NL8900676A - Substraat met interconnectiestructuren. - Google Patents
Substraat met interconnectiestructuren. Download PDFInfo
- Publication number
- NL8900676A NL8900676A NL8900676A NL8900676A NL8900676A NL 8900676 A NL8900676 A NL 8900676A NL 8900676 A NL8900676 A NL 8900676A NL 8900676 A NL8900676 A NL 8900676A NL 8900676 A NL8900676 A NL 8900676A
- Authority
- NL
- Netherlands
- Prior art keywords
- substrate
- interconnection structures
- rows
- pressure
- substrate according
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 49
- 238000010276 construction Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims 1
- 230000008719 thickening Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 support body Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8900676A NL8900676A (nl) | 1989-03-20 | 1989-03-20 | Substraat met interconnectiestructuren. |
| JP2063935A JPH02292837A (ja) | 1989-03-20 | 1990-03-13 | 相互接続構造の基板 |
| EP90200606A EP0389040A1 (de) | 1989-03-20 | 1990-03-14 | Substrat mit einer Verbindungsstruktur |
| KR1019900003583A KR0160960B1 (ko) | 1989-03-20 | 1990-03-17 | 상호접속 구조물을 구비한 기판을 포함하는 전자장치 |
| US07/496,477 US5061984A (en) | 1989-03-20 | 1990-03-20 | Substrate and device comprising interconnection structures |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8900676 | 1989-03-20 | ||
| NL8900676A NL8900676A (nl) | 1989-03-20 | 1989-03-20 | Substraat met interconnectiestructuren. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8900676A true NL8900676A (nl) | 1990-10-16 |
Family
ID=19854321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8900676A NL8900676A (nl) | 1989-03-20 | 1989-03-20 | Substraat met interconnectiestructuren. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5061984A (de) |
| EP (1) | EP0389040A1 (de) |
| JP (1) | JPH02292837A (de) |
| KR (1) | KR0160960B1 (de) |
| NL (1) | NL8900676A (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2867209B2 (ja) * | 1993-08-27 | 1999-03-08 | 日東電工株式会社 | フレキシブル回路基板と接触対象物との接続方法およびその構造 |
| DE19529490A1 (de) * | 1995-08-10 | 1997-02-13 | Fraunhofer Ges Forschung | Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Trägersubstrat zur Kontaktierung von Chips |
| US6007348A (en) | 1996-05-07 | 1999-12-28 | Advanced Intercommunications Corporation | Solder ball terminal |
| TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
| DE10120029A1 (de) * | 2001-02-13 | 2002-08-29 | Pac Tech Gmbh | Presskontaktierung von Mikrochips |
| JP6369054B2 (ja) * | 2014-03-03 | 2018-08-08 | 東京エレクトロン株式会社 | 基板載置装置及び基板処理装置 |
| RU2758577C1 (ru) * | 2021-03-17 | 2021-10-29 | Федеральное государственное бюджетное учреждение науки Институт физики твердого тела Российской академии наук (ИФТТ РАН) | Способ изготовления контактов к тонким трёхмерным чешуйкам слоистых кристаллов |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237744A (en) * | 1975-09-19 | 1977-03-23 | Seiko Epson Corp | Electronic desk computer with liquid crystal display |
| JPS58173790A (ja) * | 1982-04-06 | 1983-10-12 | シチズン時計株式会社 | 表示装置と半導体装置の接続構造 |
| US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
-
1989
- 1989-03-20 NL NL8900676A patent/NL8900676A/nl not_active Application Discontinuation
-
1990
- 1990-03-13 JP JP2063935A patent/JPH02292837A/ja active Pending
- 1990-03-14 EP EP90200606A patent/EP0389040A1/de not_active Withdrawn
- 1990-03-17 KR KR1019900003583A patent/KR0160960B1/ko not_active IP Right Cessation
- 1990-03-20 US US07/496,477 patent/US5061984A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0389040A1 (de) | 1990-09-26 |
| KR900015281A (ko) | 1990-10-26 |
| KR0160960B1 (ko) | 1999-02-01 |
| JPH02292837A (ja) | 1990-12-04 |
| US5061984A (en) | 1991-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4688150A (en) | High pin count chip carrier package | |
| US5258330A (en) | Semiconductor chip assemblies with fan-in leads | |
| US5148265A (en) | Semiconductor chip assemblies with fan-in leads | |
| US5281852A (en) | Semiconductor device including stacked die | |
| US5616206A (en) | Method for arranging conductive particles on electrodes of substrate | |
| US5162613A (en) | Integrated circuit interconnection technique | |
| EP0252929A1 (de) | Elektrisch veränderbarer piezoelektrischer hybrid-kondensator. | |
| KR970066683A (ko) | 액정장치, 액정장치의 제조방법 및 전자기기 | |
| US6851598B2 (en) | Electronic component with a semiconductor chip and method for producing the electronic component | |
| WO1993022787A1 (en) | Arrangement for mounting a lens to a solid state image sensor | |
| NL8900676A (nl) | Substraat met interconnectiestructuren. | |
| JPH09129669A (ja) | 半導体のチップと基板間の電気的連結構造 | |
| US5432679A (en) | Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane | |
| US6559523B2 (en) | Device for attaching a semiconductor chip to a chip carrier | |
| US4126882A (en) | Package for multielement electro-optical devices | |
| JPH02146757A (ja) | 半導体装置 | |
| JPH02135763A (ja) | 半導体装置 | |
| JPH0433348A (ja) | 半導体装置 | |
| JPH02135762A (ja) | 半導体装置 | |
| US6953992B2 (en) | Electronic component with at least one semiconductor chip and method for its manufacture | |
| JP2553498B2 (ja) | チツプキヤリヤパツケ−ジ組立体 | |
| JPH0450745B2 (de) | ||
| JP3373274B2 (ja) | 半導体装置 | |
| GB2339332A (en) | Assembling planar electrical components | |
| NL8900675A (nl) | Interconnectiestructuur. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A1B | A search report has been drawn up | ||
| BV | The patent application has lapsed |