NO161266C - Epoksyharpiksmaterte for fremstillin g av elektriske laminater. - Google Patents

Epoksyharpiksmaterte for fremstillin g av elektriske laminater.

Info

Publication number
NO161266C
NO161266C NO85853822A NO853822A NO161266C NO 161266 C NO161266 C NO 161266C NO 85853822 A NO85853822 A NO 85853822A NO 853822 A NO853822 A NO 853822A NO 161266 C NO161266 C NO 161266C
Authority
NO
Norway
Prior art keywords
epoxy resin
electrical laminates
preparation
resin materials
resin composition
Prior art date
Application number
NO85853822A
Other languages
English (en)
Norwegian (no)
Other versions
NO161266B (no
NO853822L (no
Inventor
Raymond Koenig
Dieter H Klein
Robert Urscheler
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of NO853822L publication Critical patent/NO853822L/no
Publication of NO161266B publication Critical patent/NO161266B/no
Publication of NO161266C publication Critical patent/NO161266C/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Processing Of Terminals (AREA)
NO85853822A 1984-01-31 1985-09-27 Epoksyharpiksmaterte for fremstillin g av elektriske laminater. NO161266C (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3403172 1984-01-31
PCT/EP1985/000026 WO1985003515A1 (en) 1984-01-31 1985-01-30 Epoxy resin composition and process for preparing laminates therefrom

Publications (3)

Publication Number Publication Date
NO853822L NO853822L (no) 1985-09-27
NO161266B NO161266B (no) 1989-04-17
NO161266C true NO161266C (no) 1989-07-26

Family

ID=6226300

Family Applications (1)

Application Number Title Priority Date Filing Date
NO85853822A NO161266C (no) 1984-01-31 1985-09-27 Epoksyharpiksmaterte for fremstillin g av elektriske laminater.

Country Status (18)

Country Link
US (1) US4661568A (show.php)
EP (2) EP0169865A1 (show.php)
JP (1) JPS61501154A (show.php)
KR (2) KR920002615B1 (show.php)
AT (1) ATE35817T1 (show.php)
AU (1) AU557131B2 (show.php)
BR (1) BR8505172A (show.php)
CA (1) CA1276358C (show.php)
DE (1) DE3563852D1 (show.php)
DK (1) DK440085D0 (show.php)
ES (1) ES8608020A1 (show.php)
FI (1) FI853743L (show.php)
IE (1) IE57890B1 (show.php)
IL (1) IL74199A (show.php)
IN (1) IN164123B (show.php)
NO (1) NO161266C (show.php)
SG (1) SG87488G (show.php)
WO (1) WO1985003515A1 (show.php)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
IL80277A0 (en) * 1985-10-15 1987-01-30 President Eng Corp Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process
US4808652A (en) * 1988-06-08 1989-02-28 Monsanto Company Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
EP0507271A3 (en) * 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
CA2199390A1 (en) * 1994-09-08 1996-03-14 Jan Andre Jozef Schutyser Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
WO1996028490A1 (en) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Heat-resistant epoxy resin composition
DE69708908T2 (de) 1996-10-29 2002-07-18 Isola Laminate Systems Corp., Lacrosse Copolymer aus styrol und maleinsäureanhydrid enthaltende epoxidharzzusammensetzung und covernetzer
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
JPWO2012043245A1 (ja) * 2010-09-29 2014-02-06 日本カーバイド工業株式会社 メラミンエポキシ樹脂モノマーおよび樹脂組成物
US9193214B2 (en) 2012-10-12 2015-11-24 High Voltage Graphics, Inc. Flexible heat sealable decorative articles and method for making the same
US8911858B2 (en) 2012-10-31 2014-12-16 Empire Technology Development Llc Multifunctional melamine epoxy resins, methylols and amines
US9890130B2 (en) 2013-02-15 2018-02-13 Empire Technology Development Llc Phenolic epoxy compounds
US9868683B2 (en) 2013-06-13 2018-01-16 Empire Technology Development Llc Multi-functional phenolic resins
EP3077364A4 (en) 2013-12-02 2017-11-08 Empire Technology Development LLC Novel gemini surfactants and their use
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof
ES3020844T3 (en) * 2021-02-16 2025-05-23 Vestas Wind Sys As Improvements relating to the manufacture of a wind turbine component
CA3256979A1 (en) * 2022-05-20 2023-11-23 Epoxy Technology, Inc. HIGH-PERFORMANCE COMPLIANT COATINGS

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB622675A (en) * 1946-10-02 1949-05-05 Donald Atherton Manufacture of new synthetic resinous condensation products
US3502557A (en) * 1965-04-01 1970-03-24 Ppg Industries Inc Electrodeposition of amine-aldehyde condensate and hydroxy-containing carboxylic acid coreaction products
US4499268A (en) * 1982-02-23 1985-02-12 Ciba Geigy Corporation Process for the preparation of isomelamines
US4467070A (en) * 1982-09-30 1984-08-21 Ford Motor Company Thermosetting coating composition comprising polymeric catalyst - III
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents

Also Published As

Publication number Publication date
EP0169865A1 (en) 1986-02-05
KR850700252A (ko) 1985-12-26
NO161266B (no) 1989-04-17
DK440085A (da) 1985-09-27
AU3934285A (en) 1985-08-27
CA1276358C (en) 1990-11-13
IE57890B1 (en) 1993-05-05
US4661568A (en) 1987-04-28
IE850224L (en) 1985-07-31
FI853743A7 (fi) 1985-09-27
EP0155469B1 (en) 1988-07-20
EP0155469A1 (en) 1985-09-25
SG87488G (en) 1989-06-16
IL74199A0 (en) 1985-04-30
KR920002615B1 (ko) 1992-03-30
JPH0369364B2 (show.php) 1991-10-31
ATE35817T1 (de) 1988-08-15
DK440085D0 (da) 1985-09-27
ES539962A0 (es) 1986-04-16
FI853743A0 (fi) 1985-09-27
WO1985003515A1 (en) 1985-08-15
ES8608020A1 (es) 1986-04-16
DE3563852D1 (en) 1988-08-25
IL74199A (en) 1988-07-31
IN164123B (show.php) 1989-01-14
JPS61501154A (ja) 1986-06-12
FI853743L (fi) 1985-09-27
BR8505172A (pt) 1986-01-21
AU557131B2 (en) 1986-12-04
NO853822L (no) 1985-09-27

Similar Documents

Publication Publication Date Title
NO853822L (no) Epoksyharpiksmateriale, samt anvendelse av det ved fremstillng av laminater.
TW354328B (en) Epoxy resin composition comprising a bipohenol-type epoxy resin and a polyhydric phenol resin curing agent, process for the preparation of said composition and articles comprising said composition
AU6074886A (en) Resin composition and a process for preparing laminates therefrom
AU6119098A (en) Diglycidyl ethers
AU536907B2 (en) Furan cements
EP0466942A4 (en) Composition comprising epoxy compounds having hydroxyl group and process for producing the same
DE59307683D1 (de) Verfahren zur herstellung einer flammwidrig eingestellten epoxidharzformmasse
AU572948B2 (en) Acid curing resol cements
DK310689D0 (da) Monocarboxylsyrederivater af aromatisk baserede epoxyharpikser
JPS56108792A (en) 1-alkyl-4-hydroxymethyl-2,6,7-trioxabicyclo 2,2,2 octane
JPS5634764A (en) Production of amino resin for coating
JPS57155226A (en) Preparation of modified epoxy resin
JPS5599912A (en) Curable resin composition
JPS64116A (en) Curable epoxy resin composition
JPS55129411A (en) Preparation of plasticized modified phenolic resin
JPS57195120A (en) Epoxy resin composition
JPS56141316A (en) Epoxy resin composition
JPS54143498A (en) Curing agent for epoxy resins