NO325995B1 - Fremgangsmate for fremstilling av en solcelle - Google Patents
Fremgangsmate for fremstilling av en solcelle Download PDFInfo
- Publication number
- NO325995B1 NO325995B1 NO20025034A NO20025034A NO325995B1 NO 325995 B1 NO325995 B1 NO 325995B1 NO 20025034 A NO20025034 A NO 20025034A NO 20025034 A NO20025034 A NO 20025034A NO 325995 B1 NO325995 B1 NO 325995B1
- Authority
- NO
- Norway
- Prior art keywords
- layer
- silicon
- sinxoy
- hydrogen
- substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 75
- 230000008569 process Effects 0.000 title claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 60
- 239000010703 silicon Substances 0.000 claims abstract description 60
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 50
- 239000001257 hydrogen Substances 0.000 claims abstract description 50
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 229910004286 SiNxOy Inorganic materials 0.000 claims abstract description 35
- 239000000126 substance Substances 0.000 claims abstract description 31
- 238000002161 passivation Methods 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 18
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 16
- 239000010937 tungsten Substances 0.000 claims abstract description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000013078 crystal Substances 0.000 claims abstract description 13
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 5
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 5
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 239000011733 molybdenum Substances 0.000 claims abstract description 4
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims abstract description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 17
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical class N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 13
- 229910021529 ammonia Inorganic materials 0.000 claims description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 11
- 229910000077 silane Inorganic materials 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 9
- 238000005231 Edge Defined Film Fed Growth Methods 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000003870 refractory metal Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 7
- 125000004429 atom Chemical group 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000002019 doping agent Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- -1 pressure Substances 0.000 claims description 6
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 238000001556 precipitation Methods 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 2
- 150000002830 nitrogen compounds Chemical class 0.000 claims description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 93
- 239000002344 surface layer Substances 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 17
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 229910021419 crystalline silicon Inorganic materials 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000002800 charge carrier Substances 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004050 hot filament vapor deposition Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 239000012876 carrier material Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000003667 anti-reflective effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012803 optimization experiment Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Hybrid Cells (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10152707A DE10152707B4 (de) | 2001-10-19 | 2001-10-19 | Verfahren zur Herstellung einer Solarzelle |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20025034D0 NO20025034D0 (no) | 2002-10-18 |
| NO20025034L NO20025034L (no) | 2003-04-22 |
| NO325995B1 true NO325995B1 (no) | 2008-09-01 |
Family
ID=7703699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20025034A NO325995B1 (no) | 2001-10-19 | 2002-10-18 | Fremgangsmate for fremstilling av en solcelle |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6746709B2 (ja) |
| EP (1) | EP1304748B1 (ja) |
| JP (1) | JP4020748B2 (ja) |
| AT (1) | ATE465517T1 (ja) |
| DE (2) | DE10152707B4 (ja) |
| ES (1) | ES2344936T3 (ja) |
| NO (1) | NO325995B1 (ja) |
| PT (1) | PT1304748E (ja) |
| TW (1) | TW561629B (ja) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7465351B2 (en) * | 2004-06-18 | 2008-12-16 | Memc Electronic Materials, Inc. | Melter assembly and method for charging a crystal forming apparatus with molten source material |
| US7344594B2 (en) * | 2004-06-18 | 2008-03-18 | Memc Electronic Materials, Inc. | Melter assembly and method for charging a crystal forming apparatus with molten source material |
| US7691199B2 (en) * | 2004-06-18 | 2010-04-06 | Memc Electronic Materials, Inc. | Melter assembly and method for charging a crystal forming apparatus with molten source material |
| US7629236B2 (en) * | 2004-08-26 | 2009-12-08 | Alliance For Sustainable Energy, Llc | Method for passivating crystal silicon surfaces |
| US8916768B2 (en) * | 2005-04-14 | 2014-12-23 | Rec Solar Pte. Ltd. | Surface passivation of silicon based wafers |
| KR100900443B1 (ko) * | 2006-11-20 | 2009-06-01 | 엘지전자 주식회사 | 태양전지 및 그의 제조방법 |
| KR100974220B1 (ko) * | 2006-12-13 | 2010-08-06 | 엘지전자 주식회사 | 태양전지 |
| KR100833675B1 (ko) * | 2007-01-30 | 2008-05-29 | (주)실리콘화일 | 반투명 결정질 실리콘 박막 태양전지 |
| WO2009061322A1 (en) * | 2007-11-09 | 2009-05-14 | Midwest Research Institute | Low-temperature junction growth using hot-wire chemical vapor deposition |
| EP2088630A1 (en) * | 2008-02-08 | 2009-08-12 | Applied Materials, Inc. | Photovoltaic device comprising a sputter deposited passivation layer as well as method and apparatus for producing such a device |
| DE102009008371A1 (de) * | 2009-02-11 | 2010-08-12 | Schott Solar Ag | Integraler Prozeß von Waferherstellung bis Modulfertigung zur Herstellung von Wafern, Solarzellen und Solarmodulen |
| KR101714097B1 (ko) * | 2009-04-21 | 2017-03-08 | 테트라썬, 아이엔씨. | 고효율 태양전지 구조 및 제조방법 |
| GB2471128A (en) * | 2009-06-18 | 2010-12-22 | Rec Solar As | Surface passivation of silicon wafers |
| US9126290B2 (en) * | 2009-06-24 | 2015-09-08 | David Buttress | Method for joining solar receiver tubes |
| US8841573B2 (en) * | 2009-08-30 | 2014-09-23 | David Buttress | Apparatus for field welding solar receiver tubes |
| DE102009044052A1 (de) * | 2009-09-18 | 2011-03-24 | Schott Solar Ag | Kristalline Solarzelle, Verfahren zur Herstellung einer solchen sowie Verfahren zur Herstellung eines Solarzellenmoduls |
| US20110192316A1 (en) | 2010-02-05 | 2011-08-11 | E-Chem Enterprise Corp. | Electroless plating solution for providing solar cell electrode |
| CN103165744B (zh) * | 2011-12-19 | 2016-02-17 | 中建材浚鑫科技股份有限公司 | 一种晶体硅太阳能电池片的制造方法 |
| US9978902B2 (en) | 2013-11-19 | 2018-05-22 | Institutt For Energiteknikk | Passivation stack on a crystalline silicon solar cell |
| NO341687B1 (no) | 2013-11-19 | 2017-12-18 | Inst Energiteknik | Passiveringssabel på en solcelle av krystallinsk silisium |
| GB2521457A (en) * | 2013-12-20 | 2015-06-24 | Isis Innovation | Charge stabilized dielectric film for electronic devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4253881A (en) * | 1978-10-23 | 1981-03-03 | Rudolf Hezel | Solar cells composed of semiconductive materials |
| DE3725338A1 (de) * | 1987-07-30 | 1989-02-09 | Nukem Gmbh | Verkapselung von einem photovoltaischem element |
| JP3141805B2 (ja) * | 1997-01-20 | 2001-03-07 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP3132489B2 (ja) * | 1998-11-05 | 2001-02-05 | 日本電気株式会社 | 化学的気相成長装置及び薄膜成膜方法 |
| JP2002075992A (ja) * | 2000-09-01 | 2002-03-15 | Fujitsu Ltd | シリコン窒化膜の成膜方法および半導体装置の製造方法および半導体装置 |
| US6407013B1 (en) * | 2001-01-16 | 2002-06-18 | Taiwan Semiconductor Manufacturing Co., Ltd | Soft plasma oxidizing plasma method for forming carbon doped silicon containing dielectric layer with enhanced adhesive properties |
-
2001
- 2001-10-19 DE DE10152707A patent/DE10152707B4/de not_active Expired - Fee Related
-
2002
- 2002-10-15 DE DE50214383T patent/DE50214383D1/de not_active Expired - Lifetime
- 2002-10-15 PT PT02022993T patent/PT1304748E/pt unknown
- 2002-10-15 AT AT02022993T patent/ATE465517T1/de not_active IP Right Cessation
- 2002-10-15 EP EP02022993A patent/EP1304748B1/de not_active Expired - Lifetime
- 2002-10-15 ES ES02022993T patent/ES2344936T3/es not_active Expired - Lifetime
- 2002-10-17 TW TW091123924A patent/TW561629B/zh not_active IP Right Cessation
- 2002-10-18 US US10/273,182 patent/US6746709B2/en not_active Expired - Fee Related
- 2002-10-18 NO NO20025034A patent/NO325995B1/no not_active IP Right Cessation
- 2002-10-18 JP JP2002304363A patent/JP4020748B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4020748B2 (ja) | 2007-12-12 |
| ATE465517T1 (de) | 2010-05-15 |
| EP1304748B1 (de) | 2010-04-21 |
| US20040081747A1 (en) | 2004-04-29 |
| DE10152707A1 (de) | 2003-05-08 |
| US6746709B2 (en) | 2004-06-08 |
| PT1304748E (pt) | 2010-07-21 |
| EP1304748A2 (de) | 2003-04-23 |
| TW561629B (en) | 2003-11-11 |
| DE10152707B4 (de) | 2004-08-26 |
| EP1304748A3 (de) | 2007-05-09 |
| JP2003158283A (ja) | 2003-05-30 |
| ES2344936T3 (es) | 2010-09-10 |
| NO20025034L (no) | 2003-04-22 |
| DE50214383D1 (de) | 2010-06-02 |
| NO20025034D0 (no) | 2002-10-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CHAD | Change of the owner's name or address (par. 44 patent law, par. patentforskriften) |
Owner name: SCHOTT SOLAR GMBH, DE |
|
| MM1K | Lapsed by not paying the annual fees |