NO20013114L - Fasegruppeantenne og fremgangsmate ved fremstilling av denne - Google Patents
Fasegruppeantenne og fremgangsmate ved fremstilling av denneInfo
- Publication number
- NO20013114L NO20013114L NO20013114A NO20013114A NO20013114L NO 20013114 L NO20013114 L NO 20013114L NO 20013114 A NO20013114 A NO 20013114A NO 20013114 A NO20013114 A NO 20013114A NO 20013114 L NO20013114 L NO 20013114L
- Authority
- NO
- Norway
- Prior art keywords
- preparing
- phase group
- group antenna
- antenna
- phase
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36815198A JP3481482B2 (ja) | 1998-12-24 | 1998-12-24 | フェーズドアレイアンテナおよびその製造方法 |
PCT/JP1999/006515 WO2000039892A1 (en) | 1998-12-24 | 1999-11-22 | Phased array antenna and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20013114D0 NO20013114D0 (no) | 2001-06-21 |
NO20013114L true NO20013114L (no) | 2001-08-24 |
Family
ID=18491084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20013114A NO20013114L (no) | 1998-12-24 | 2001-06-21 | Fasegruppeantenne og fremgangsmate ved fremstilling av denne |
Country Status (6)
Country | Link |
---|---|
US (1) | US6556168B1 (ja) |
EP (1) | EP1146593A4 (ja) |
JP (1) | JP3481482B2 (ja) |
CA (1) | CA2356854C (ja) |
NO (1) | NO20013114L (ja) |
WO (1) | WO2000039892A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6366259B1 (en) * | 2000-07-21 | 2002-04-02 | Raytheon Company | Antenna structure and associated method |
JP2004172504A (ja) * | 2002-11-21 | 2004-06-17 | Fujitsu Media Device Kk | 可変キャパシタ、それを備えたパッケージ及び可変キャパシタの製造方法 |
JP2004214820A (ja) * | 2002-12-27 | 2004-07-29 | Honda Motor Co Ltd | 車載アンテナ |
US7298235B2 (en) | 2004-01-13 | 2007-11-20 | Raytheon Company | Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces |
WO2006130993A1 (en) * | 2005-06-09 | 2006-12-14 | Macdonald, Dettwiler And Associates Ltd. | Lightweight space-fed active phased array antenna system |
US7991550B2 (en) * | 2006-02-03 | 2011-08-02 | GM Global Technology Operations LLC | Method and apparatus for on-vehicle calibration and orientation of object-tracking systems |
US7728771B2 (en) * | 2007-07-03 | 2010-06-01 | Northrop Grumman Systems Corporation | Dual band quadpack transmit/receive module |
EP2104182A1 (en) * | 2008-01-17 | 2009-09-23 | Raysat, Inc. | Integrated antenna phased array control device |
US20090231186A1 (en) * | 2008-02-06 | 2009-09-17 | Raysat Broadcasting Corp. | Compact electronically-steerable mobile satellite antenna system |
EP3171456B1 (en) * | 2014-08-14 | 2021-10-06 | Huawei Technologies Co., Ltd. | Beam scanning antenna, microwave system and beam alignment method |
WO2017076750A1 (en) | 2015-11-02 | 2017-05-11 | Taoglas Limited | A multi-network telematics device with multiple antennas |
US10403984B2 (en) * | 2015-12-15 | 2019-09-03 | Kymeta Corporation | Distributed direct drive arrangement for driving cells |
US10312600B2 (en) * | 2016-05-20 | 2019-06-04 | Kymeta Corporation | Free space segment tester (FSST) |
CN106684551B (zh) | 2017-01-24 | 2019-07-23 | 京东方科技集团股份有限公司 | 一种移相单元、天线阵、显示面板和显示装置 |
US11205847B2 (en) * | 2017-02-01 | 2021-12-21 | Taoglas Group Holdings Limited | 5-6 GHz wideband dual-polarized massive MIMO antenna arrays |
FR3065329B1 (fr) | 2017-04-14 | 2019-07-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Cellule elementaire d'un reseau transmetteur pour une antenne reconfigurable |
US11394103B2 (en) * | 2017-07-18 | 2022-07-19 | Samsung Electro-Mechanics Co., Ltd. | Antenna module and manufacturing method thereof |
US11133594B2 (en) * | 2019-01-04 | 2021-09-28 | Veoneer Us, Inc. | System and method with multilayer laminated waveguide antenna |
DE112020001411T5 (de) * | 2019-04-25 | 2021-12-23 | Murata Manufacturing Co., Ltd. | Antennenmodul und Kommunikationsvorrichtung |
US11374321B2 (en) | 2019-09-24 | 2022-06-28 | Veoneer Us, Inc. | Integrated differential antenna with air gap for propagation of differential-mode radiation |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3484785A (en) * | 1968-05-03 | 1969-12-16 | Raytheon Co | Beam-steering apparatus |
JP2717264B2 (ja) * | 1988-05-18 | 1998-02-18 | 東洋通信機株式会社 | フェーズド・アレイ・アンテナ |
JPH0265401A (ja) * | 1988-08-31 | 1990-03-06 | Mitsubishi Electric Corp | アンテナ制御用データ転送装置 |
JPH03182103A (ja) | 1989-12-11 | 1991-08-08 | Toyota Central Res & Dev Lab Inc | フェーズドアレイアンテナ |
CA2071714A1 (en) | 1991-07-15 | 1993-01-16 | Gary George Sanford | Electronically reconfigurable antenna |
JP2846755B2 (ja) | 1991-09-10 | 1999-01-13 | アルプス電気株式会社 | テーププレーヤのリールモータ制御装置 |
JPH0591016A (ja) | 1991-09-26 | 1993-04-09 | Toshiba Corp | カセツトプレーヤ一体型携帯電話機 |
JP2840493B2 (ja) * | 1991-12-27 | 1998-12-24 | 株式会社日立製作所 | 一体型マイクロ波回路 |
JP2606521Y2 (ja) * | 1992-02-27 | 2000-11-27 | 株式会社村田製作所 | アンテナ装置 |
JPH0574008U (ja) * | 1992-03-06 | 1993-10-08 | 日本無線株式会社 | 移相器のアクティブモジュール |
JPH0591016U (ja) * | 1992-05-14 | 1993-12-10 | 三菱電機株式会社 | アンテナ制御用データ転送装置 |
JPH06267926A (ja) | 1993-03-12 | 1994-09-22 | Canon Inc | エッチング工程およびこれを用いた静電マイクロスイッチ |
US5510758A (en) * | 1993-04-07 | 1996-04-23 | Matsushita Electric Industrial Co., Ltd. | Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps |
US6184832B1 (en) * | 1996-05-17 | 2001-02-06 | Raytheon Company | Phased array antenna |
EP0887879A1 (en) | 1997-06-23 | 1998-12-30 | Nec Corporation | Phased-array antenna apparatus |
JPH1174717A (ja) * | 1997-06-23 | 1999-03-16 | Nec Corp | フェーズドアレーアンテナ装置 |
US5923289A (en) * | 1997-07-28 | 1999-07-13 | Motorola, Inc. | Modular array and phased array antenna system |
JPH11174717A (ja) | 1997-12-10 | 1999-07-02 | Union Chemicar Kk | 再使用可能記録体 |
-
1998
- 1998-12-24 JP JP36815198A patent/JP3481482B2/ja not_active Expired - Fee Related
-
1999
- 1999-11-22 US US09/869,203 patent/US6556168B1/en not_active Expired - Fee Related
- 1999-11-22 CA CA002356854A patent/CA2356854C/en not_active Expired - Fee Related
- 1999-11-22 WO PCT/JP1999/006515 patent/WO2000039892A1/ja not_active Application Discontinuation
- 1999-11-22 EP EP99973556A patent/EP1146593A4/en not_active Withdrawn
-
2001
- 2001-06-21 NO NO20013114A patent/NO20013114L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US6556168B1 (en) | 2003-04-29 |
JP2000196330A (ja) | 2000-07-14 |
CA2356854C (en) | 2004-04-20 |
EP1146593A4 (en) | 2002-10-09 |
CA2356854A1 (en) | 2000-07-06 |
WO2000039892A1 (en) | 2000-07-06 |
EP1146593A1 (en) | 2001-10-17 |
JP3481482B2 (ja) | 2003-12-22 |
NO20013114D0 (no) | 2001-06-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application | ||
FC2A | Withdrawal, rejection or dismissal of laid open patent application |