NO20084398L - Eksplosjonsbeskyttet kapsling Ex-d med varmebro - Google Patents

Eksplosjonsbeskyttet kapsling Ex-d med varmebro

Info

Publication number
NO20084398L
NO20084398L NO20084398A NO20084398A NO20084398L NO 20084398 L NO20084398 L NO 20084398L NO 20084398 A NO20084398 A NO 20084398A NO 20084398 A NO20084398 A NO 20084398A NO 20084398 L NO20084398 L NO 20084398L
Authority
NO
Norway
Prior art keywords
explosion
heat bridge
proof enclosure
box
bridges
Prior art date
Application number
NO20084398A
Other languages
English (en)
Other versions
NO341105B1 (no
Inventor
Juergen Poidl
Original Assignee
Stahl R Schaltgeraete Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stahl R Schaltgeraete Gmbh filed Critical Stahl R Schaltgeraete Gmbh
Publication of NO20084398L publication Critical patent/NO20084398L/no
Publication of NO341105B1 publication Critical patent/NO341105B1/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cookers (AREA)
  • Table Equipment (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)

Abstract

En hermetisk tettet kasse eller en kasse som er utført i en til dette forutsatt tennbeskyttelsestype, er utstyrt med varmebroer på adskilte steder. Varmebroene danner i det indre rommet av huset monteringsflater og dessuten monteringsflater på den utvendige siden. Via varmebroene avledes ved de tilsvarende stedene vanne fra det indre av kassen til utsiden.
NO20084398A 2006-03-20 2008-10-20 Kasse med varmebro NO341105B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006013017.0A DE102006013017B4 (de) 2006-03-20 2006-03-20 Gehäuse mit Wärmebrücke
PCT/EP2006/011396 WO2007107178A1 (de) 2006-03-20 2006-11-28 Gehäuse mit wärmebrücke

Publications (2)

Publication Number Publication Date
NO20084398L true NO20084398L (no) 2008-10-20
NO341105B1 NO341105B1 (no) 2017-08-28

Family

ID=38169392

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20084398A NO341105B1 (no) 2006-03-20 2008-10-20 Kasse med varmebro

Country Status (5)

Country Link
US (1) US7863528B2 (no)
EP (1) EP1997361B1 (no)
DE (1) DE102006013017B4 (no)
NO (1) NO341105B1 (no)
WO (1) WO2007107178A1 (no)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008027584B3 (de) * 2008-06-10 2009-12-24 Siemens Aktiengesellschaft Gehäuse für ein elektrisches Gerät
DE102008029187A1 (de) * 2008-06-19 2009-08-20 Siemens Aktiengesellschaft Gehäuse
DE102009005067A1 (de) * 2009-01-19 2010-07-22 Trw Automotive Gmbh Hybrid-Platte
JP5223712B2 (ja) * 2009-02-12 2013-06-26 パナソニック株式会社 圧縮機用電子回路装置
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
KR101072094B1 (ko) * 2009-06-30 2011-10-10 엘지이노텍 주식회사 태양광 발전장치 및 그의 제조방법
DE102010008074A1 (de) * 2010-02-15 2011-08-18 Continental Automotive GmbH, 30165 Gehäuse mit Kühlvorrichtung
DE102011001723B4 (de) 2011-04-01 2016-06-09 Konecranes Global Corporation Druckfestes Gehäuse, Verfahren zur Herstellung desselben sowie Anordnung desselben mit einem weiteren Gehäuse
KR20130057639A (ko) * 2011-11-24 2013-06-03 삼성전기주식회사 역률 보정 장치, 직류/직류 컨버터 및 전원 공급 장치
JP5896833B2 (ja) * 2012-05-30 2016-03-30 三菱電機株式会社 屋外設置機器の製造方法およびインバータ装置の製造方法
JP6007723B2 (ja) * 2012-10-19 2016-10-12 オムロン株式会社 ヒートシンクを備える機器
JP6349807B2 (ja) * 2014-03-14 2018-07-04 オムロン株式会社 電子機器
JP6295746B2 (ja) 2014-03-14 2018-03-20 オムロン株式会社 電子機器
FR3019944B1 (fr) * 2014-04-10 2016-04-01 Emerson Network Power Ind Systems Armoire electrique destinee aux applications en milieux a risques
US9338907B2 (en) * 2014-09-24 2016-05-10 Hil Tech Llc Thermally managed enclosure
US20170018389A1 (en) * 2015-07-15 2017-01-19 Littelfuse, Inc. Circuit protection assembly
JP6722540B2 (ja) * 2016-07-28 2020-07-15 株式会社Ｊｖｃケンウッド 放熱構造および電子機器
WO2019064929A1 (ja) * 2017-09-27 2019-04-04 株式会社村田製作所 電子機器
TWI769874B (zh) * 2021-06-24 2022-07-01 明泰科技股份有限公司 以高熱阻抗材料為殼體的散熱結構及具有其的電子裝置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5812375A (en) * 1996-05-06 1998-09-22 Cummins Engine Company, Inc. Electronic assembly for selective heat sinking and two-sided component attachment
FI974293A0 (fi) * 1997-11-21 1997-11-21 Muuntolaite Oy Kylelement foer ojaemnt foerdelad vaermebelastning
US6180436B1 (en) * 1998-05-04 2001-01-30 Delco Electronics Corporation Method for removing heat from a flip chip semiconductor device
US6404048B2 (en) * 1998-09-03 2002-06-11 Micron Technology, Inc. Heat dissipating microelectronic package
US6088226A (en) * 1999-03-31 2000-07-11 Lucent Technologies, Inc. Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6396691B1 (en) * 2000-04-17 2002-05-28 Circa Telecom, Usa, Inc. Thermal cover for T1/HDSL repeater case
JP2002327724A (ja) * 2001-04-27 2002-11-15 Omron Corp 締結構造
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
ATE543240T1 (de) * 2002-05-16 2012-02-15 Abb Schweiz Ag Kühlelement
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
DE10309100A1 (de) * 2003-03-03 2004-09-23 R. Stahl Schaltgeräte GmbH Explosionsgeschützte Hängeleuchte
JP4457694B2 (ja) * 2003-05-19 2010-04-28 株式会社デンソー 電子部品の放熱構造
DE10357092A1 (de) * 2003-12-06 2005-07-07 Gönnheimer, Hans Peter, Dipl.-Ing. (FH) Verbessertes Kapselungsverfahren für sandgekapselte elektrische und elektronische Betriebsmittel für den Einsatz in einer explosionsgefährdeten Atmosphäre
DE102004018476B4 (de) * 2004-04-16 2009-06-18 Infineon Technologies Ag Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung
US7149088B2 (en) * 2004-06-18 2006-12-12 International Rectifier Corporation Half-bridge power module with insert molded heatsinks

Also Published As

Publication number Publication date
US7863528B2 (en) 2011-01-04
WO2007107178A1 (de) 2007-09-27
EP1997361A1 (de) 2008-12-03
DE102006013017A1 (de) 2007-10-04
EP1997361B1 (de) 2018-09-12
NO341105B1 (no) 2017-08-28
DE102006013017B4 (de) 2014-11-06
US20100170714A1 (en) 2010-07-08

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