means for continuously conveying the work 1 is not shown, and may be constituted by a chain continuously driven by a sprocket, an air cylinder, or the like. One workpiece 1 is held by the conveying jig 20, and a plurality of workpieces 1 are continuously conveyed in the plating tank 10 as shown in fig. 2. In the conveying jig 20, if the workpiece 1 is a rigid body such as a circuit board, the workpiece 1 can be held in a suspended state by holding the upper end of the workpiece 1 by the chuck 21A. When the workpiece 1 is flexible like a flexible circuit board or the like, the conveying jig 20 may have a frame portion 22, and hold and pull the lower end of the workpiece 1 downward by a chuck 21B.

2. Electrolytic processing assembly

As shown in FIG. 1, an electrolytic processing module 100 is provided in the plating tank 10. The assembly 100 includes a nozzle unit 200 and an anode unit 300 integrally connected to the nozzle unit 200.

Here, fig. 2 and 3 show the module 100 disposed on the most upstream side of the plating tank 10, but a plurality of modules 100 may be disposed along the longitudinal direction of the plating tank 10 as shown in fig. 4. In the case of processing both surfaces of the workpiece 1, 2 modules 100 are disposed on both sides of the workpiece 1, and a total of 4 modules 100 are disposed in fig. 4.

As shown in fig. 1 to 4, the nozzle unit 200 includes a plurality of nozzle pipes 210, a common pipe 220, and a pipe joint 230. As shown in fig. 1, each of the plurality of nozzle pipes 210 has a plurality of discharge ports, for example, a plurality of nozzles 211, at different positions in the vertical direction. The plating solution is discharged from each nozzle 211. The plurality of nozzle pipes 210 are formed of an insulator, and do not adversely affect the electric field applied to the workpiece 1. As shown in fig. 2, the common pipe 220 communicates with one end of each of the nozzle pipes 210 and supplies the plating solution to the nozzle pipes 210. As shown in fig. 1 to 3, the pipe joint 230 is attachable to and detachable from an external pipe 30 provided in the plating tank 10.

The anode unit 300 has at least one (e.g., a plurality of) insoluble anodes 310, an anode tank 320, and at least one (e.g., 2) supplied power parts 330 of fig. 1. As shown in fig. 2 and 4, the plurality of insoluble anodes 310 are disposed at positions separated from the nozzle pipes 210 in the horizontal direction. The anode tank 320 includes partition walls 321 (front-side partition walls 321A, back-side partition walls 321B, and side-side partition walls 321C) arranged horizontally apart from the plurality of insoluble anodes 310, and surrounds the plurality of insoluble anodes 310. The partition wall 321 is formed of an insulator, and does not adversely affect the electric field applied to the workpiece 1. The power supply target section 330 is electrically connected to the plurality of insoluble anodes 310 and is detachable from an external power supply section provided in the plating tank 10.

The nozzle unit 200 and the anode unit 300 may be integrated by a suitable fixing means. In the present embodiment, as shown in fig. 1 and 2, the nozzle unit 200 and the anode unit 300 are integrated by 2 coupling portions 110. As shown in fig. 1, one end of the coupling portion 110 is fixed to, for example, the partition 321 of the anode unit 300, and the other end is fixed to, for example, the common pipe 220 of the nozzle unit 200.

According to this assembly 100, the nozzle unit 200 and the anode unit 300 can be integrally attached to and detached from the plating tank 10 by attaching and detaching the pipe joint 230 of the nozzle unit 200 to and detaching the supplied portion 330 of the anode unit 300 from the external pipe 30 and the external power supply portion 40. This improves workability of installation and maintenance of the module 100. In the present embodiment, the vertical position of the module 100 can be uniquely determined by placing the power-supplied portion 330 on the external power-supplying portion 40, and the horizontal position of the module 100 can be uniquely determined by connecting the pipe joint 230 to the external pipe 30.

In the present embodiment, the insoluble anode 310 does not require a mesh portion and a large number of through holes, and therefore, the resistance does not increase. The periphery of the insoluble anode 310 is partitioned from the plating bath 10 by partition walls 321(321A to 321C), and the partition walls 321 are normally permeable to at least a part of metal ions (positive ions) in the plating solution, while preventing negative ions generated in the plating bath 10 from entering the insoluble anode 310 (inside the partition walls 321). Since the plurality of nozzle pipes 210 are located outside the partition wall 321, the operation of discharging the plating solution from the plurality of nozzle pipes 210 is not hindered by the partition wall 321.

In the present embodiment, the power receiving portion 330 may include, for example, 2 connecting terminal portions 331 electrically connected to, for example, 2 external power supply portions 40 disposed at the edge of the upper opening 11 of the plating tank 10. Further, the common pipe 220 is formed to communicate with the upper end portions of the plurality of nozzle pipes 210 and to extend horizontally above the plurality of nozzle pipes 210. In this way, the pipe joint 230 of the module 100 and the external pipe 30 can be connected to each other and the power-supplied portion 330 of the module 100 and the external power-supplying portion 40 can be connected to the upper side of the plating tank 10. This improves workability of attaching and detaching the module 100 to and from the plating tank 10. As shown in fig. 3, the positions of the 2 connection terminal portions 331 are set to be on both sides of the pipe fitting 230 at the center in consideration of the wiring resistance on the plurality of insoluble anodes 310.

Here, as shown in fig. 1 and 5, when the anode unit 300 includes a plurality of insoluble anodes 310, the anode unit includes an anode plate (also referred to as an anode rod) 312 extending in the horizontal direction, and the plurality of insoluble anodes 310 are electrically connected to and supported by the anode plate 312. In this case, as shown in fig. 1, power-supplied portion 330 is electrically connected to anode plate 312.

In the present embodiment, as shown in fig. 1 and 2, the common pipe 220 is disposed at a position higher than the position of the upper end of the anode unit 300. As shown in fig. 1, the pipe joint 230 passes above the anode unit 300 and is connected to an external pipe 30 disposed at the edge of the upper opening 11 of the plating tank 10. Thus, when the module 100 is inserted into the plating tank 10 from just above the upper opening 11 of the plating tank 10, there is no member that interferes with the module 100. The module 100 inserted into the plating tank 10 is connected to the external power supply unit 40 and the external pipe 30 provided at the edge of the upper opening 11 of the plating tank 10, and therefore, the workability of installing the module 100 in the plating tank 10 can be improved. This further improves the workability of attaching and detaching the module 100 to and from the plating tank 10.

In the present embodiment, the lower end portions of the plurality of nozzle pipes 210 are fixed to the lower end portion of the anode tank 320. For example, as shown in fig. 1, a protruding portion 322 protruding horizontally from the front-side partition wall 321A may be provided, and the lower end portions of the plurality of nozzle pipes 210 may be fixed to the protruding portion 322. Thus, the upper and lower ends of the plurality of nozzle pipes 210 are stably supported by the common pipe 220 and the extension 322.

In the present embodiment, at least the front-side partition wall 321A of the partition walls 321 facing the plurality of nozzle pipes 210 is formed of a material (for example, a cation exchange membrane or an ion exchange resin) that selectively passes through metal ions in the plating solution. In this way, the metal ions generated in the partition walls 321 can be supplied to the workpiece 1 side through the partition walls 321, and the electrolytic treatment of the surface of the workpiece 1 can be promoted.

In the present embodiment, as shown in fig. 2, the rear-side partition wall 321B of the partition wall 321 may have an opening 321B1 (the region having the x mark in fig. 2 is an opening) through which the plating solution flows. Thus, the plating solution is supplied from above or below the partition wall 321, and the plating solution is discharged from the opening 321B1 of the rear-side partition wall 321B, whereby a circulation path for the plating solution in the partition wall 321 can be secured.

In the present embodiment, as shown in fig. 4, the plurality of insoluble anodes 310 may be arranged with a gap 311 between two insoluble anodes 310 adjacent in the horizontal direction. In this case, the backside partition wall 321B may have an opening 321B1 (see fig. 1) at a position facing the gap 311 between the two

insoluble anodes

310 and 310. In this way, the plating solution between the insoluble anode 310 and the front-side partition walls 321A can be guided to the openings 321B1 through the gaps 311, and the circulation of the plating solution in the partition walls 321 can be promoted.

In particular, in the present embodiment, as shown in fig. 1 and 4, the plating tank 10 has

overflow tanks

12A,12B on both sides thereof. When the level of the plating liquid in the plating tank 10 exceeds a certain level, the plating liquid in the plating tank 10 is discharged to the

overflow tanks

12A, 12B. The gap 311 and the opening 321B1 can form a flow path for the plating solution in the partition wall 321 to the

respective overflow vessels

12A and 12B.

In the present embodiment, as shown in fig. 5, the anode tank 320 may hold a shadow mask 350, and the shadow mask 350 may shield a part of an electric field formed between the insoluble anode 310 and the work 1. The shadow mask 350 can prevent the electric field from being formed in an unnecessary region, and can improve the plating quality of the workpiece 1. The mask portion 351 covers a surface facing the lower end of the workpiece 1. As shown in fig. 1, the shadow mask 350 shown in fig. 5 is vertically supported at a region between the surface-side partition walls 321A and the plurality of nozzle pipes 210. As shown in fig. 1, the shadow mask 350 holds the mask portion 351 by a plurality of protrusions 340 protruding forward from the front-side partition wall 321A. As shown in fig. 5, the shadow mask 350 has vertical portions 352 extending upward on both sides of the mask portion 351, and the upper end portions of the vertical portions 352 are held by the front-side partition walls 321A.

As shown in fig. 6, the shadow mask 350 may include a1 st shadow mask 350A and a 2 nd shadow mask 350B. The 1 st shadow mask 350A shields the lower side region of the electrolysis formed between the insoluble anode 310 and the workpiece 1. The 2 nd shadow mask 350B shields the upper region of the above-described electrolysis. The 1 st block mask 350A includes a mask portion 351A that blocks a lower region of an electric field, and vertical portions 352A extending upward on both sides of the mask portion 351A. The 2 nd shadow mask 350B includes a mask portion 351B that shields an upper region of an electric field, and vertical portions 352B extending upward on both sides of the mask portion 351B.

The anode box 320 may have an adjustment mechanism for adjusting the mounting position of each of the 1 st and 2

nd shadow masks

350A and 350B in the vertical direction. Fig. 7, which is an enlarged view of a portion B of fig. 6, shows an example of the adjustment mechanism. In fig. 7, a long hole 353A having a length axis in the vertical direction is formed in an upper region of the vertical portion 352A of the 1 st shadow mask 350A. The 1 st shadow mask 350A is allowed to move in the vertical direction within the range of the elongated hole 353A, and is fixed to the mounting plate 321A1 held on the front-side partition wall 321A of the anode case 320 by a bolt 354A at a desired position. Thereby adjusting the vertical installation position of the 1 st shadow mask 350A. Similarly, the 2 nd shadow mask 350B allows vertical movement within the range of the elongated hole 353B, and the mounting position in the vertical direction is adjusted by the bolt 354B at a desired position.

In this way, the mounting positions of the 1 st and 2

nd shadow masks

350A and 350B in the vertical direction are adjusted so that the height H of the aperture window of the electric field matches the dimension of the workpiece 1 in the vertical direction as shown in fig. 7. To facilitate this adjustment, vertical scales may be provided beside the

elongated holes

353A, 353B.

While the present embodiment has been described in detail as above, those skilled in the art will readily appreciate that many modifications are possible without substantially departing from the novel matters and advantages of the present invention. Accordingly, all such modifications are included in the scope of the present invention. For example, a term described at least once in the specification or the drawings together with a different term having a broader meaning or the same meaning can be replaced with the different term at any position in the specification or the drawings. All combinations of the embodiment and the modifications are also included in the scope of the present invention.

Description of the symbols

1 workpiece, 10 surface treatment tank, 11 upper opening, 20 conveying jig, 30 external piping, 40 external power supply part, 100 electrolytic treatment module, 110 connection part, 200 nozzle unit, 210 nozzle pipe, 211 nozzle (ejection port), 220 common piping, 230 piping joint, 300 anode unit, 310 insoluble anode, 311 gap, 312 anode plate (anode rod), 320 anode box, 321 partition, 321A front side partition, 321B back side partition, 321B1 opening, 321C side partition, 322 extension part, 330 power supply part, 331 connection terminal part, 340 projection, 350 mask, 350A 1 st mask, 350B 2 nd mask, 353A,353B,354A,354B adjustment mechanism.

Claims

1. An electrolytic processing module to be installed in a surface processing tank for performing electrolytic processing on a surface of a workpiece set as a cathode,

the electrolytic processing assembly has a nozzle unit; and

an anode unit integrally connected to the nozzle unit,

the nozzle unit includes:

the anode unit has:

2. The electrolytic processing assembly of claim 1,

the power supply receiving portion includes a connection terminal portion electrically connected to the external power supply portion provided at an edge portion of the upper opening portion of the surface treatment tank,

the common pipe is communicated with the upper end parts of the nozzle pipes and horizontally extends above the nozzle pipes.

3. The electrolytic processing assembly of claim 2,

the common pipe is disposed at a position higher than an upper end portion of the anode unit,

the pipe joint passes through the upper part of the anode unit and is connected to the external pipe provided at the edge of the upper opening of the surface treatment tank.

4. The electrolytic processing assembly of any one of claims 1 to 3,

the lower end portions of the plurality of nozzle pipes are fixed to the lower end portion of the anode tank.

5. The electrolytic processing assembly of any one of claims 1 to 4,

at least the surface-side partition wall of the partition walls, which faces the plurality of nozzle pipes, is formed of a material that selectively transmits metal ions in the processing liquid.

6. The electrolytic processing assembly of claim 5,

the back-side partition wall of the partition wall, which is opposed to the front-side partition wall, has an opening through which the treatment liquid flows.

7. The electrolytic processing assembly of claim 6,

the at least one insoluble anode includes a plurality of insoluble anodes arranged with a gap between two insoluble anodes adjacent in the horizontal direction,

the backside partition wall has the opening at a position opposite to the gap between the two insoluble anodes.

8. The electrolytic processing assembly of any one of claims 1 to 7,

the anode box holds a shadow mask that shields a portion of an electric field formed between the at least one insoluble anode and the workpiece.

9. The electrolytic processing assembly of claim 8,

the shadow mask includes a1 st shadow mask that shields a lower side region of the electrolysis, and a 2 nd shadow mask that shields an upper side region of the electrolysis.

10. The electrolytic processing assembly of claim 9,

the anode box has an adjustment mechanism for adjusting the mounting position of the 1 st and 2 nd shadow masks in the vertical direction.

11. A surface treatment device, characterized by comprising:

an electrolytic processing component according to any one of claims 1 to 10 disposed in the surface treatment bath.