NO930197D0 - Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver - Google Patents
Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiverInfo
- Publication number
- NO930197D0 NO930197D0 NO930197A NO930197A NO930197D0 NO 930197 D0 NO930197 D0 NO 930197D0 NO 930197 A NO930197 A NO 930197A NO 930197 A NO930197 A NO 930197A NO 930197 D0 NO930197 D0 NO 930197D0
- Authority
- NO
- Norway
- Prior art keywords
- provision
- connecting semiconductor
- semiconductor discs
- discs
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
- Jigs For Machine Tools (AREA)
- Clamps And Clips (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/825,520 US5180150A (en) | 1992-01-24 | 1992-01-24 | Apparatus for providing consistent registration of semiconductor wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
NO930197D0 true NO930197D0 (no) | 1993-01-21 |
NO930197L NO930197L (no) | 1993-07-26 |
Family
ID=25244210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO93930197A NO930197L (no) | 1992-01-24 | 1993-01-21 | Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver |
Country Status (6)
Country | Link |
---|---|
US (1) | US5180150A (no) |
EP (1) | EP0552966B1 (no) |
JP (1) | JPH0746695B2 (no) |
DE (1) | DE69300284T2 (no) |
IL (1) | IL104267A (no) |
NO (1) | NO930197L (no) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5700297A (en) * | 1992-08-28 | 1997-12-23 | Ipec Precision, Inc. | Apparatus for providing consistent, non-jamming registration of notched semiconductor wafers |
US5352249A (en) * | 1992-08-28 | 1994-10-04 | Hughes Aircraft Company | Apparatus for providing consistent, non-jamming registration of semiconductor wafers |
US5280894A (en) * | 1992-09-30 | 1994-01-25 | Honeywell Inc. | Fixture for backside wafer etching |
IL109193A0 (en) * | 1993-04-12 | 1994-06-24 | Hughes Aircraft Co | Apparatus and method for providing consistent, nonjamming registration of notched semiconductor wafers |
US5701013A (en) * | 1996-06-07 | 1997-12-23 | Mosel Viltelic, Inc. | Wafer metrology pattern integrating both overlay and critical dimension features for SEM or AFM measurements |
US7166816B1 (en) | 1997-06-26 | 2007-01-23 | Mks Instruments, Inc. | Inductively-coupled torodial plasma source |
US6815633B1 (en) | 1997-06-26 | 2004-11-09 | Applied Science & Technology, Inc. | Inductively-coupled toroidal plasma source |
US8779322B2 (en) | 1997-06-26 | 2014-07-15 | Mks Instruments Inc. | Method and apparatus for processing metal bearing gases |
US6150628A (en) | 1997-06-26 | 2000-11-21 | Applied Science And Technology, Inc. | Toroidal low-field reactive gas source |
US6388226B1 (en) | 1997-06-26 | 2002-05-14 | Applied Science And Technology, Inc. | Toroidal low-field reactive gas source |
US7569790B2 (en) * | 1997-06-26 | 2009-08-04 | Mks Instruments, Inc. | Method and apparatus for processing metal bearing gases |
DE19856102C2 (de) * | 1998-12-04 | 2003-11-20 | Tyco Electronics Logistics Ag | Transportsystem für Kleinbauteile |
US6367635B1 (en) * | 1999-09-30 | 2002-04-09 | Auer Precision Company, Inc. | Ultra precision process carrier for semi-conductor manufacturing |
KR200435062Y1 (ko) * | 2006-08-22 | 2007-01-09 | (주)테크윙 | 테스트핸들러용 하이픽스보드 클램핑장치 |
US8749053B2 (en) | 2009-06-23 | 2014-06-10 | Intevac, Inc. | Plasma grid implant system for use in solar cell fabrications |
US8271120B2 (en) * | 2009-08-03 | 2012-09-18 | Lawrence Livermore National Security, Llc | Method and system for processing optical elements using magnetorheological finishing |
SG10201508582WA (en) | 2011-11-08 | 2015-11-27 | Intevac Inc | Substrate processing system and method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55148433A (en) * | 1979-05-08 | 1980-11-19 | Nec Corp | Manufacture of semiconductor device and device therefor |
GB2146935B (en) * | 1983-08-18 | 1986-10-22 | Plessey Co Plc | Jigs for locating electrical components |
US4703920A (en) * | 1986-08-25 | 1987-11-03 | Amp Incorporated | Manufacturing method for integrated circuit chip carriers and work holder for use in the method |
JP2508540B2 (ja) * | 1987-11-02 | 1996-06-19 | 三菱マテリアル株式会社 | ウェ―ハの位置検出装置 |
JPS63296237A (ja) * | 1988-04-22 | 1988-12-02 | Hitachi Ltd | ウエーハの自動アライメント方法 |
FR2633452B1 (fr) * | 1988-06-28 | 1990-11-02 | Doue Julien | Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur |
US4970772A (en) * | 1989-12-05 | 1990-11-20 | Sulzer Brothers Limited | Wafer alignment fixture |
-
1992
- 1992-01-24 US US07/825,520 patent/US5180150A/en not_active Expired - Fee Related
- 1992-12-29 IL IL10426792A patent/IL104267A/en not_active IP Right Cessation
-
1993
- 1993-01-21 NO NO93930197A patent/NO930197L/no unknown
- 1993-01-22 DE DE69300284T patent/DE69300284T2/de not_active Expired - Fee Related
- 1993-01-22 EP EP93300454A patent/EP0552966B1/en not_active Expired - Lifetime
- 1993-01-25 JP JP1028093A patent/JPH0746695B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5180150A (en) | 1993-01-19 |
NO930197L (no) | 1993-07-26 |
JPH0613451A (ja) | 1994-01-21 |
EP0552966A1 (en) | 1993-07-28 |
IL104267A0 (en) | 1993-05-13 |
DE69300284D1 (de) | 1995-08-31 |
EP0552966B1 (en) | 1995-07-26 |
DE69300284T2 (de) | 1995-12-21 |
IL104267A (en) | 1994-07-31 |
JPH0746695B2 (ja) | 1995-05-17 |
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