NO975676D0 - Pregbare hereplastfilmer - Google Patents
Pregbare hereplastfilmerInfo
- Publication number
- NO975676D0 NO975676D0 NO975676A NO975676A NO975676D0 NO 975676 D0 NO975676 D0 NO 975676D0 NO 975676 A NO975676 A NO 975676A NO 975676 A NO975676 A NO 975676A NO 975676 D0 NO975676 D0 NO 975676D0
- Authority
- NO
- Norway
- Prior art keywords
- handsome
- plastic film
- plastic
- film
- handsome plastic
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/708—Isotropic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2333/00—Polymers of unsaturated acids or derivatives thereof
- B32B2333/04—Polymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
- Manufacturing Of Electric Cables (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/488,469 US5731086A (en) | 1995-06-07 | 1995-06-07 | Debossable films |
PCT/US1996/009838 WO1996040509A1 (en) | 1995-06-07 | 1996-06-07 | Debossable films |
Publications (2)
Publication Number | Publication Date |
---|---|
NO975676D0 true NO975676D0 (no) | 1997-12-05 |
NO975676L NO975676L (no) | 1998-02-06 |
Family
ID=23939789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO975676A NO975676L (no) | 1995-06-07 | 1997-12-05 | Pregbare hereplastfilmer |
Country Status (12)
Country | Link |
---|---|
US (1) | US5731086A (no) |
EP (1) | EP0842045A4 (no) |
JP (1) | JPH11507601A (no) |
KR (1) | KR19990022579A (no) |
CN (1) | CN1192717A (no) |
AU (1) | AU697590B2 (no) |
CA (1) | CA2223544A1 (no) |
EA (1) | EA000986B1 (no) |
IL (1) | IL122491A0 (no) |
NO (1) | NO975676L (no) |
NZ (1) | NZ310811A (no) |
WO (1) | WO1996040509A1 (no) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040137734A1 (en) * | 1995-11-15 | 2004-07-15 | Princeton University | Compositions and processes for nanoimprinting |
US20020140096A1 (en) * | 2001-03-30 | 2002-10-03 | Siemens Dematic Electronics Assembly Systems, Inc. | Method and structure for ex-situ polymer stud grid array contact formation |
US6591496B2 (en) * | 2001-08-28 | 2003-07-15 | 3M Innovative Properties Company | Method for making embedded electrical traces |
US7225536B2 (en) * | 2005-04-07 | 2007-06-05 | Ho-Ching Yang | Precasting multi-layer PCB process |
JP2012061599A (ja) * | 2009-01-21 | 2012-03-29 | Nissan Chem Ind Ltd | ベンゾシクロブテン樹脂のインプリント技術への適用及び当該技術によるパターン形成方法 |
TWI395043B (zh) | 2009-07-15 | 2013-05-01 | Au Optronics Corp | 電泳顯示薄膜、電泳顯示面板及其製造方法 |
CN102181236A (zh) * | 2010-01-14 | 2011-09-14 | E.I.内穆尔杜邦公司 | 环氧基的表护层及与其相关的方法和组合物 |
JP5449012B2 (ja) * | 2010-05-06 | 2014-03-19 | 古河電気工業株式会社 | 絶縁電線、電気機器及び絶縁電線の製造方法 |
CN102063951B (zh) * | 2010-11-05 | 2013-07-03 | 苏州苏大维格光电科技股份有限公司 | 一种透明导电膜及其制作方法 |
CN102222538B (zh) * | 2011-03-11 | 2012-12-05 | 苏州纳格光电科技有限公司 | 图形化的柔性透明导电薄膜及其制法 |
ES2626499T3 (es) | 2011-12-09 | 2017-07-25 | Cytec Technology Corp. | Película de acabado superficial para estructuras compuestas y método de elaboración de la misma |
KR102042822B1 (ko) * | 2012-09-24 | 2019-11-08 | 한국전자통신연구원 | 전자회로 및 그 제조방법 |
CN103123564B (zh) * | 2013-03-22 | 2015-12-09 | 汕头超声显示器技术有限公司 | 一种电容触摸屏及其制造方法 |
CN104869754B (zh) * | 2014-02-25 | 2018-06-26 | 财团法人工业技术研究院 | 嵌有导线的软性基板及其制造方法 |
CN104906766A (zh) * | 2014-03-12 | 2015-09-16 | 复盛应用科技股份有限公司 | 具立体花纹的高尔夫球杆头制作方法 |
CN104020890B (zh) * | 2014-05-30 | 2017-11-21 | 南昌欧菲光科技有限公司 | 触控基板与其制作方法以及采用该触控基板的触摸屏 |
CN106346766A (zh) * | 2016-11-17 | 2017-01-25 | 苏州澳冠智能装备股份有限公司 | 一种薄膜粘接装置 |
CN111556886B (zh) * | 2017-12-22 | 2022-03-22 | Ppg工业俄亥俄公司 | 在外观和流挂控制性能方面提供益处的可热固化的成膜组合物 |
CN109179455B (zh) * | 2018-09-29 | 2021-02-09 | 吉林大学 | 一种碳酸盐型盐湖卤水富集锂盐同时提取钾盐的方法 |
CN113119642B (zh) * | 2021-04-13 | 2022-07-01 | 北京黎马敦太平洋包装有限公司 | 一种压印工作站 |
JP2022191901A (ja) | 2021-06-16 | 2022-12-28 | キオクシア株式会社 | 半導体装置およびその製造方法 |
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US2772501A (en) * | 1956-05-31 | 1956-12-04 | Robert J Malcolm | Method of manufacturing electrical circuit components |
US2955351A (en) * | 1954-12-28 | 1960-10-11 | Plast O Fab Circuits Inc | Method of making a printed circuit |
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US4912844A (en) * | 1988-08-10 | 1990-04-03 | Dimensional Circuits Corporation | Methods of producing printed circuit boards |
US4944087A (en) * | 1988-10-05 | 1990-07-31 | Rogers Corporation | Method of making a curved plastic body with circuit pattern |
US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
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US5260130A (en) * | 1989-09-29 | 1993-11-09 | Shin-Etsu Chemical Co., Ltd. | Adhesive composition and coverlay film therewith |
US5108825A (en) * | 1989-12-21 | 1992-04-28 | General Electric Company | Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it |
US5030144A (en) * | 1990-04-13 | 1991-07-09 | North American Specialties Corporation | Solder-bearing lead |
JPH0421436A (ja) * | 1990-05-16 | 1992-01-24 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JPH0476985A (ja) * | 1990-07-18 | 1992-03-11 | Cmk Corp | プリント配線板の製造法 |
JP2747096B2 (ja) * | 1990-07-24 | 1998-05-06 | 北川工業株式会社 | 3次元回路基板の製造方法 |
US5351393A (en) * | 1991-05-28 | 1994-10-04 | Dimensonal Circuits Corporation | Method of mounting a surface-mountable IC to a converter board |
US5370921A (en) * | 1991-07-11 | 1994-12-06 | The Dexter Corporation | Lightning strike composite and process |
US5288542A (en) * | 1992-07-14 | 1994-02-22 | International Business Machines Corporation | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
US5346747A (en) * | 1992-12-24 | 1994-09-13 | Granmont, Inc. | Composite printed circuit board substrate and process for its manufacture |
US5390412A (en) * | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
-
1995
- 1995-06-07 US US08/488,469 patent/US5731086A/en not_active Expired - Fee Related
-
1996
- 1996-06-07 WO PCT/US1996/009838 patent/WO1996040509A1/en active Search and Examination
- 1996-06-07 NZ NZ310811A patent/NZ310811A/xx unknown
- 1996-06-07 AU AU61677/96A patent/AU697590B2/en not_active Ceased
- 1996-06-07 CA CA002223544A patent/CA2223544A1/en not_active Abandoned
- 1996-06-07 JP JP9502041A patent/JPH11507601A/ja active Pending
- 1996-06-07 KR KR1019970709060A patent/KR19990022579A/ko not_active Application Discontinuation
- 1996-06-07 EA EA199800045A patent/EA000986B1/ru not_active IP Right Cessation
- 1996-06-07 EP EP96919307A patent/EP0842045A4/en not_active Withdrawn
- 1996-06-07 CN CN96196154A patent/CN1192717A/zh active Pending
-
1997
- 1997-12-05 NO NO975676A patent/NO975676L/no not_active Application Discontinuation
- 1997-12-07 IL IL12249197A patent/IL122491A0/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EA000986B1 (ru) | 2000-08-28 |
CA2223544A1 (en) | 1996-12-19 |
IL122491A0 (en) | 1998-10-30 |
US5731086A (en) | 1998-03-24 |
AU697590B2 (en) | 1998-10-08 |
EP0842045A4 (en) | 1999-11-10 |
CN1192717A (zh) | 1998-09-09 |
EA199800045A1 (ru) | 1998-06-25 |
WO1996040509A1 (en) | 1996-12-19 |
MX9709925A (es) | 1998-08-30 |
JPH11507601A (ja) | 1999-07-06 |
EP0842045A1 (en) | 1998-05-20 |
AU6167796A (en) | 1996-12-30 |
NZ310811A (en) | 1999-01-28 |
KR19990022579A (ko) | 1999-03-25 |
NO975676L (no) | 1998-02-06 |
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FC2A | Withdrawal, rejection or dismissal of laid open patent application |