NO972280D0 - Lineær bueutladning ved plasma-prosessering - Google Patents

Lineær bueutladning ved plasma-prosessering

Info

Publication number
NO972280D0
NO972280D0 NO972280A NO972280A NO972280D0 NO 972280 D0 NO972280 D0 NO 972280D0 NO 972280 A NO972280 A NO 972280A NO 972280 A NO972280 A NO 972280A NO 972280 D0 NO972280 D0 NO 972280D0
Authority
NO
Norway
Prior art keywords
pct
electrode
arc discharge
electrode plate
date
Prior art date
Application number
NO972280A
Other languages
English (en)
Other versions
NO309920B1 (no
NO972280L (no
Inventor
Ladislav Bardos
Hana Barankova
Original Assignee
Surfcoat Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surfcoat Oy filed Critical Surfcoat Oy
Publication of NO972280D0 publication Critical patent/NO972280D0/no
Publication of NO972280L publication Critical patent/NO972280L/no
Publication of NO309920B1 publication Critical patent/NO309920B1/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Carbon And Carbon Compounds (AREA)
NO972280A 1994-11-18 1997-05-20 Lineær bueutladning ved plasmaprosessering NO309920B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9403988A SE9403988L (sv) 1994-11-18 1994-11-18 Apparat för alstring av linjär ljusbågsurladdning för plasmabearbetning
PCT/SE1995/001248 WO1996016531A1 (en) 1994-11-18 1995-10-20 An apparatus for generation of a linear arc discharge for plasma processing

Publications (3)

Publication Number Publication Date
NO972280D0 true NO972280D0 (no) 1997-05-20
NO972280L NO972280L (no) 1997-07-10
NO309920B1 NO309920B1 (no) 2001-04-17

Family

ID=20396028

Family Applications (1)

Application Number Title Priority Date Filing Date
NO972280A NO309920B1 (no) 1994-11-18 1997-05-20 Lineær bueutladning ved plasmaprosessering

Country Status (13)

Country Link
US (1) US5908602A (no)
EP (1) EP0792572B1 (no)
JP (1) JP3652702B2 (no)
KR (1) KR100333800B1 (no)
AT (1) ATE182738T1 (no)
AU (1) AU688996B2 (no)
CA (1) CA2205576C (no)
DE (1) DE69511103T2 (no)
DK (1) DK0792572T3 (no)
ES (1) ES2138755T3 (no)
NO (1) NO309920B1 (no)
SE (1) SE9403988L (no)
WO (1) WO1996016531A1 (no)

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DE19722624C2 (de) * 1997-05-30 2001-08-09 Je Plasmaconsult Gmbh Vorrichtung zur Erzeugung einer Vielzahl von Niedertemperatur-Plasmajets
SE511139C2 (sv) * 1997-11-20 1999-08-09 Hana Barankova Plasmabearbetningsapparat med vridbara magneter
SE516336C2 (sv) * 1999-04-28 2001-12-17 Hana Barankova Apparat för plasmabehandling av ytor
US7091605B2 (en) * 2001-09-21 2006-08-15 Eastman Kodak Company Highly moisture-sensitive electronic device element and method for fabrication
US6444945B1 (en) 2001-03-28 2002-09-03 Cp Films, Inc. Bipolar plasma source, plasma sheet source, and effusion cell utilizing a bipolar plasma source
US6764658B2 (en) * 2002-01-08 2004-07-20 Wisconsin Alumni Research Foundation Plasma generator
US20030168009A1 (en) * 2002-03-08 2003-09-11 Denes Ferencz S. Plasma processing within low-dimension cavities
CN1754409B (zh) * 2002-08-30 2010-07-28 积水化学工业株式会社 等离子处理装置
US7411352B2 (en) * 2002-09-19 2008-08-12 Applied Process Technologies, Inc. Dual plasma beam sources and method
EP1554412B1 (en) * 2002-09-19 2013-08-14 General Plasma, Inc. Plasma enhanced chemical vapor deposition apparatus
JP3933035B2 (ja) * 2002-11-06 2007-06-20 富士ゼロックス株式会社 カーボンナノチューブの製造装置および製造方法
US7038389B2 (en) * 2003-05-02 2006-05-02 Applied Process Technologies, Inc. Magnetron plasma source
US7867366B1 (en) 2004-04-28 2011-01-11 Alameda Applied Sciences Corp. Coaxial plasma arc vapor deposition apparatus and method
US8038858B1 (en) 2004-04-28 2011-10-18 Alameda Applied Sciences Corp Coaxial plasma arc vapor deposition apparatus and method
DE102004043967B4 (de) * 2004-09-11 2010-01-07 Roth & Rau Ag Anordnung und Verfahren zur Plasmabehandlung eines Substrates
FR2912864B1 (fr) * 2007-02-15 2009-07-31 H E F Soc Par Actions Simplifi Dispositif pour generer un plasma froid dans une enceinte sous vide et utilisation du dispositif pour des traitements thermochimiques
KR101468077B1 (ko) * 2007-07-19 2014-12-05 엘아이지에이디피 주식회사 상압 플라즈마 처리장치
CA2765337C (en) 2008-06-13 2016-05-17 Fablab Inc. A system and method for fabricating macroscopic objects, and nano-assembled objects obtained therewith
EA030379B1 (ru) * 2008-08-04 2018-07-31 Эй-Джи-Си Флет Гласс Норт Эмерике, Инк. Способ нанесения тонкопленочных покрытий с использованием плазменно-химического осаждения из газовой фазы (варианты)
WO2011156876A1 (en) * 2010-06-18 2011-12-22 Mahle Metal Leve S/A Plasma processing device
WO2011156877A1 (en) * 2010-06-18 2011-12-22 Mahle Metal Leve S/A Plasma processing device
US8697198B2 (en) * 2011-03-31 2014-04-15 Veeco Ald Inc. Magnetic field assisted deposition
US9508532B2 (en) 2013-03-13 2016-11-29 Bb Plasma Design Ab Magnetron plasma apparatus
EP3228160B1 (en) 2014-12-05 2021-07-21 AGC Glass Europe SA Hollow cathode plasma source
JP6508746B2 (ja) 2014-12-05 2019-05-08 エージーシー フラット グラス ノース アメリカ，インコーポレイテッドＡｇｃ Ｆｌａｔ Ｇｌａｓｓ Ｎｏｒｔｈ Ａｍｅｒｉｃａ，Ｉｎｃ． マクロ粒子低減コーティングを利用したプラズマ源ならびにマクロ粒子低減コーティングを用いたプラズマ源を薄膜コーティングおよび表面改質に使用する方法
US9721764B2 (en) 2015-11-16 2017-08-01 Agc Flat Glass North America, Inc. Method of producing plasma by multiple-phase alternating or pulsed electrical current
US9721765B2 (en) 2015-11-16 2017-08-01 Agc Flat Glass North America, Inc. Plasma device driven by multiple-phase alternating or pulsed electrical current
US10242846B2 (en) 2015-12-18 2019-03-26 Agc Flat Glass North America, Inc. Hollow cathode ion source
US10573499B2 (en) 2015-12-18 2020-02-25 Agc Flat Glass North America, Inc. Method of extracting and accelerating ions
RU168090U1 (ru) * 2016-06-06 2017-01-18 Акционерное общество "Научно-исследовательский институт оптико-электронного приборостроения" АО "НИИ ОЭП" Плазменный источник светового излучения
RU168022U1 (ru) * 2016-06-15 2017-01-17 Акционерное общество "Научно-исследовательский институт оптико-электронного приборостроения" АО "НИИ ОЭП" Плазменный источник светового излучения
KR102332691B1 (ko) * 2017-08-07 2021-12-01 가스가 덴끼 가부시끼가이샤 표면개질장치
KR102216854B1 (ko) * 2019-09-30 2021-02-17 포항공과대학교 산학협력단 마이크로파 플라즈마를 이용한 아크 방전장치 및 아크 방전방법
FR3115180B1 (fr) * 2020-10-14 2022-11-04 Peter Choi Appareil de génération de plasma

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US3562141A (en) * 1968-02-23 1971-02-09 John R Morley Vacuum vapor deposition utilizing low voltage electron beam
US4521286A (en) * 1983-03-09 1985-06-04 Unisearch Limited Hollow cathode sputter etcher
FR2581244B1 (fr) * 1985-04-29 1987-07-10 Centre Nat Rech Scient Source d'ions du type triode a une seule chambre d'ionisation a excitation haute frequence et a confinement magnetique du type multipolaire
CS246982B1 (en) * 1985-06-17 1986-11-13 Ladislav Bardos Method and apparatus for producing chemically active environment for plasma chemical reactions namely for deposition of thin layers
DE3606959A1 (de) * 1986-03-04 1987-09-10 Leybold Heraeus Gmbh & Co Kg Vorrichtung zur plasmabehandlung von substraten in einer durch hochfrequenz angeregten plasmaentladung
DE3774098D1 (de) * 1986-12-29 1991-11-28 Sumitomo Metal Ind Plasmageraet.
NL8701530A (nl) * 1987-06-30 1989-01-16 Stichting Fund Ond Material Werkwijze voor het behandelen van oppervlakken van substraten met behulp van een plasma en reactor voor het uitvoeren van die werkwijze.
DE69032691T2 (de) * 1989-12-07 1999-06-10 Japan Science & Tech Corp Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck
US5133986A (en) * 1990-10-05 1992-07-28 International Business Machines Corporation Plasma enhanced chemical vapor processing system using hollow cathode effect
US5279723A (en) * 1992-07-30 1994-01-18 As Represented By The United States Department Of Energy Filtered cathodic arc source
DE4235953C2 (de) * 1992-10-23 1998-07-02 Fraunhofer Ges Forschung Sputterquelle mit einer linearen Hohlkathode zum reaktiven Beschichten von Substraten
SE501888C2 (sv) * 1993-10-18 1995-06-12 Ladislav Bardos En metod och en apparat för generering av en urladdning i egna ångor från en radiofrekvenselektrod för kontinuerlig självförstoftning av elektroden

Also Published As

Publication number Publication date
EP0792572B1 (en) 1999-07-28
ATE182738T1 (de) 1999-08-15
CA2205576A1 (en) 1996-05-30
AU3942095A (en) 1996-06-17
NO309920B1 (no) 2001-04-17
ES2138755T3 (es) 2000-01-16
JP3652702B2 (ja) 2005-05-25
KR100333800B1 (ko) 2002-11-27
DK0792572T3 (da) 2000-03-13
DE69511103T2 (de) 2000-04-13
US5908602A (en) 1999-06-01
NO972280L (no) 1997-07-10
SE503141C2 (sv) 1996-04-01
JPH10509833A (ja) 1998-09-22
SE9403988L (sv) 1996-04-01
AU688996B2 (en) 1998-03-19
CA2205576C (en) 2005-09-20
DE69511103D1 (de) 1999-09-02
WO1996016531A1 (en) 1996-05-30
EP0792572A1 (en) 1997-09-03
SE9403988D0 (sv) 1994-11-18

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