NO20023215L - Metode for å produsere höyttaler - Google Patents

Metode for å produsere höyttaler

Info

Publication number
NO20023215L
NO20023215L NO20023215A NO20023215A NO20023215L NO 20023215 L NO20023215 L NO 20023215L NO 20023215 A NO20023215 A NO 20023215A NO 20023215 A NO20023215 A NO 20023215A NO 20023215 L NO20023215 L NO 20023215L
Authority
NO
Norway
Prior art keywords
loudspeakers
producing
producing loudspeakers
Prior art date
Application number
NO20023215A
Other languages
English (en)
Other versions
NO20023215D0 (no
Inventor
Kenichi Ajiiki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of NO20023215D0 publication Critical patent/NO20023215D0/no
Publication of NO20023215L publication Critical patent/NO20023215L/no

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
NO20023215A 2000-11-15 2002-07-02 Metode for å produsere höyttaler NO20023215L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000347799A JP4457487B2 (ja) 2000-11-15 2000-11-15 スピーカの製造方法
PCT/JP2001/009906 WO2002041667A1 (fr) 2000-11-15 2001-11-13 Procede de fabrication d'un haut parleur

Publications (2)

Publication Number Publication Date
NO20023215D0 NO20023215D0 (no) 2002-07-02
NO20023215L true NO20023215L (no) 2002-07-02

Family

ID=18821476

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20023215A NO20023215L (no) 2000-11-15 2002-07-02 Metode for å produsere höyttaler

Country Status (7)

Country Link
US (1) US6915555B2 (no)
EP (1) EP1343354B1 (no)
JP (1) JP4457487B2 (no)
CN (1) CN1198481C (no)
DE (1) DE60141767D1 (no)
NO (1) NO20023215L (no)
WO (1) WO2002041667A1 (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020057902A (ko) * 2002-05-28 2002-07-12 전창만 다기능 전자음향변환기의 구조
KR20020057899A (ko) * 2002-05-28 2002-07-12 전창만 다기능 전자음향변환기의 구조
KR20020057897A (ko) * 2002-05-28 2002-07-12 전창만 다기능 전자음향변환기의 구조
AT413921B (de) * 2002-10-01 2006-07-15 Akg Acoustics Gmbh Mikrofone mit untereinander gleicher empfindlichkeit und verfahren zur herstellung derselben
KR100799008B1 (ko) 2004-03-31 2008-01-28 마쯔시다덴기산교 가부시키가이샤 스피커와, 이를 이용한 모듈, 전자 기기 및 장치, 스피커의제조 방법
US7497013B2 (en) 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
JP4710462B2 (ja) * 2005-07-21 2011-06-29 ソニー株式会社 スピーカ振動板及びスピーカ振動板製造方法
US20100046773A1 (en) * 2006-11-08 2010-02-25 Nxp, B.V. Acoustic device and method of manufacturing the same
TWI419577B (zh) * 2009-12-23 2013-12-11 Ind Tech Res Inst 揚聲器的製造方法與裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766937A (en) * 1980-10-14 1982-04-23 Onkyo Corp Forming method of vibration sheet for speaker
JPS59215198A (ja) * 1983-05-20 1984-12-05 Sanyo Electric Co Ltd スピ−カ振動板のエツジとフレ−ムとの結合方法
JPS61273099A (ja) 1985-05-28 1986-12-03 Pioneer Electronic Corp ヘッドホン用スピ−カの組立方法
JPH05236591A (ja) 1992-02-17 1993-09-10 Atsuden Kk 音響変換器用振動板の製造方法
JP3107683B2 (ja) * 1993-08-12 2000-11-13 富士通株式会社 ダイヤモンドの気相合成方法
KR950024611A (ko) * 1994-01-05 1995-08-21 구쯔자와 겐따로우 자기회로를 구비한 스피커
US5757945A (en) * 1995-04-12 1998-05-26 Kabushiki Kaisha Kenwood Terminal for speaker
JPH0984185A (ja) * 1995-09-20 1997-03-28 Matsushita Electric Ind Co Ltd スピーカ

Also Published As

Publication number Publication date
JP4457487B2 (ja) 2010-04-28
CN1395812A (zh) 2003-02-05
WO2002041667A1 (fr) 2002-05-23
EP1343354A4 (en) 2008-04-16
NO20023215D0 (no) 2002-07-02
US20030093891A1 (en) 2003-05-22
EP1343354A1 (en) 2003-09-10
EP1343354B1 (en) 2010-04-07
US6915555B2 (en) 2005-07-12
JP2002152895A (ja) 2002-05-24
CN1198481C (zh) 2005-04-20
DE60141767D1 (de) 2010-05-20

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application