NO921571L - PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYER - Google Patents
PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYERInfo
- Publication number
- NO921571L NO921571L NO92921571A NO921571A NO921571L NO 921571 L NO921571 L NO 921571L NO 92921571 A NO92921571 A NO 92921571A NO 921571 A NO921571 A NO 921571A NO 921571 L NO921571 L NO 921571L
- Authority
- NO
- Norway
- Prior art keywords
- layer
- metal
- coating agent
- selective
- procedure
- Prior art date
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Den foreliggende oppfinnelse tilveiebringer en fremgangsmåte for fremstilling av elektroniske kretskort (10)med høy densitet omfattende de trinn at et lag av et første metall. (26) avsettes på et lag av folie (20) for fremstilling av en kompositt (29), hvorpå kompositten (29) festes til et isolerende underlag (12) for fremstilling av et laminat (31). Laget av folie (20) blir deretter fjernet fra laget av det første metall (26). Dekkmiddel blir deretter påført på laget av det første metall (26), eksponert og fremkalt. Under fremkallingen av dekkmidlet blir deler av dekkmidlet (44) fjernet fra laget av det første metall (26). Et lag av et tredje metall (54) blir deretter plettert på de deler av laget av det første metall (26) som ikke er dekket . av dekkmidlet (44). Alt gjenværende. dekkmiddel (44) og de deler av laget av det første metall (26) som ikke er dekket av det tredje metall (54) blir deretter fjernet slik at det produseres et ferdig finlinjet mønster (60) som har. ledende (14) og isolerende områder (61). Det ferdige finlinjede mønster (60) kan deretter anvendes for å frem-stille et kretskort.The present invention provides a method of manufacturing high density electronic circuit boards (10) comprising the steps of forming a layer of a first metal. (26) is deposited on a layer of foil (20) to make a composite (29), whereupon the composite (29) is attached to an insulating substrate (12) to make a laminate (31). The layer of foil (20) is then removed from the layer of the first metal (26). Coating agent is then applied to the layer of the first metal (26), exposed and developed. During the development of the coating agent, parts of the coating agent (44) are removed from the layer of the first metal (26). A layer of a third metal (54) is then plated on those parts of the layer of the first metal (26) which are not covered. of the coating agent (44). All remaining. covering means (44) and those parts of the layer of the first metal (26) which are not covered by the third metal (54) are then removed so as to produce a finished fine line pattern (60) which has conductive (14) and insulating areas (61). The finished fine line pattern (60) can then be used to make a circuit board.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/572,849 US5017271A (en) | 1990-08-24 | 1990-08-24 | Method for printed circuit board pattern making using selectively etchable metal layers |
PCT/US1991/002026 WO1992003599A1 (en) | 1990-08-24 | 1991-03-26 | Method for printed circuit board pattern making using selectively etchable metal layers |
Publications (2)
Publication Number | Publication Date |
---|---|
NO921571D0 NO921571D0 (en) | 1992-04-23 |
NO921571L true NO921571L (en) | 1992-06-09 |
Family
ID=26783023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO92921571A NO921571L (en) | 1990-08-24 | 1992-04-23 | PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYER |
Country Status (1)
Country | Link |
---|---|
NO (1) | NO921571L (en) |
-
1992
- 1992-04-23 NO NO92921571A patent/NO921571L/en unknown
Also Published As
Publication number | Publication date |
---|---|
NO921571D0 (en) | 1992-04-23 |
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