NL8902695A - Interconnectiestructuur. - Google Patents

Interconnectiestructuur. Download PDF

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Publication number
NL8902695A
NL8902695A NL8902695A NL8902695A NL8902695A NL 8902695 A NL8902695 A NL 8902695A NL 8902695 A NL8902695 A NL 8902695A NL 8902695 A NL8902695 A NL 8902695A NL 8902695 A NL8902695 A NL 8902695A
Authority
NL
Netherlands
Prior art keywords
interconnection structure
structure according
display device
substrate
interconnection
Prior art date
Application number
NL8902695A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8902695A priority Critical patent/NL8902695A/nl
Priority to JP2288616A priority patent/JPH03154345A/ja
Priority to EP90202855A priority patent/EP0426246A1/en
Priority to CN90108837A priority patent/CN1051460A/zh
Priority to KR1019900017402A priority patent/KR910010685A/ko
Publication of NL8902695A publication Critical patent/NL8902695A/nl

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
NL8902695A 1989-11-01 1989-11-01 Interconnectiestructuur. NL8902695A (nl)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL8902695A NL8902695A (nl) 1989-11-01 1989-11-01 Interconnectiestructuur.
JP2288616A JPH03154345A (ja) 1989-11-01 1990-10-29 相互接続構造
EP90202855A EP0426246A1 (en) 1989-11-01 1990-10-29 Interconnection structure
CN90108837A CN1051460A (zh) 1989-11-01 1990-10-29 互连结构
KR1019900017402A KR910010685A (ko) 1989-11-01 1990-10-30 상호 접속 구조물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8902695 1989-11-01
NL8902695A NL8902695A (nl) 1989-11-01 1989-11-01 Interconnectiestructuur.

Publications (1)

Publication Number Publication Date
NL8902695A true NL8902695A (nl) 1991-06-03

Family

ID=19855546

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8902695A NL8902695A (nl) 1989-11-01 1989-11-01 Interconnectiestructuur.

Country Status (5)

Country Link
EP (1) EP0426246A1 (ja)
JP (1) JPH03154345A (ja)
KR (1) KR910010685A (ja)
CN (1) CN1051460A (ja)
NL (1) NL8902695A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752938B1 (ko) * 2006-08-03 2007-08-30 마이크로 인스펙션 주식회사 볼을 이용한 접촉식 프로브

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985002715A1 (en) * 1983-12-05 1985-06-20 Honeywell Inc. Semiconductor device pad area protection structure
JPS6178151A (ja) * 1984-09-25 1986-04-21 Nec Corp 半導体装置
GB2184288A (en) * 1985-12-16 1987-06-17 Nat Semiconductor Corp Oxidation inhibition of copper bonding pads using palladium
JPS63148646A (ja) * 1986-12-12 1988-06-21 Toshiba Corp 半導体装置
JP2633586B2 (ja) * 1987-10-21 1997-07-23 株式会社東芝 バンプ構造を有する半導体装置
JP2596960B2 (ja) * 1988-03-07 1997-04-02 シャープ株式会社 接続構造

Also Published As

Publication number Publication date
EP0426246A1 (en) 1991-05-08
JPH03154345A (ja) 1991-07-02
KR910010685A (ko) 1991-06-29
CN1051460A (zh) 1991-05-15

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