NO990150D0 - Fjerning av materiale ved strÕling pÕf°rt ved skrÕ vinkel - Google Patents
Fjerning av materiale ved strÕling pÕf°rt ved skrÕ vinkelInfo
- Publication number
- NO990150D0 NO990150D0 NO990150A NO990150A NO990150D0 NO 990150 D0 NO990150 D0 NO 990150D0 NO 990150 A NO990150 A NO 990150A NO 990150 A NO990150 A NO 990150A NO 990150 D0 NO990150 D0 NO 990150D0
- Authority
- NO
- Norway
- Prior art keywords
- removal
- undesired material
- substrate
- radiation
- inclined angle
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Drying Of Semiconductors (AREA)
- Laser Beam Processing (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Confectionery (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Vending Machines For Individual Products (AREA)
- Sampling And Sample Adjustment (AREA)
- Road Signs Or Road Markings (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/686,523 US5800625A (en) | 1996-07-26 | 1996-07-26 | Removal of material by radiation applied at an oblique angle |
PCT/US1997/013317 WO1998004366A1 (en) | 1996-07-26 | 1997-07-22 | Removal of material by radiation applied at an oblique angle |
Publications (2)
Publication Number | Publication Date |
---|---|
NO990150D0 true NO990150D0 (no) | 1999-01-13 |
NO990150L NO990150L (no) | 1999-03-02 |
Family
ID=24756659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO990150A NO990150L (no) | 1996-07-26 | 1999-01-13 | Fjerning av materiale ved strÕling fra skrÕ vinkel |
Country Status (17)
Country | Link |
---|---|
US (1) | US5800625A (no) |
EP (1) | EP0921871B1 (no) |
JP (1) | JP2000515811A (no) |
KR (1) | KR100476814B1 (no) |
CN (1) | CN1231623A (no) |
AT (1) | ATE242065T1 (no) |
AU (1) | AU3966397A (no) |
BR (1) | BR9710764A (no) |
CZ (1) | CZ19899A3 (no) |
DE (1) | DE69722633T2 (no) |
EA (1) | EA199900160A1 (no) |
HU (1) | HUP9903927A3 (no) |
LV (1) | LV12345A (no) |
MY (1) | MY113873A (no) |
NO (1) | NO990150L (no) |
TW (1) | TW388075B (no) |
WO (1) | WO1998004366A1 (no) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10244392A (ja) * | 1997-03-04 | 1998-09-14 | Semiconductor Energy Lab Co Ltd | レーザー照射装置 |
US6494217B2 (en) * | 1998-03-12 | 2002-12-17 | Motorola, Inc. | Laser cleaning process for semiconductor material and the like |
AU5408999A (en) * | 1998-05-26 | 1999-12-13 | Schering Aktiengesellschaft | Treatment of infertility with camp-increasing compounds alone or in combination with at least one meiosis-stimulating compound |
US7649153B2 (en) * | 1998-12-11 | 2010-01-19 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam |
US6333485B1 (en) * | 1998-12-11 | 2001-12-25 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam |
DE19964443B4 (de) * | 1999-04-07 | 2007-08-16 | Shell Solar Gmbh | Vorrichtung zum Abtragen von Schichten auf einem Werkstück |
US6881687B1 (en) | 1999-10-29 | 2005-04-19 | Paul P. Castrucci | Method for laser cleaning of a substrate surface using a solid sacrificial film |
US6582857B1 (en) | 2000-03-16 | 2003-06-24 | International Business Machines Corporation | Repair of masks to promote adhesion of patches |
US6805751B2 (en) | 2000-07-24 | 2004-10-19 | Alkansas State University | Method and apparatus for removal of minute particles from a surface using thermophoresis to prevent particle redeposition |
AU2001282862A1 (en) * | 2000-07-24 | 2002-02-05 | Florida State University Research Foundation | Method and apparatus for removing minute particles from a surface |
US20020029956A1 (en) * | 2000-07-24 | 2002-03-14 | Allen Susan Davis | Method and apparatus for removing minute particles from a surface |
US6425956B1 (en) * | 2001-01-05 | 2002-07-30 | International Business Machines Corporation | Process for removing chemical mechanical polishing residual slurry |
US6635845B2 (en) * | 2001-05-19 | 2003-10-21 | Imt Co., Ltd. | Dry surface cleaning apparatus using a laser |
US20030062126A1 (en) * | 2001-10-03 | 2003-04-03 | Scaggs Michael J. | Method and apparatus for assisting laser material processing |
US7276127B2 (en) * | 2002-02-01 | 2007-10-02 | Metastable Instruments, Inc. | Method and apparatus for cleaning with internally reflected electromagnetic radiation |
AU2003251606A1 (en) * | 2002-07-25 | 2004-02-16 | Arkansas State University | Method and apparatus for removing minute particle(s) from a surface |
KR20040016406A (ko) * | 2002-08-15 | 2004-02-21 | 호야 가부시키가이샤 | 광 모듈 |
US6852946B2 (en) * | 2002-12-20 | 2005-02-08 | Caterpillar Inc | Laser-induced plasma micromachining |
US6747243B1 (en) | 2002-12-24 | 2004-06-08 | Novellus Systems, Inc. | Spot cleaning of particles after inspection |
US7006222B2 (en) * | 2003-01-08 | 2006-02-28 | Kla-Tencor Technologies Corporation | Concurrent measurement and cleaning of thin films on silicon-on-insulator (SOI) |
US7247986B2 (en) | 2003-06-10 | 2007-07-24 | Samsung Sdi. Co., Ltd. | Organic electro luminescent display and method for fabricating the same |
US7341695B1 (en) * | 2003-12-16 | 2008-03-11 | Stuart Garner | Anti-fouling apparatus and method |
DE102005020072B4 (de) * | 2005-04-22 | 2007-12-06 | Forschungsverbund Berlin E.V. | Verfahren zum Feinpolieren/-strukturieren wärmeempfindlicher dielektrischer Materialien mittels Laserstrahlung |
DE202005021296U1 (de) * | 2005-05-27 | 2007-10-04 | Emag Laser Tec Gmbh | Vorrichtung zur Behandlung von Werkstückoberflächen |
US20070022623A1 (en) * | 2005-07-29 | 2007-02-01 | Board Of Regents Of University Of Nebraska | Laser surface drying |
JP2008073760A (ja) * | 2006-09-25 | 2008-04-03 | Sumitomo Electric Ind Ltd | 付着物除去方法 |
EP2102711A1 (en) * | 2006-12-08 | 2009-09-23 | Canon Kabushiki Kaisha | Exposure appararus |
JP5202876B2 (ja) * | 2007-06-06 | 2013-06-05 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
US8002899B2 (en) * | 2008-09-30 | 2011-08-23 | Applied Materials, Inc. | Method and apparatus for mask pellicle adhesive residue cleaning |
JP5658245B2 (ja) * | 2009-06-23 | 2015-01-21 | エーエスエムエル ネザーランズ ビー.ブイ. | レーザクリーニングデバイス、リソグラフィ投影装置および表面を浄化する方法 |
US8310670B2 (en) * | 2009-07-08 | 2012-11-13 | Universidade De Vigo | Method for removal of wax from porous stones in historical monuments |
JP2011085642A (ja) * | 2009-10-13 | 2011-04-28 | Hitachi High-Technologies Corp | Fpdパネル実装装置及び実装方法 |
US20120132629A1 (en) * | 2010-11-30 | 2012-05-31 | Electro Scientific Industries, Inc. | Method and apparatus for reducing taper of laser scribes |
CN102380491A (zh) * | 2011-08-01 | 2012-03-21 | 迪普干冰制造(大连)有限公司 | 一种加热吸尘搭配干冰清洗的表面脱漆处理设备及方法 |
KR101507215B1 (ko) * | 2013-02-07 | 2015-03-30 | 주식회사 아이엠티 | 유리 단차부 이물의 건식 세정 방법 및 장치 |
CN203936519U (zh) * | 2014-05-30 | 2014-11-12 | 宁德新能源科技有限公司 | 锂离子电池极片涂层清洗装置 |
WO2015192220A1 (en) * | 2014-06-19 | 2015-12-23 | Magna International Inc. | Method and apparatus for laser assisted power washing |
WO2017109544A1 (fr) * | 2015-12-22 | 2017-06-29 | Arcelormittal | Procede de preparation d'une tole pre-revetue, avec enlevement du revetement a l'aide d'un faisceau laser incline; tôle correspondante |
CN105772447B (zh) * | 2016-05-17 | 2019-02-22 | 上海临仕激光科技有限公司 | 一种铝合金氧化膜焊前激光清洗的方法 |
CN106391591B (zh) * | 2016-11-29 | 2019-11-22 | 苏州热工研究院有限公司 | 激光工作头及激光清洗系统 |
CN107695040B (zh) * | 2017-10-20 | 2021-01-15 | 大族激光科技产业集团股份有限公司 | 激光清洗系统及方法 |
CN108554936A (zh) * | 2018-04-08 | 2018-09-21 | 苏州珮凯科技有限公司 | 半导体8寸晶元薄膜制程的e-max工艺的石英零部件的再生方法 |
US11467508B2 (en) | 2018-07-25 | 2022-10-11 | Applied Materials, Inc. | Pellicle adhesive residue removal system and methods |
CN109226096A (zh) * | 2018-08-15 | 2019-01-18 | 中车青岛四方机车车辆股份有限公司 | 一种Al-Mg-Zn合金工件表面激光清洗工艺 |
CN111463122B (zh) * | 2020-04-20 | 2021-04-20 | 天津大学 | 基于极紫外光的原子级材料可控去除方法 |
CN113690280B (zh) * | 2021-08-11 | 2023-11-28 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板的修复方法和阵列基板 |
CN114378052B (zh) * | 2021-12-13 | 2023-04-11 | 海目星激光智能装备(江苏)有限公司 | 一种极片清洗系统以及方法 |
CN115301636A (zh) * | 2022-08-12 | 2022-11-08 | 阳程科技股份有限公司 | 激光除胶方法及采用该方法的除胶设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5531857A (en) * | 1988-07-08 | 1996-07-02 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation from a high energy source |
US5099557A (en) * | 1988-07-08 | 1992-03-31 | Engelsberg Audrey C | Removal of surface contaminants by irradiation from a high-energy source |
US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
US5024968A (en) * | 1988-07-08 | 1991-06-18 | Engelsberg Audrey C | Removal of surface contaminants by irradiation from a high-energy source |
US4987286A (en) * | 1989-10-30 | 1991-01-22 | University Of Iowa Research Foundation | Method and apparatus for removing minute particles from a surface |
US5023424A (en) * | 1990-01-22 | 1991-06-11 | Tencor Instruments | Shock wave particle removal method and apparatus |
US5204517A (en) * | 1991-12-24 | 1993-04-20 | Maxwell Laboratories, Inc. | Method and system for control of a material removal process using spectral emission discrimination |
US5281798A (en) * | 1991-12-24 | 1994-01-25 | Maxwell Laboratories, Inc. | Method and system for selective removal of material coating from a substrate using a flashlamp |
US5319183A (en) * | 1992-02-18 | 1994-06-07 | Fujitsu Limited | Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
RU2114486C1 (ru) * | 1992-03-31 | 1998-06-27 | Колдрэн Лимитед Партнершип | Устройство для удаления поверхностных загрязнений с подложки (варианты) |
AU7682594A (en) * | 1993-09-08 | 1995-03-27 | Uvtech Systems, Inc. | Surface processing |
FR2711557B1 (fr) * | 1993-10-26 | 1996-01-05 | Saint Gobain Emballage | Procédé et dispositif pour le nettoyage d'éléments solides. |
IL115933A0 (en) * | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Process and apparatus for oblique beam revolution for the effective laser stripping of sidewalls |
-
1996
- 1996-07-26 US US08/686,523 patent/US5800625A/en not_active Expired - Fee Related
- 1996-08-26 MY MYPI96003521A patent/MY113873A/en unknown
- 1996-10-11 TW TW085112434A patent/TW388075B/zh not_active IP Right Cessation
-
1997
- 1997-07-22 EA EA199900160A patent/EA199900160A1/ru unknown
- 1997-07-22 JP JP10509094A patent/JP2000515811A/ja active Pending
- 1997-07-22 AT AT97937055T patent/ATE242065T1/de not_active IP Right Cessation
- 1997-07-22 AU AU39663/97A patent/AU3966397A/en not_active Abandoned
- 1997-07-22 HU HU9903927A patent/HUP9903927A3/hu unknown
- 1997-07-22 WO PCT/US1997/013317 patent/WO1998004366A1/en active IP Right Grant
- 1997-07-22 EP EP97937055A patent/EP0921871B1/en not_active Expired - Lifetime
- 1997-07-22 BR BR9710764A patent/BR9710764A/pt not_active Application Discontinuation
- 1997-07-22 DE DE69722633T patent/DE69722633T2/de not_active Expired - Fee Related
- 1997-07-22 KR KR10-1999-7000590A patent/KR100476814B1/ko not_active IP Right Cessation
- 1997-07-22 CZ CZ99198A patent/CZ19899A3/cs unknown
- 1997-07-22 CN CN97198187A patent/CN1231623A/zh active Pending
-
1999
- 1999-01-13 NO NO990150A patent/NO990150L/no unknown
- 1999-02-23 LV LV990031A patent/LV12345A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EA199900160A1 (ru) | 1999-08-26 |
BR9710764A (pt) | 1999-08-17 |
CZ19899A3 (cs) | 1999-09-15 |
NO990150L (no) | 1999-03-02 |
US5800625A (en) | 1998-09-01 |
HU9903927A (en) | 2000-04-28 |
TW388075B (en) | 2000-04-21 |
EP0921871A1 (en) | 1999-06-16 |
JP2000515811A (ja) | 2000-11-28 |
ATE242065T1 (de) | 2003-06-15 |
DE69722633T2 (de) | 2004-04-29 |
DE69722633D1 (de) | 2003-07-10 |
LV12345A (lv) | 1999-09-20 |
KR20000029533A (ko) | 2000-05-25 |
WO1998004366A1 (en) | 1998-02-05 |
HUP9903927A3 (en) | 2000-05-29 |
AU3966397A (en) | 1998-02-20 |
KR100476814B1 (ko) | 2005-03-18 |
EP0921871B1 (en) | 2003-06-04 |
MY113873A (en) | 2002-06-29 |
CN1231623A (zh) | 1999-10-13 |
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