NO172444C - Fremgangsmaate til fremstilling av et varmtherdende materiale som taaler hoey temperatur - Google Patents

Fremgangsmaate til fremstilling av et varmtherdende materiale som taaler hoey temperatur

Info

Publication number
NO172444C
NO172444C NO874994A NO874994A NO172444C NO 172444 C NO172444 C NO 172444C NO 874994 A NO874994 A NO 874994A NO 874994 A NO874994 A NO 874994A NO 172444 C NO172444 C NO 172444C
Authority
NO
Norway
Prior art keywords
useful
thermoset
procedure
manufacturing
heat
Prior art date
Application number
NO874994A
Other languages
English (en)
Norwegian (no)
Other versions
NO874994L (no
NO874994D0 (no
NO172444B (no
Inventor
Frederick John Hirsekorn
William David Emmons
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of NO874994D0 publication Critical patent/NO874994D0/no
Publication of NO874994L publication Critical patent/NO874994L/no
Publication of NO172444B publication Critical patent/NO172444B/no
Publication of NO172444C publication Critical patent/NO172444C/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Indole Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
NO874994A 1986-12-05 1987-12-01 Fremgangsmaate til fremstilling av et varmtherdende materiale som taaler hoey temperatur NO172444C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/938,296 US4732952A (en) 1986-12-05 1986-12-05 "B stageable" high service temperature epoxy thermosets

Publications (4)

Publication Number Publication Date
NO874994D0 NO874994D0 (no) 1987-12-01
NO874994L NO874994L (no) 1988-06-06
NO172444B NO172444B (no) 1993-04-13
NO172444C true NO172444C (no) 1993-07-21

Family

ID=25471234

Family Applications (1)

Application Number Title Priority Date Filing Date
NO874994A NO172444C (no) 1986-12-05 1987-12-01 Fremgangsmaate til fremstilling av et varmtherdende materiale som taaler hoey temperatur

Country Status (10)

Country Link
US (1) US4732952A (xx)
EP (1) EP0274221B1 (xx)
JP (1) JPS63145322A (xx)
AT (1) ATE82303T1 (xx)
DE (1) DE3782640T2 (xx)
DK (1) DK640087A (xx)
FI (1) FI875359A (xx)
IL (1) IL84711A (xx)
NO (1) NO172444C (xx)
ZA (1) ZA879075B (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02169619A (ja) * 1988-12-23 1990-06-29 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いてなる光半導体素子
JPH03188102A (ja) * 1989-12-15 1991-08-16 Nippon Kasei Kk 重合硬化性組成物
US6624216B2 (en) * 2002-01-31 2003-09-23 National Starch And Chemical Investment Holding Corporation No-flow underfill encapsulant
US7135554B1 (en) * 2004-01-27 2006-11-14 Biopure Corporation Method of forming a polymerized hemoglobin solution from stabilized hemoglobin
TW200722493A (en) * 2005-12-08 2007-06-16 Ls Cable Ltd Die-attaching paste composition and method for hardening the same
JP2010018778A (ja) * 2008-06-11 2010-01-28 Panasonic Electric Works Co Ltd 液状熱硬化性樹脂組成物及びそれを用いた銅張積層板
JP2010070605A (ja) * 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物
JP2013000359A (ja) * 2011-06-16 2013-01-07 Toshiba Corp 内視鏡装置および電子機器
DE102014207785A1 (de) * 2014-04-25 2015-10-29 Evonik Degussa Gmbh Verfahren zur Herstellung von lagerstabilen Epoxy-Prepregs und daraus hergestellte Composites auf Basis von radikalisch polymerisierbaren Säuren und Epoxiden
DE102016117183A1 (de) 2016-09-13 2018-03-15 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Lichtfixierbare Vergussmasse und Verfahren zum selektiven Verguss von Substraten/Bauteilen unter Verwendung der Massen
WO2024024331A1 (ja) * 2022-07-26 2024-02-01 味の素株式会社 樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676398A (en) * 1968-11-25 1972-07-11 Ppg Industries Inc Polymerizable crosslinkable esters of polyepoxy compounds
US3654251A (en) * 1968-11-25 1972-04-04 Gaetano F D Alelio Crosslinking polymers
US3770602A (en) * 1968-11-25 1973-11-06 Ppg Industries Inc Radiation crosslinkable polymers prepared by reacting a polyepoxy compound with an acrylic anhydride of a monocarboxylic acid
US3732332A (en) * 1970-10-16 1973-05-08 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US4056506A (en) * 1975-06-26 1977-11-01 Gulf Oil Corporation Homogeneous polyepoxide-polyanhydride compositions

Also Published As

Publication number Publication date
FI875359A0 (fi) 1987-12-04
NO874994L (no) 1988-06-06
FI875359A (fi) 1988-06-06
EP0274221A2 (en) 1988-07-13
IL84711A (en) 1991-07-18
NO874994D0 (no) 1987-12-01
IL84711A0 (en) 1988-05-31
NO172444B (no) 1993-04-13
DK640087D0 (da) 1987-12-04
ATE82303T1 (de) 1992-11-15
DE3782640T2 (de) 1993-06-03
DE3782640D1 (de) 1992-12-17
ZA879075B (en) 1988-08-31
JPS63145322A (ja) 1988-06-17
EP0274221A3 (en) 1988-12-07
DK640087A (da) 1988-06-06
US4732952A (en) 1988-03-22
EP0274221B1 (en) 1992-11-11

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