PH12016502286A1 - Composite sheet for forming protective film - Google Patents

Composite sheet for forming protective film

Info

Publication number
PH12016502286A1
PH12016502286A1 PH12016502286A PH12016502286A PH12016502286A1 PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1 PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1
Authority
PH
Philippines
Prior art keywords
protective film
composite sheet
forming protective
supporting sheet
forming
Prior art date
Application number
PH12016502286A
Other languages
English (en)
Inventor
Naoya Saiki
Daisuke Yamamoto
Hiroyuki Yoneyama
Youichi Inao
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12016502286A1 publication Critical patent/PH12016502286A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
PH12016502286A 2014-05-23 2016-11-16 Composite sheet for forming protective film PH12016502286A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014106757 2014-05-23
PCT/JP2015/064202 WO2015178346A1 (ja) 2014-05-23 2015-05-18 保護膜形成用複合シート

Publications (1)

Publication Number Publication Date
PH12016502286A1 true PH12016502286A1 (en) 2017-02-13

Family

ID=54554016

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016502286A PH12016502286A1 (en) 2014-05-23 2016-11-16 Composite sheet for forming protective film

Country Status (7)

Country Link
JP (1) JP6319433B2 (ja)
KR (1) KR102378063B1 (ja)
CN (1) CN106463373B (ja)
PH (1) PH12016502286A1 (ja)
SG (1) SG11201609543VA (ja)
TW (2) TWI741336B (ja)
WO (1) WO2015178346A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106463373B (zh) * 2014-05-23 2020-01-03 琳得科株式会社 保护膜形成用复合片
KR102637275B1 (ko) * 2016-02-22 2024-02-15 린텍 가부시키가이샤 보호막 형성용 시트, 보호막 형성용 시트의 제조 방법 및 반도체 장치의 제조 방법
WO2017150330A1 (ja) * 2016-03-02 2017-09-08 古河電気工業株式会社 ウエハ加工用テープ
CN108243616B (zh) * 2016-03-04 2022-10-28 琳得科株式会社 半导体加工用片
KR102313074B1 (ko) * 2016-03-24 2021-10-14 린텍 가부시키가이샤 지지 시트 및 보호막 형성용 복합 시트
TWI722170B (zh) * 2016-04-28 2021-03-21 日商琳得科股份有限公司 保護膜形成用膜以及保護膜形成用複合片
TWI778960B (zh) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
TWI721158B (zh) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 保護膜形成用膜及保護膜形成用複合片
JP6935807B2 (ja) * 2017-02-02 2021-09-15 昭和電工マテリアルズ株式会社 電子部品の製造方法、仮保護用樹脂組成物及び仮保護用樹脂フィルム
WO2018179475A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 保護膜形成用複合シート
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート
JP2019079961A (ja) * 2017-10-25 2019-05-23 リンテック株式会社 半導体加工用シート
JP7325403B2 (ja) * 2018-04-18 2023-08-14 リンテック株式会社 ワーク加工用シート
WO2021130823A1 (ja) * 2019-12-23 2021-07-01 昭和電工マテリアルズ株式会社 ダイシング・ダイボンディング一体型フィルム及びその品質管理方法、並びに半導体装置の製造方法
JP2022157810A (ja) 2021-03-31 2022-10-14 リンテック株式会社 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法
JP2023144842A (ja) 2022-03-28 2023-10-11 リンテック株式会社 樹脂膜形成用複合シート、キット、及び、樹脂膜付きワーク加工物の製造方法

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JPS58149048A (ja) * 1982-03-02 1983-09-05 Sony Corp 昇華性染料の転写によるカラーハードコピー印画紙の形成方法
CN100355031C (zh) 2002-03-12 2007-12-12 浜松光子学株式会社 基板的分割方法
JP4128058B2 (ja) * 2002-09-24 2008-07-30 三井化学株式会社 粘着フィルム及びその使用方法
JP5165829B2 (ja) * 2004-02-26 2013-03-21 日東電工株式会社 ロール状ウエハ加工用粘着シート
JP4642436B2 (ja) * 2004-11-12 2011-03-02 リンテック株式会社 マーキング方法および保護膜形成兼ダイシング用シート
JP2007109808A (ja) * 2005-10-12 2007-04-26 Furukawa Electric Co Ltd:The 半導体ウエハダイシング−ダイボンド用粘接着テープ
JP4762671B2 (ja) 2005-10-26 2011-08-31 古河電気工業株式会社 ダイシングテープ、および半導体ウェハダイシング方法
JP2011040449A (ja) * 2009-08-07 2011-02-24 Du Pont Mitsui Polychem Co Ltd ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
JP2011151362A (ja) 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
JPWO2011096350A1 (ja) * 2010-02-02 2013-06-10 三井化学東セロ株式会社 表面保護フィルム
KR101900961B1 (ko) * 2010-03-01 2018-09-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 거친 표면을 보호하기 위한 반투명 필름
JP5483713B2 (ja) * 2010-05-12 2014-05-07 日東電工株式会社 表面保護フィルム
JP5391158B2 (ja) * 2010-06-30 2014-01-15 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
JP2012033637A (ja) * 2010-07-29 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法
JP5889892B2 (ja) * 2011-06-14 2016-03-22 デンカ株式会社 粘着シート及び電子部品の製造方法
WO2013047674A1 (ja) * 2011-09-30 2013-04-04 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
JP5583725B2 (ja) * 2012-09-20 2014-09-03 リンテック株式会社 レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法
CN106463373B (zh) * 2014-05-23 2020-01-03 琳得科株式会社 保护膜形成用复合片

Also Published As

Publication number Publication date
CN106463373B (zh) 2020-01-03
TW201602303A (zh) 2016-01-16
TW201940624A (zh) 2019-10-16
SG11201609543VA (en) 2016-12-29
KR20170008749A (ko) 2017-01-24
JP6319433B2 (ja) 2018-05-09
TWI675900B (zh) 2019-11-01
TWI741336B (zh) 2021-10-01
JPWO2015178346A1 (ja) 2017-04-20
KR102378063B1 (ko) 2022-03-23
WO2015178346A1 (ja) 2015-11-26
CN106463373A (zh) 2017-02-22

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