NO921571L - PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYER - Google Patents

PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYER

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Publication number
NO921571L
NO921571L NO92921571A NO921571A NO921571L NO 921571 L NO921571 L NO 921571L NO 92921571 A NO92921571 A NO 92921571A NO 921571 A NO921571 A NO 921571A NO 921571 L NO921571 L NO 921571L
Authority
NO
Norway
Prior art keywords
layer
metal
coating agent
selective
procedure
Prior art date
Application number
NO92921571A
Other languages
Norwegian (no)
Other versions
NO921571D0 (en
Inventor
Christopher J Whewell
Sidney J Clouser
Chin-Ho Lee
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/572,849 external-priority patent/US5017271A/en
Application filed by Gould Inc filed Critical Gould Inc
Publication of NO921571D0 publication Critical patent/NO921571D0/en
Publication of NO921571L publication Critical patent/NO921571L/en

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

Den foreliggende oppfinnelse tilveiebringer en fremgangsmåte for fremstilling av elektroniske kretskort (10)med høy densitet omfattende de trinn at et lag av et første metall. (26) avsettes på et lag av folie (20) for fremstilling av en kompositt (29), hvorpå kompositten (29) festes til et isolerende underlag (12) for fremstilling av et laminat (31). Laget av folie (20) blir deretter fjernet fra laget av det første metall (26). Dekkmiddel blir deretter påført på laget av det første metall (26), eksponert og fremkalt. Under fremkallingen av dekkmidlet blir deler av dekkmidlet (44) fjernet fra laget av det første metall (26). Et lag av et tredje metall (54) blir deretter plettert på de deler av laget av det første metall (26) som ikke er dekket . av dekkmidlet (44). Alt gjenværende. dekkmiddel (44) og de deler av laget av det første metall (26) som ikke er dekket av det tredje metall (54) blir deretter fjernet slik at det produseres et ferdig finlinjet mønster (60) som har. ledende (14) og isolerende områder (61). Det ferdige finlinjede mønster (60) kan deretter anvendes for å frem-stille et kretskort.The present invention provides a method of manufacturing high density electronic circuit boards (10) comprising the steps of forming a layer of a first metal. (26) is deposited on a layer of foil (20) to make a composite (29), whereupon the composite (29) is attached to an insulating substrate (12) to make a laminate (31). The layer of foil (20) is then removed from the layer of the first metal (26). Coating agent is then applied to the layer of the first metal (26), exposed and developed. During the development of the coating agent, parts of the coating agent (44) are removed from the layer of the first metal (26). A layer of a third metal (54) is then plated on those parts of the layer of the first metal (26) which are not covered. of the coating agent (44). All remaining. covering means (44) and those parts of the layer of the first metal (26) which are not covered by the third metal (54) are then removed so as to produce a finished fine line pattern (60) which has conductive (14) and insulating areas (61). The finished fine line pattern (60) can then be used to make a circuit board.

NO92921571A 1990-08-24 1992-04-23 PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYER NO921571L (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/572,849 US5017271A (en) 1990-08-24 1990-08-24 Method for printed circuit board pattern making using selectively etchable metal layers
PCT/US1991/002026 WO1992003599A1 (en) 1990-08-24 1991-03-26 Method for printed circuit board pattern making using selectively etchable metal layers

Publications (2)

Publication Number Publication Date
NO921571D0 NO921571D0 (en) 1992-04-23
NO921571L true NO921571L (en) 1992-06-09

Family

ID=26783023

Family Applications (1)

Application Number Title Priority Date Filing Date
NO92921571A NO921571L (en) 1990-08-24 1992-04-23 PROCEDURE FOR AA MADE CIRCUIT PATTERN USING SELECTIVE EASY METAL LAYER

Country Status (1)

Country Link
NO (1) NO921571L (en)

Also Published As

Publication number Publication date
NO921571D0 (en) 1992-04-23

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