NO963827D0 - Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse derav - Google Patents

Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse derav

Info

Publication number
NO963827D0
NO963827D0 NO963827A NO963827A NO963827D0 NO 963827 D0 NO963827 D0 NO 963827D0 NO 963827 A NO963827 A NO 963827A NO 963827 A NO963827 A NO 963827A NO 963827 D0 NO963827 D0 NO 963827D0
Authority
NO
Norway
Prior art keywords
optical
electro
providing
connection
optical connection
Prior art date
Application number
NO963827A
Other languages
English (en)
Other versions
NO963827L (no
Inventor
Hartwig Richter
Manfred Becker
Original Assignee
Deutsche Telekom Ag
Ferdinand Braun Inst Fur Hochs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telekom Ag, Ferdinand Braun Inst Fur Hochs filed Critical Deutsche Telekom Ag
Publication of NO963827D0 publication Critical patent/NO963827D0/no
Publication of NO963827L publication Critical patent/NO963827L/no

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2551—Splicing of light guides, e.g. by fusion or bonding using thermal methods, e.g. fusion welding by arc discharge, laser beam, plasma torch
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
NO963827A 1995-12-13 1996-09-13 Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse NO963827L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19546443A DE19546443A1 (de) 1995-12-13 1995-12-13 Optische und/oder elektrooptische Verbindung und Verfahren zur Herstellung einer solchen

Publications (2)

Publication Number Publication Date
NO963827D0 true NO963827D0 (no) 1996-09-13
NO963827L NO963827L (no) 1997-06-16

Family

ID=7779943

Family Applications (1)

Application Number Title Priority Date Filing Date
NO963827A NO963827L (no) 1995-12-13 1996-09-13 Optisk og/eller elektrooptisk forbindelse og fremgangsmåte for tilveiebringelse

Country Status (5)

Country Link
US (2) US6181855B1 (no)
EP (1) EP0779526A3 (no)
CA (1) CA2192781A1 (no)
DE (1) DE19546443A1 (no)
NO (1) NO963827L (no)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19746204A1 (de) * 1997-10-18 1999-04-29 Deutsche Telekom Ag Halbleiterlaserchip
US6471419B1 (en) * 1999-06-07 2002-10-29 International Business Machines Corporation Fiber optic assembly
US6628865B2 (en) 2000-12-15 2003-09-30 Intel Corporation Alignment of optical fibers to an etched array waveguide
US6886989B2 (en) * 2000-12-15 2005-05-03 Intel Corporation Alignment of fiber optic bundle to array waveguide using pins
US6707970B2 (en) 2000-12-15 2004-03-16 Intel Corporation Alignment of fiber optic bundle to array waveguide using an epoxy
DE10243757A1 (de) * 2002-01-31 2004-04-01 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterchips
TWI226139B (en) 2002-01-31 2005-01-01 Osram Opto Semiconductors Gmbh Method to manufacture a semiconductor-component
CN100530705C (zh) 2003-01-31 2009-08-19 奥斯兰姆奥普托半导体有限责任公司 用于制造一个半导体元器件的方法
KR101058302B1 (ko) * 2003-01-31 2011-08-22 오스람 옵토 세미컨덕터스 게엠베하 박막 반도체 소자 및 상기 소자의 제조 방법
DE10314494B3 (de) * 2003-03-27 2004-11-18 Infineon Technologies Ag Elektrooptisches Modul
US20050031186A1 (en) * 2003-08-10 2005-02-10 Luu Victor Van Systems and methods for characterizing a three-dimensional sample
US7231153B2 (en) * 2005-01-13 2007-06-12 Xerox Corporation Systems and methods for monitoring replaceable units
CA2637326C (en) 2006-01-24 2011-10-18 Welldynamics, Inc. Positional control of downhole actuators
US20080166122A1 (en) * 2007-01-08 2008-07-10 Inventec Multimedia & Telecom Corporation Optical network backup channel switching control device
DE202007017386U1 (de) * 2007-12-13 2008-02-28 CCS Technology, Inc., Wilmington Kopplungseinrichtung zum Koppeln von Lichtwellenleitern
JP5224845B2 (ja) * 2008-02-18 2013-07-03 新光電気工業株式会社 半導体装置の製造方法及び半導体装置
US20110164848A1 (en) * 2010-01-07 2011-07-07 Alcatel-Lucent Usa Inc. Ball Lens Holder For A Planar Lightwave Circuit Device
JP7211235B2 (ja) * 2019-04-15 2023-01-24 日本電信電話株式会社 光接続構造

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065203A (en) * 1975-12-10 1977-12-27 International Telephone And Telegraph Corporation Couplers for electro-optical elements
US4341942A (en) * 1978-10-31 1982-07-27 International Business Machines Corporation Method of bonding wires to passivated chip microcircuit conductors
GB8417911D0 (en) * 1984-07-13 1984-08-15 British Telecomm Connecting waveguides
DE3433717A1 (de) * 1984-09-14 1986-03-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum koppeln optischer bauelemente und anordnung zur durchfuehrung des verfahrens
SE453334B (sv) * 1985-09-13 1988-01-25 Ericsson Telefon Ab L M Anordning for centrering av optiska fibrer vid svetsning
US4752109A (en) * 1986-09-02 1988-06-21 Amp Incorporated Optoelectronics package for a semiconductor laser
DE3809396A1 (de) * 1988-03-21 1989-10-05 Siemens Ag Optischer sende- und empfangsmodul
DE58905432D1 (de) * 1988-07-01 1993-10-07 Siemens Ag Vorrichtung zum Justieren und Fixieren einer Kugellinse sowie Verfahren zum Betrieb der Vorrichtung.
US4867524A (en) * 1988-09-08 1989-09-19 United Technologies Corporation Metallic bond for mounting of optical fibers to integrated optical chips
US5016971A (en) * 1989-10-20 1991-05-21 Hughes Aircraft Company Automated laser fusion system for high strength optical fiber splicing
DE4004544C2 (de) * 1990-02-14 1998-07-30 Siemens Ag Laser-Schweißeinrichtung
US5073002A (en) * 1990-11-30 1991-12-17 Hockaday Bruce D Self aligning pigtail
GB9100680D0 (en) * 1991-01-11 1991-02-27 Gen Electric Co Plc Optical fibre interface
DE4140283A1 (de) * 1991-12-06 1993-06-17 Bundesrep Deutschland Verfahren zur fixierung eines lichtwellenleiters
GB2268813B (en) * 1992-07-13 1995-04-19 Integrated Optical Components Packaged optical devices
JP2565279B2 (ja) * 1992-09-25 1996-12-18 日本電気株式会社 光結合構造
DE4320194A1 (de) * 1993-06-18 1994-12-22 Sel Alcatel Ag Vorrichtung zur justagefreien Ankopplung einer Mehrzahl von Lichtwellenleitern an ein Laserarray
US5367140A (en) * 1993-12-27 1994-11-22 At&T Bell Laboratories Method for laser welding of optical packages
US5432877A (en) * 1994-06-03 1995-07-11 Photonic Integration Research, Inc. Integrated optical circuit having a waveguide end of lens geometry, and method for making same

Also Published As

Publication number Publication date
EP0779526A3 (de) 1997-10-29
DE19546443A1 (de) 1997-06-19
EP0779526A2 (de) 1997-06-18
US6282346B1 (en) 2001-08-28
NO963827L (no) 1997-06-16
CA2192781A1 (en) 1997-06-14
US6181855B1 (en) 2001-01-30

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