NO20040067L - Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet - Google Patents

Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet

Info

Publication number
NO20040067L
NO20040067L NO20040067A NO20040067A NO20040067L NO 20040067 L NO20040067 L NO 20040067L NO 20040067 A NO20040067 A NO 20040067A NO 20040067 A NO20040067 A NO 20040067A NO 20040067 L NO20040067 L NO 20040067L
Authority
NO
Norway
Prior art keywords
cleaning
cleaning compositions
ammonia
improved substrate
free alkaline
Prior art date
Application number
NO20040067A
Other languages
English (en)
Norwegian (no)
Inventor
Chien-Pin Sherman Hsu
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of NO20040067L publication Critical patent/NO20040067L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/33—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
NO20040067A 2001-07-09 2004-01-08 Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet NO20040067L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30431201P 2001-07-09 2001-07-09
PCT/US2002/021374 WO2003006597A1 (fr) 2001-07-09 2002-07-08 Compositions de nettoyage de micro-elements electroniques alcalines sans ammoniac a compatibilite avec les substrats amelioree

Publications (1)

Publication Number Publication Date
NO20040067L true NO20040067L (no) 2004-03-05

Family

ID=23175967

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20040067A NO20040067L (no) 2001-07-09 2004-01-08 Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet

Country Status (17)

Country Link
EP (1) EP1404796B1 (fr)
JP (1) JP4177758B2 (fr)
KR (2) KR100944444B1 (fr)
CN (2) CN1526007A (fr)
AT (1) ATE545695T1 (fr)
AU (1) AU2002320305A1 (fr)
BR (1) BR0211054A (fr)
CA (1) CA2452884C (fr)
IL (2) IL159761A0 (fr)
IN (1) IN2004CH00042A (fr)
MY (1) MY139607A (fr)
NO (1) NO20040067L (fr)
PL (1) PL199501B1 (fr)
RS (1) RS904A (fr)
TW (1) TWI292437B (fr)
WO (1) WO2003006597A1 (fr)
ZA (1) ZA200400064B (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192938A1 (en) 2003-03-24 2004-09-30 Manzer Leo Ernest Production of 5-mehyl-N-aryl-2-pyrrolidone and 5-methyl-N-alkyl-2-pyrrolidone by reductive of levulinic acid esters with aryl and alkyl amines
PT1664935E (pt) * 2003-08-19 2008-01-10 Mallinckrodt Baker Inc Composições de decapagem e limpeza para micro electrónica
TWI393178B (zh) * 2005-01-27 2013-04-11 Advanced Tech Materials 半導體基板處理用之組成物
US9329486B2 (en) 2005-10-28 2016-05-03 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
US7632796B2 (en) 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
US8263539B2 (en) 2005-10-28 2012-09-11 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and methods for its use
ES2356109T3 (es) * 2007-02-14 2011-04-05 Mallinckrodt Baker, Inc. Formulaciones basadas en oxometalato activadas por peróxido para la eliminación de residuos de grabado.
US8481472B2 (en) * 2008-10-09 2013-07-09 Avantor Performance Materials, Inc. Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition
US8298751B2 (en) 2009-11-02 2012-10-30 International Business Machines Corporation Alkaline rinse agents for use in lithographic patterning
WO2012161790A1 (fr) * 2011-02-24 2012-11-29 John Moore Composition chimique concentrée et procédé d'élimination de la résine photosensible pendant une fabrication microélectronique
US9158202B2 (en) * 2012-11-21 2015-10-13 Dynaloy, Llc Process and composition for removing substances from substrates
US10072237B2 (en) * 2015-08-05 2018-09-11 Versum Materials Us, Llc Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
EP4022021A4 (fr) * 2019-08-30 2023-05-31 Dow Global Technologies LLC Composition de décapage de résine photosensible
CN111519190B (zh) * 2020-05-27 2022-03-18 湖北兴福电子材料有限公司 一种铜制程面板中稳定蚀刻锥角的蚀刻液及稳定方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
EP0301044A4 (fr) * 1987-02-05 1989-03-29 Macdermid Inc Composition servant a enlever des photoreserves de protection.
US5091103A (en) * 1990-05-01 1992-02-25 Alicia Dean Photoresist stripper
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
DE69333877T2 (de) * 1992-07-09 2006-06-14 Ekc Technology Inc Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält
JPH0959689A (ja) * 1995-08-29 1997-03-04 Mitsubishi Chem Corp 研削剤除去用洗浄剤
JP4565741B2 (ja) * 1998-05-18 2010-10-20 マリンクロッド・ベイカー・インコーポレイテッド マイクロエレクトロニクス基板洗浄用珪酸塩含有アルカリ組成物
DE69941088D1 (de) * 1998-05-18 2009-08-20 Mallinckrodt Baker Inc Alkalische, silikat enthaltende reinigungslösungen für mikroelektronische substrate
US6558879B1 (en) * 2000-09-25 2003-05-06 Ashland Inc. Photoresist stripper/cleaner compositions containing aromatic acid inhibitors

Also Published As

Publication number Publication date
ATE545695T1 (de) 2012-03-15
ZA200400064B (en) 2004-10-27
RS904A (sr) 2007-02-05
IN2004CH00042A (fr) 2005-12-02
JP2004536181A (ja) 2004-12-02
PL199501B1 (pl) 2008-09-30
TWI292437B (en) 2008-01-11
IL159761A0 (en) 2004-06-20
MY139607A (en) 2009-10-30
CN1526007A (zh) 2004-09-01
PL367838A1 (en) 2005-03-07
EP1404796B1 (fr) 2012-02-15
CA2452884A1 (fr) 2003-01-23
CN102399651A (zh) 2012-04-04
JP4177758B2 (ja) 2008-11-05
BR0211054A (pt) 2004-07-20
AU2002320305A1 (en) 2003-01-29
KR100944444B1 (ko) 2010-02-26
KR20090076934A (ko) 2009-07-13
KR20040018437A (ko) 2004-03-03
EP1404796A1 (fr) 2004-04-07
IL159761A (en) 2006-12-10
CA2452884C (fr) 2010-12-07
WO2003006597A1 (fr) 2003-01-23

Similar Documents

Publication Publication Date Title
NO20040068L (no) Ammoniakkfrie alkaliske mikroelektroniske rensesammensetninger med forbedret substratkompatibilitet
MY143399A (en) Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
NO20040067L (no) Ammoniakkfrei alkaliske mikroelektroniske rengjoringssammensetninger med forbedret substratkompatibilitet
WO2003104901A3 (fr) Compositions d'elimination de la couche antireflet et de nettoyage micro-electronique
AU2002352986A1 (en) Compositions containing 1,3-dicarbonyl chelating agents for stripping residues from semiconductors
AU2003286584A1 (en) Aqueous phosphoric acid compositions for cleaning semiconductor devices
RS106204A (en) Microelectronic cleaning compositions containing oxidizers and organic solvents
TWI265172B (en) and method for forming the same Composition for forming insulating film, method for producing the same, silica-based insulating film
TW200604762A (en) Composition for removing photoresist and/or etching residue from a substrate and use thereof
MY117049A (en) Composition for stripping photoresist and organic materials from substrate surfaces
EP1178359A3 (fr) Composition décapante
ATE376050T1 (de) Halbleiterreinigungslösung
ATE373071T1 (de) Zusammensetzung und verfahren zur behandlung von halbleitersubstraten
EP1148105A3 (fr) Composition pour la fabrication de couches, procédé pour la fabrication de couches et couches à base de silice
TW200504164A (en) Composition for forming porous film and method for forming the same, porous film and method for forming the same, interlevel insulator film, and semiconductor device
TW200611924A (en) Film-forming composition containing carbosilane-based polymer and film obtained from the same
HUP0500585A2 (hu) Bevonatkészítmény faalapú anyagokhoz, eljárás a készítmény előállítására, és a készítmény alkalmazása
TH65770A (th) สารผสมทำความสะอาดไมโครอิเล็กโทรนิคที่เป็นด่างที่ปราศจากแอมโมเนียด้วยความเข้ากันได้กับซับสเทรทที่ปรับปรุง
TW200600526A (en) Polymer for organic EL element, composition for organic EL element, and organic EL element

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application