JPWO2019059058A1 - Electrolytic treatment assembly and surface treatment device using the same - Google Patents

Abstract

The electrolytic treatment assembly 100 attached to the surface treatment tank 10 for electrolytically treating the surface of the work 1 set as a cathode includes a nozzle unit 200 and an anode unit 300 integrally connected to the nozzle unit. The nozzle unit includes a plurality of nozzle pipes 210, a common pipe 220, and a pipe joint 230 that connects the common pipe to an external pipe. The anode unit includes: an anode box 320; The anode box includes at least one insoluble anode 310 that is horizontally spaced from the plurality of nozzle tubes, and a partition that is horizontally spaced from the insoluble anode.

Description

  The present invention relates to an electrolytic treatment assembly disposed in a surface treatment tank such as an electrolytic plating device, and a surface treatment device using the same.

  In a surface treatment apparatus such as an electrolytic plating apparatus, a mesh box and a nozzle tube are provided on both sides of a work transfer path in a plating tank, as shown in Patent Document 1, for example. A consumable anode ball (soluble anode) is accommodated in the conductive mesh box. A nozzle tube is arranged between the workpiece and the mesh box. A plurality of ejection ports (nozzles) are arranged in a column in the nozzle tube, and the plating solution can be ejected toward the surface of the workpiece to be processed.

  In Patent Literature 2, an insoluble anode plate having a large number of through holes and a nozzle tube fixed on the back side of the insoluble anode plate are integrated. The nozzle tube is fixed to the insoluble anode plate at a position corresponding to the through hole, and the processing liquid is jetted toward the workpiece through the nozzle tube and the through hole.

JP 2012-046782 A JP-A-2002-226993

In the soluble electrode of Patent Document 1, the electrode material is dissolved to become a plating component. Soluble electrodes are consumables and require replacement. Further, the soluble electrode has a disadvantage that it is not formed only from the plating component and contains impurities (for example, phosphorus P). On the other hand, the insoluble electrode of Patent Literature 2 is such that the electrode material is not dissolved, the metal plus ion (for example, cupric oxide) in the plating solution in the plating tank becomes a plating component, and the insoluble electrode is used only as an electrode. , Better than soluble electrodes. Particularly, when a high current density of, for example, 10 to several tens A / dm ² is achieved, the soluble electrode is greatly consumed, and thus it is desirable to use an insoluble electrode.

  Further, in Patent Literature 2, since the anode and the nozzle tube are integrally connected, the anode and the nozzle tube can be integrally removed from the plating tank at the time of maintenance or the like, and workability is improved.

  However, in Patent Document 2, since a large number of through holes are indispensable in the insoluble anode plate, the electric resistance of the anode plate increases. Similarly, an increase in electrical resistance is unavoidable even in the conductive mesh box of Patent Document 1. Further, the insoluble anode plate of Patent Document 2 is exposed in the plating tank. The entire surface of the insoluble anode plate must be covered with an ion exchange membrane in order to avoid deterioration in plating quality due to the negative ions in the plating tank adhering to the insoluble anode plate. If the periphery of the insoluble anode plate is surrounded by a partition wall to prevent the ingress of negative ions, the jet from the nozzle tube toward the work is also blocked by the diaphragm.

  Some embodiments of the present invention integrate the insoluble anode with the nozzle tube without increasing the electrical resistance of the anode and while preventing negative ions in the processing tank from entering the insoluble anode side. It is an object of the present invention to provide an electrolytic processing assembly capable of improving maintenance workability and the like, and a surface treatment apparatus using the same.

(1) One embodiment of the present invention is an electrolytic treatment assembly attached to a surface treatment tank for electrolytically treating a surface of a work set as a cathode,
A nozzle unit,
An anode unit integrally connected to the nozzle unit,
Has,
The nozzle unit includes:
A plurality of nozzle tubes for ejecting the processing liquid from different positions in the vertical direction,
A common pipe for supplying the processing liquid to the plurality of nozzle pipes,
A pipe joint for connecting the common pipe to an external pipe installed in the surface treatment tank,
Including
The anode unit,
At least one insoluble anode disposed at a position horizontally separated from the plurality of nozzle tubes,
An anode box including the at least one insoluble anode and a partition wall separated in the horizontal direction, surrounding the at least one insoluble anode with the partition wall,
A power-receiving part that connects the at least one insoluble anode to an external power-supplying part installed in the surface treatment tank,
The present invention relates to an electrolytic processing assembly having:

  According to the electrolytic processing assembly according to one embodiment of the present invention, the nozzle unit is attached to and detached from the external piping by attaching and detaching the power-supplied portion of the anode unit to and from the external power supply portion. The anode unit can be integrally attached to and detached from the surface treatment tank. Thereby, the workability of installation and maintenance of the assembly is improved. Moreover, since the insoluble anode does not require a mesh portion or a large number of through holes, the electric resistance does not increase. In addition, the periphery of the insoluble anode is separated from the surface treatment tank by a partition wall, and the partition wall generally transmits metal ions (positive ions) in the processing solution, while negative ions generated in the surface treatment tank are transferred to the insoluble anode plate side. We can prevent invasion. Since the plurality of nozzle tubes are outside the partition wall, the ejection of the processing liquid from the plurality of nozzle tubes is not hindered by the partition wall.

(2) In one aspect (1) of the present invention, the power-supplied portion includes a connection terminal portion that is electrically connected to the external power-supply portion disposed at an edge of an upper opening of the surface treatment tank. The common pipe may communicate with upper ends of the plurality of nozzle pipes and extend horizontally above the plurality of nozzle pipes. In this case, the connection between the pipe joint of the assembly and the external pipe of the surface treatment tank and the connection between the power-supplied portion of the assembly and the external power supply portion of the surface treatment tank can be performed on the upper side of the surface treatment tank. Thereby, the workability of attaching and detaching the assembly to and from the surface treatment tank is improved.

(3) In one aspect (2) of the present invention, the common pipe is disposed at a position higher than a position of an upper end portion of the anode unit, and the pipe joint passes above the anode unit, and It may be connected to the external piping arranged at the edge of the upper opening of the surface treatment tank. With this configuration, there is no member that interferes with the assembly when the assembly is inserted into the surface treatment tank from directly above the upper opening of the surface treatment tank. The assembly inserted into the surface treatment tank is connected to the external power supply unit and the external piping installed at the edge of the upper opening of the surface treatment tank, so workability to install the assembly in the surface treatment tank is improved. Is done. Thereby, the workability of attaching and detaching the assembly to and from the surface treatment tank is further improved.

(4) In one aspect (1) to (3) of the present invention, lower ends of the plurality of nozzle tubes may be fixed to lower ends of the anode box. Thus, the plurality of nozzle tubes are stably supported at the upper and lower ends.

(5) In one aspect (1) to (4) of the present invention, at least a surface-side partition facing the plurality of nozzle tubes among the partition walls is made of a material that selectively permeates metal ions in the treatment liquid. It may be formed. In this way, the metal ions generated in the partition can be supplied to the work through the surface-side partition, and the electrolytic treatment of the surface of the work is promoted.

(6) In one aspect (5) of the present invention, a rear-side partition facing the front-side partition among the partition may have an opening through which the treatment liquid flows. In this manner, the processing liquid is supplied from above or below the partition, the processing liquid is discharged from the opening of the rear partition, and the processing liquid in the partition can be circulated.

(7) In one aspect (6) of the present invention, the at least one insoluble anode includes a plurality of insoluble anodes arranged with a gap between two adjacent ones in the horizontal direction, and the back side partition wall May have the opening at a position facing the gap between the two insoluble anodes. In this way, the treatment liquid between the insoluble anode and the front-side partition can be guided to the opening through the gap, and the circulation of the treatment liquid in the partition can be promoted.

(8) In one aspect (1) to (7) of the present invention, the anode box holds a shielding mask that shields a part of an electric field formed between the at least one insoluble anode and the work. be able to. The shielding mask can prevent an electric field from being formed in a useless area, and can improve the electrolytic treatment quality of the work.

(9) In one aspect (8) of the present invention, the shielding mask includes a first shielding mask for shielding a lower region of the electrolysis, and a second shielding mask for shielding an upper region of the electrolysis. Can be. Thereby, it is possible to prevent the electric field from being concentrated on the upper edge and the lower edge of the work.

(10) In one aspect (9) of the present invention, the anode box may have an adjusting mechanism for adjusting a vertical mounting position of each of the first shielding mask and the second shielding mask. Thereby, the mounting positions of the first and second shielding masks in the vertical direction are respectively adjusted so that the height of the opening window of the electric field matches the size of the work in the vertical direction.

(11) Another aspect of the present invention provides:
A surface treatment tank for electrolytically treating the surface of the work;
The electrolytic treatment assembly according to any one of the above (1) to (10), which is disposed in the surface treatment tank;
And a surface treatment apparatus having the same.
According to another aspect of the present invention, it is possible to provide a surface treatment apparatus having the functions and effects described in the above (1) to (10).

It is sectional drawing of the continuous plating apparatus which concerns on one Embodiment of this invention. It is the front view which looked at the electrolysis assembly in the plating tank of FIG. 1 from the workpiece side. It is a top view of a part of continuous plating apparatus of FIG. FIG. 2 is a view showing two assemblies arranged along a longitudinal direction of the plating tank of FIG. 1. It is a figure showing a shielding mask held by an assembly. It is a figure showing a 1st shielding mask and a 2nd shielding mask. It is sectional drawing of the adjustment mechanism which adjusts the mounting position of a 1st shielding mask and a 2nd shielding mask in the perpendicular direction.

  Hereinafter, preferred embodiments of the present invention will be described in detail. Note that the present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not necessarily.

1. Overview of Continuous Plating Apparatus FIG. 1 is a sectional view of a surface treatment apparatus according to the present embodiment, for example, a continuous plating apparatus, and FIG. 2 is a plan view. In FIG. 1, a plating tank 10 is a tank for plating a work 1 by accommodating a work 1 suspended and supported by a transport jig 20 in a plating solution 2. The plating tank 10 has a peripheral wall and a bottom wall, and contains a plating solution 2 which is a processing solution.

  The work 1 is a circuit board, a flexible circuit board, or the like. The transport jig 20 can continuously transport the work and energize the work 1. The work 1 functions as a cathode. In practice, a power supply unit (which may be a conveyance rail) in sliding contact with the conveyance jig 20 is connected to a negative terminal of a power supply, and the work 1 is set to a cathode via the power supply unit and the conveyance jig 20.

  The work 1 suspended and supported by the transport jig 20 is continuously transported along a transport direction A shown in FIG. 2 in a direction orthogonal to the paper surface of FIG. Although illustration of the means for continuously transporting the work 1 is omitted, it can be constituted by a chain, a cylinder or the like continuously driven by sprockets. One work 1 is held by the transfer jig 20, and a plurality of works 1 are continuously transferred in the plating tank 10 as shown in FIG. 2. If the work 1 is a rigid body such as a circuit board, the transfer jig 20 can hold the work 1 in a hanging state by holding the upper end of the work 1 with the chuck 21A. When the work 1 is flexible, such as a flexible circuit board, the transfer jig 20 has a frame portion 22, and the lower end of the work 1 can be held by the chuck 21B and pulled downward.

2. Electrolytic Processing Assembly As shown in FIG. 1, the plating tank 10 is provided with an electrolytic processing assembly 100. The assembly 100 has a nozzle unit 200 and an anode unit 300 integrally connected to the nozzle unit 200.

  Here, FIGS. 2 and 3 show the assembly 100 arranged on the most upstream side of the plating tank 10, but a plurality of assemblies 100 are arranged along the longitudinal direction of the plating tank 10 as shown in FIG. be able to. When both surfaces of the work 1 are processed, two assemblies 100 are arranged on both sides of the work 1, and a total of four assemblies 100 are arranged in FIG.

  The nozzle unit 200 has a plurality of nozzle pipes 210, a common pipe 220, and a pipe joint 230, as shown in FIGS. As shown in FIG. 1, each of the plurality of nozzle tubes 210 has a plurality of ejection ports, for example, a plurality of nozzles 211 at different positions in the vertical direction. A plating solution is jetted from each nozzle 211. The plurality of nozzle tubes 210 are formed of an insulator and do not adversely affect the electric field acting on the work 1. As shown in FIG. 2, the common pipe 220 communicates with one end of each of the plurality of nozzle tubes 210 to supply a plating solution to the plurality of nozzle tubes 210. The pipe joint 230 is detachable from the external pipe 30 installed in the plating tank 10, as shown in FIGS.

  The anode unit 300 includes at least one, for example, a plurality of insoluble anodes 310, an anode box 320, and at least one, for example, two power-supplied parts 330 in FIG. Each of the plurality of insoluble anodes 310 is arranged at a position horizontally separated from the nozzle tube 210 as shown in FIGS. The anode box 320 includes a plurality of insoluble anodes 310 and partition walls 321 (a front partition wall 321A, a rear partition wall 321B, and a side wall partition 321C) which are arranged in a horizontal direction and surrounds the plurality of insoluble anodes 310. The partition 321 is formed of an insulator and does not adversely affect the electric field acting on the work 1. The power-supplied section 330 is electrically connected to the plurality of insoluble anodes 310, and is detachable from an external power-supply section provided in the plating tank 10.

  The nozzle unit 200 and the anode unit 300 can be integrated by an appropriate fixing means. In this embodiment, as shown in FIGS. 1 and 2, the nozzle unit 200 and the anode unit 300 are integrated by the two connecting portions 110. As shown in FIG. 1, the connecting portion 110 has one end fixed to, for example, the partition 321 of the anode unit 300, and the other end fixed to, for example, the common pipe 220 of the nozzle unit 200.

  According to this assembly 100, the nozzle joint 200 of the nozzle unit 200 is attached to and detached from the external pipe 30, and the power-supplied part 330 of the anode unit 300 is attached to and detached from the external power-supplying part 40. The anode unit 300 can be integrally attached to and detached from the plating tank 10. Thereby, the workability of the installation and maintenance of the assembly 100 is improved. In the present embodiment, by placing the power-supplied part 330 on the external power supply part 40, the vertical position of the assembly 100 is uniquely determined, and by connecting the pipe joint 230 to the external pipe 30, The horizontal position of the assembly 100 is uniquely determined.

  In the present embodiment, since the insoluble anode 310 does not require a mesh portion or a large number of through holes, the electric resistance does not increase. Further, the periphery of the insoluble anode 310 is partitioned from the plating tank 10 by partition walls 321 (321A to 321C), and the partition wall 321 generally at least partially transmits metal ions (positive ions) in a plating solution, It is possible to prevent the negative ions generated in 10 from entering the insoluble anode 310 side (inside the partition 321). Since the plurality of nozzle tubes 210 are outside the partition 321, the ejection of the plating solution from the plurality of nozzle tubes 210 is not hindered by the partition 321.

  In the present embodiment, the power receiving section 330 includes, for example, two connection terminal sections 331 electrically connected to, for example, the two external power feeding sections 40 arranged at the edge of the upper opening 11 of the plating tank 10. Can be. The common pipe 220 communicates with the upper ends of the plurality of nozzle pipes 210 and extends horizontally above the plurality of nozzle pipes 210. In this case, the connection between the pipe joint 230 of the assembly 100 and the external pipe 30 and the connection between the power-supplied portion 330 and the external power-supplying portion 40 of the assembly 100 can be performed on the upper side of the plating tank 10. Thereby, the workability of attaching and detaching the assembly 100 to and from the plating tank 10 is improved. The positions of the two connection terminals 331 are set on both sides of the pipe joint 230 located at the center as shown in FIG. 3 in consideration of the wiring resistance to the plurality of insoluble anodes 310.

  Here, when the anode unit 300 has a plurality of insoluble anodes 310, as shown in FIGS. 1 and 5, the anode unit 300 has an anode plate (also referred to as an anode bar) 312 extending in the horizontal direction, and the plurality of insoluble anodes 310 It is electrically connected to the plate 312 and is supported. In this case, the power supply unit 330 is electrically connected to the anode plate 312 as shown in FIG.

  In the present embodiment, as shown in FIGS. 1 and 2, the common pipe 220 is arranged at a position higher than the position of the upper end of the anode unit 300. As shown in FIG. 1, the pipe joint 230 passes above the anode unit 300 and is connected to the external pipe 30 arranged at the edge of the upper opening 11 of the plating tank 10. In this case, there is no member that interferes with the assembly 100 when the assembly 100 is inserted into the plating tank 10 from directly above the upper opening 11 of the plating tank 10. The assembly 100 inserted into the plating tank 10 is connected to the external power supply unit 40 and the external pipe 30 installed at the edge of the upper opening 11 of the plating tank 10, so that the assembly 100 is installed in the plating tank 10. Workability is improved. Thereby, the workability of attaching and detaching the assembly 100 to and from the plating tank 10 is further improved.

  In the present embodiment, the lower ends of the plurality of nozzle tubes 210 are fixed to the lower ends of the anode boxes 320. For example, as shown in FIG. 1, an overhang portion 322 that extends horizontally from the front-side partition wall 321 </ b> A can be provided, and the lower ends of the plurality of nozzle tubes 210 can be fixed to the overhang portion 322. In this case, the upper and lower ends of the plurality of nozzle pipes 210 are stably supported by the common pipe 220 and the overhang portion 322.

  In the present embodiment, at least the surface-side partition 321A of the partition 321 facing the plurality of nozzle tubes 210 is formed of a material (for example, a cation exchange membrane or an ion exchange resin) that selectively transmits metal ions in the plating solution. You. Thus, the metal ions generated in the partition 321 can be supplied to the work 1 through the partition 321, and the electrolytic treatment of the surface of the work 1 is promoted.

  In the present embodiment, as shown in FIG. 2, the rear partition 321B of the partition 321 can have an opening 321B1 through which a plating solution flows (an area marked with a cross in FIG. 2 is an opening) 321B1. Thus, the plating solution is supplied from above or below the partition 321, the plating solution is discharged from the opening 321 </ b> B <b> 1 of the rear partition 321 </ b> B, and a circulation path of the plating solution in the partition 321 is secured.

  In the present embodiment, the plurality of insoluble anodes 310 can be arranged with a gap 311 between two adjacent ones in the horizontal direction, as shown in FIG. In this case, the rear side partition wall 321B can have an opening 321B1 at a position facing the gap 311 between the two insoluble anodes 310, 310 (see FIG. 1). Thus, the plating solution between the insoluble anode 310 and the front-side partition 321A can be guided to the opening 321B1 through the gap 311 to promote the circulation of the plating solution in the partition 321.

  In particular, in the present embodiment, as shown in FIGS. 1 and 4, overflow tanks 12 </ b> A and 12 </ b> B are provided on both sides of the plating tank 10. When the level of the plating solution in the plating tank 10 exceeds a certain level, the plating solution in the plating tank 10 is discharged to the overflow tanks 12A and 12B. The gap 311 and the opening 321B1 can form a flow path for the plating solution in the partition 321 to flow to the overflow tanks 12A and 12B.

  In the present embodiment, the anode box 320 can hold a shielding mask 350 that shields a part of the electric field formed between the insoluble anode 310 and the work 1 as shown in FIG. The shielding mask 350 can prevent an electric field from being formed in a useless area, and can improve the plating quality of the work 1. There is a mask portion 351 that covers a surface facing the lower end of the work 1. As shown in FIG. 1, the shielding mask 350 shown in FIG. 5 is vertically supported in a region between the front-side partition 321A and the plurality of nozzle tubes 210. As shown in FIG. 1, the mask portion 351 of the shielding mask 350 is held by a plurality of protrusions 340 protruding forward from the front-side partition wall 321A. As shown in FIG. 5, the shielding mask 350 has a vertical portion 352 extending upward on both sides of the mask portion 351, and the upper end of the vertical portion 352 is held by the front-side partition 321 </ b> A.

  As shown in FIG. 6, the shielding mask 350 may include a first shielding mask 350A and a second shielding mask 350B. The first shielding mask 350A shields a lower region of the electrolysis formed between the insoluble anode 310 and the work 1. The second shielding mask 350B shields the upper region of the electrolysis. The first shielding mask 350A includes a mask portion 351A that shields a lower region of the electric field, and a vertical portion 352A that extends upward on both sides of the mask portion 351A. The second shielding mask 350B includes a mask portion 351B that shields an upper region of the electric field, and a vertical portion 352B that extends upward on both sides of the mask portion 351B.

  The anode box 320 can have an adjustment mechanism for adjusting the vertical mounting position of each of the first shielding mask 350A and the second shielding mask 350B. One example of the adjusting mechanism is shown in FIG. 7, which is an enlarged view of a portion B in FIG. In FIG. 7, an elongated hole 353A having a longitudinal axis in the vertical direction is formed in an upper region of the vertical portion 352A of the first shielding mask 350A. The first shielding mask 350A is allowed to move in the vertical direction within the range of the elongated hole 353A, and is fixed to a mounting plate 321A1 held on the front wall 321A of the anode box 320 by a bolt 354A at a desired position. Thereby, the mounting position of the first shielding mask 350A in the vertical direction is adjusted. Similarly, the second shielding mask 350B is allowed to move in the vertical direction within the range of the elongated hole 353B, and the mounting position in the vertical direction is adjusted at a desired position by the bolt 354B.

  In this way, the mounting positions of the first and second shielding masks 350A and 350B in the vertical direction are adjusted so that the height H of the electric field opening window shown in FIG. To facilitate this adjustment, a vertical scale may be provided next to the long holes 353A, 353B.

  Although the present embodiment has been described in detail as described above, those skilled in the art can easily understand that many modifications that do not substantially depart from the novel matter and effects of the present invention are possible. Therefore, such modifications are all included in the scope of the present invention. For example, in the specification or the drawings, a term described at least once together with a broader or synonymous different term can be replaced with the different term in any part of the specification or the drawing. In addition, all combinations of the present embodiment and the modifications are also included in the scope of the present invention.

  Reference Signs List 1 work, 10 surface treatment tank, 11 upper opening, 20 transport jig, 30 external piping, 40 external power supply, 100 electrolytic treatment assembly, 110 connecting part, 200 nozzle unit, 210 nozzle pipe, 211 nozzle (spout) , 220 common pipe, 230 pipe joint, 300 anode unit, 310 insoluble anode, 311 void, 312 anode plate (anode bar), 320 anode box, 321 partition, 321A front partition, 321B rear partition, 321B1 opening, 321C side Side partition, 322 overhanging part, 330 power receiving part, 331 connection terminal part, 340 protrusion, 350 shielding mask, 350A first shielding mask, 350B second shielding mask, 353A, 353B, 354A, 354B adjustment mechanism

(9) In one embodiment (8) of the present invention, the shielding masks include a first shielding mask for shielding the lower region of the field, a second shielding mask for shielding the upper region of the field, the Can be. Thereby, it is possible to prevent the electric field from being concentrated on the upper edge and the lower edge of the work.

Anode unit 300 includes at least one example, a plurality of insoluble anodes 310 in FIG. 1, an anode box 320, and at least one, for example, two of the feeding portion 330. Each of the plurality of insoluble anodes 310 is arranged at a position horizontally separated from the nozzle tube 210 as shown in FIGS. The anode box 320 includes a plurality of insoluble anodes 310 and partition walls 321 (a front partition wall 321A, a rear partition wall 321B, and a side wall partition 321C) that are arranged in a horizontal direction and surrounds the plurality of insoluble anodes 310. The partition 321 is formed of an insulator and does not adversely affect the electric field acting on the work 1. The power-supplied section 330 is electrically connected to the plurality of insoluble anodes 310, and is detachable from an external power-supply section provided in the plating tank 10.

In the present embodiment, the anode box 320 can hold a shielding mask 350 that shields a part of the electric field formed between the insoluble anode 310 and the work 1 as shown in FIG. The shielding mask 350 can prevent an electric field from being formed in a useless area, and can improve the plating quality of the work 1. The shielding mask 350 has a mask portion 351 that covers a surface facing the lower end of the work 1. As shown in FIG. 1, the shielding mask 350 shown in FIG. 5 is vertically supported in a region between the front-side partition 321A and the plurality of nozzle tubes 210. As shown in FIG. 1, the mask portion 351 of the shielding mask 350 is held by a plurality of protrusions 340 protruding forward from the front-side partition wall 321A. As shown in FIG. 5, the shielding mask 350 has a vertical portion 352 extending upward on both sides of the mask portion 351, and the upper end of the vertical portion 352 is held by the front-side partition 321 </ b> A.

As shown in FIG. 6, the shielding mask 350 may include a first shielding mask 350A and a second shielding mask 350B. The first shielding mask 350A shields a lower region of an electric field formed between the insoluble anode 310 and the work 1. The second shielding mask 350B shields an upper region of the electric field . The first shielding mask 350A includes a mask portion 351A that shields a lower region of the electric field, and a vertical portion 352A that extends upward on both sides of the mask portion 351A. The second shielding mask 350B includes a mask portion 351B that shields an upper region of the electric field, and a vertical portion 352B that extends upward on both sides of the mask portion 351B.

Claims (11)

An electrolytic treatment assembly attached to a surface treatment tank for electrolytically treating the surface of a work set as a cathode,
A nozzle unit,
An anode unit integrally connected to the nozzle unit,
Has,
The nozzle unit includes:
A plurality of nozzle tubes for ejecting the processing liquid from different positions in the vertical direction,
A common pipe for supplying the processing liquid to the plurality of nozzle pipes,
A pipe joint for connecting the common pipe to an external pipe installed in the surface treatment tank,
Including
The anode unit,
At least one insoluble anode disposed at a position horizontally separated from the plurality of nozzle tubes,
An anode box including the at least one insoluble anode and a partition wall separated in the horizontal direction, surrounding the at least one insoluble anode with the partition wall,
A power-receiving part that connects the at least one insoluble anode to an external power-supplying part installed in the surface treatment tank,
An electrolytic processing assembly comprising: In claim 1,
The power supply unit includes a connection terminal unit that is electrically connected to the external power supply unit installed at an edge of an upper opening of the surface treatment tank,
The said common piping is connected with each upper end part of the said several nozzle pipe, and extends horizontally at the upper part of these nozzle pipes, The electrolytic processing assembly characterized by the above-mentioned. In claim 2,
The common pipe is disposed at a position higher than the upper end of the anode unit,
An electrolytic processing assembly, wherein the pipe joint passes above the anode unit and is connected to the external pipe installed at the edge of the upper opening of the surface treatment tank. In any one of claims 1 to 3,
An electrolytic processing assembly, wherein lower ends of the plurality of nozzle tubes are fixed to lower ends of the anode box. In any one of claims 1 to 4,
An electrolytic processing assembly, wherein at least a surface-side partition facing the plurality of nozzle tubes among the partition walls is formed of a material that selectively transmits metal ions in the processing solution. In claim 5,
An electrolytic processing assembly, wherein a rear-side partition facing the front-side partition among the partition has an opening through which the processing liquid flows. In claim 6,
The at least one insoluble anode includes a plurality of insoluble anodes disposed with a gap between the two adjacent in the horizontal direction,
The backside partition has the opening at a position facing the gap between the two insoluble anodes. In any one of claims 1 to 7,
The electrolytic processing assembly according to claim 1, wherein the anode box holds a shielding mask for shielding a part of an electric field formed between the at least one insoluble anode and the work. In claim 8,
The electrolytic processing assembly according to claim 1, wherein the shielding mask includes a first shielding mask that shields a lower region of the electrolysis, and a second shielding mask that shields an upper region of the electrolysis. In claim 9,
The electrolytic processing assembly according to claim 1, wherein the anode box has an adjusting mechanism for adjusting a vertical mounting position of each of the first shielding mask and the second shielding mask. A surface treatment tank for electrolytically treating the surface of the work;
The electrolytic treatment assembly according to any one of claims 1 to 10, which is disposed in the surface treatment tank.
A surface treatment apparatus comprising: